Sensor with a single electrical carrier means

Patent metadata

Field	Value
Publication number	US-9645163-B2
Application number	US-201214240503-A
Country	US
Kind code	B2
Filing date	Aug 24, 2012
Priority date	Aug 24, 2011
Publication date	May 9, 2017
Grant date	May 9, 2017

Abstract

A sensor having at least one sensor element ( 1 ), at least one signal processing element ( 2 ), and a housing ( 7 ) which has at least one fastening means. An electrical interface is provided for electrically connecting the sensor. The sensor has an electrically and mechanically connecting carrier means ( 4 ) on which the at least one sensor element ( 1 ) and the signal processing element ( 2 ) are arranged and are electrically connected to the carrier means. The carrier means ( 4 ) is also at least electrically connected to the electrical interface.

First claim

The invention claimed is:

1. A sensor comprising:
at least one sensor element,
at least one signal processing element,
a housing which has at least one fastening means, and also an electrical interface for electrically connecting the sensor,
the sensor has an electrically and mechanically connecting carrier means on which the at least one sensor element and the signal processing element are directly arranged on and are electrically connected to said carrier means, wherein the carrier means is also at least electrically connected to the electrical interface,
the carrier means is in the form of a leadframe, and
wherein the at least one sensor element and the signal processing element are arranged on the carrier means in the form of unpackaged semiconductor components as bare dies, wherein the unpackaged semiconductor components comprise a functional structure formed from a semiconductor material but that the semiconductor components do not have separate housings.

2. The sensor as claimed in claim 1 , further comprising in that the sensor has a single carrier means.

3. The sensor as claimed in claim 1 further comprising the sensor has a transfer mold housing which completely or at least partially surrounds the at least one sensor element and the signal processing element and the carrier means.

4. The sensor as claimed in claim 3 further comprising the at least one sensor element and the signal processing element are at least partially covered by an encapsulation compound, within the transfer mold housing.

5. The sensor as claimed in claim 3 further comprising the transfer mold housing is completely or at least partially surrounded by an overmold housing.

6. The sensor as claimed in claim 1 further comprising the at least one sensor element is in the form of an inertial sensor element.

7. The sensor as claimed in claim 1 further comprising the sensor is in the form of a satellite sensor, and the sensor is in the form of a motor vehicle sensor.

8. The sensor as claimed in claim 1 , wherein the leadframe entirely forms the carrier means.

Assignees

• Fischer Thomas
• Günthner Stefan
• Huber Dietmar
• Schillinger Jakob
• Continental Teves Ag & Co Ohg

Inventors

• Fischer Thomas
• Günthner Stefan
• Huber Dietmar
• Schillinger Jakob

Classifications

• H10W90/811

  Multiple chips on leadframes · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W90/726

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title