Cold spray nodes, studs, stud assemblies, and methods of manufacture

US9644662B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9644662-B2
Application numberUS-201414218490-A
CountryUS
Kind codeB2
Filing dateMar 18, 2014
Priority dateMar 18, 2014
Publication dateMay 9, 2017
Grant dateMay 9, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Studs, nodes, and study assembly systems formed by various methods are disclosed. Various disclosed methods include cold spraying a powder onto a substrate to form a node on the substrate and drilling a hole only into the node. Various disclosed methods include cold spraying a powder onto a substrate to form a node and machining the node to form a stud.

First claim

Opening claim text (preview).

What is claimed is: 1. A method comprising: cold spraying a powder onto an outer surface of a substrate to form a node on the substrate, wherein the node extends above an exposed portion of the outer surface, the exposed portion being adjacent to the node; drilling a hole only into the node; and inserting a stud into the node. 2. The method according to claim 1 , further comprising plating the node on the substrate. 3. The method according to claim 1 , wherein the cold spraying the powder comprises cold spraying at least one of silicon carbide, stainless steel, aluminum, titanium, copper, tantalum, nickel, tungsten, and alloys thereof. 4. The method according to claim 1 , wherein the cold spraying the powder comprises at least one of a high pressure cold spraying and a low pressure cold spraying. 5. The method according to claim 1 , wherein the exposed portion of the outer surface is immediately adjacent to the node. 6. A method comprising: cold spraying a powder onto a substrate to form a node, wherein the node extends above an outer surface of the substrate; and machining the node to form a stud extending from the substrate; and forming threads on the stud. 7. The method of claim 6 , wherein the cold spraying the powder comprises cold spraying at least one of silicon carbide, stainless steel, aluminum, titanium, copper, tantalum, nickel, tungsten, and alloys thereof. 8. The method according to claim 6 , further comprising plating the node. 9. The method according to claim 6 , wherein the cold spraying the powder comprises at least one of a high pressure cold spraying and a low pressure cold spraying. 10. A method comprising: cold spraying a powder onto an outer surface of a substrate to form a node on the substrate, wherein the node extends above an exposed portion of the outer surface, the exposed portion being adjacent to the node; drilling a hole only into the node; and tapping the drilled hole. 11. The method according to claim 10 , further comprising threading a threaded stud into the tapped hole.

Assignees

Inventors

Classifications

  • immediately preceding a cutting tool · CPC title

  • Non-releasable devices (F16B37/044, F16B37/045 and F16B37/06 take precedence) · CPC title

  • C23C24/04Primary

    Impact or kinetic deposition of particles · CPC title

  • with coating before or during assembling · CPC title

  • Screw-bolts; Stay-bolts; Screw-threaded studs; Screws; Set screws ({F16B33/008 takes precedence; joining sheets or plates using screws with two separate threads F16B5/0275; using screws with adjustment sleeves F16B5/0283}; thread cutting screws F16B25/00) · CPC title

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Frequently asked questions

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What does patent US9644662B2 cover?
Studs, nodes, and study assembly systems formed by various methods are disclosed. Various disclosed methods include cold spraying a powder onto a substrate to form a node on the substrate and drilling a hole only into the node. Various disclosed methods include cold spraying a powder onto a substrate to form a node and machining the node to form a stud.
Who is the assignee on this patent?
Goodrich Corp
What technology area does this patent fall under?
Primary CPC classification C23C24/04. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue May 09 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).