Measurement device and purge gas flow rate measuring method

Patent metadata

Field	Value
Publication number	US-9645000-B2
Application number	US-201414763546-A
Country	US
Kind code	B2
Filing date	Jan 30, 2014
Priority date	Mar 5, 2013
Publication date	May 9, 2017
Grant date	May 9, 2017

Abstract

A purge gas flow rate in a carrier that houses a smaller number of articles than a usual number is measured. The flow rate of the purge gas supplied from a nozzle of a shelf support in a rack is measured by a measurement device. The measurement device includes a substrate, a gas introduction section provided on a bottom surface of the substrate and configured to introduce the purge gas when coming into contact with the nozzle of the shelf support, while maintaining contact with the nozzle airtight with a load from the substrate, a circuit including a flowmeter that measures the purge gas flow rate and a power supply, and a plurality of legs movable in a vertical direction with respect to the substrate and defining a portion of the weight of the measurement device supported on the shelf support.

First claim

What is claimed is:

1. A measurement device that measures a flow rate of a purge gas supplied from a nozzle of a shelf support in a rack to a carrier, the measurement device comprising:
a substrate;
a gas introduction section provided on a bottom surface of the substrate and configured to introduce the purge gas when coming into contact with the nozzle of the shelf support, while maintaining airtight contact between the gas introduction section and the nozzle with a load from the substrate;
a circuit at least including a flowmeter that measures the flow rate in the gas introduction section and a power supply; and
a plurality of legs movable in a vertical direction with respect to the substrate and defining a portion of a weight of the measurement device supported on the shelf support.

2. The measurement device according to claim 1 , wherein
the substrate is a first substrate;
a second substrate is provided above the first substrate and supports at least a portion of the circuit; and
the legs are attached to the second substrate and extend onto the shelf support avoiding the first substrate, and are configured to support a weight of the second substrate on the shelf support.

3. The measurement device according to claim 1 , further comprising:
elastic bodies applying elastic forces downward to the legs; and
adjustment members adjusting the elastic forces applied by the elastic bodies.

4. A purge gas flow rate measuring method in which a measurement device measures a flow rate of a purge gas supplied from a nozzle of a shelf support in a rack to a carrier, the measurement device including a substrate, a gas introduction section provided on a bottom surface of the substrate and configured to introduce the purge gas while maintaining airtight contact between the gas introduction section and the nozzle with a load from the substrate, a circuit at least including a flowmeter and a power supply, and a plurality of legs movable in the vertical direction with respect to the substrate, the method comprising:
distributing a load of the measurement device into a portion for the plurality of legs and a portion for the gas introduction section by the plurality of legs supported on the shelf support and the gas introduction section in contact with the nozzle of the shelf support; and
measuring by the flowmeter the flow rate of the purge gas flowing to the flowmeter via the gas introduction section.

Assignees

• Murata Machinery Ltd

Inventors

• Murata Masanao
• Yamaji Takashi

Classifications

• H10P72/3404

  Storage means · CPC title

• H10P72/1926

  characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier · CPC title

• H10P72/0604 Primary

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• G01F1/28

  by drag-force, e.g. vane type or impact flowmeter · CPC title

• G01F1/56 Primary

  by using electric or magnetic effects (G01F1/66 takes precedence) · CPC title