Laser texturizing and anodization surface treatment

US9644283B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9644283-B2
Application numberUS-201113250588-A
CountryUS
Kind codeB2
Filing dateSep 30, 2011
Priority dateSep 30, 2011
Publication dateMay 9, 2017
Grant dateMay 9, 2017

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A method of treating a metallic surface of an article including the steps of providing an article having a metallic surface; texturizing the surface using a laser to create a controlled pattern across the surface; and anodizing the surface. The controlled pattern may include a series of pits etched in a predetermined repeating pattern across the surface, such as an array of dots or a grid. The controlled pattern may also include a series of pits etched in a predetermined pseudo-random pattern across the surface.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of modifying a cosmetic quality of an aluminum alloy surface of an enclosure for an electronic device, the method comprising: polishing the aluminum alloy surface, thereby forming a polished aluminum alloy surface on the enclosure; forming a two-dimensional array of pits by passing a pulsed laser beam multiple times along a designated path over and impinging the polished aluminum alloy surface such that a remainder portion of the polished aluminum alloy surface is substantially unaffected by the pulsed laser beam, the depths of at least some of the pits increased with each pass, wherein the pits are substantially uniformly spaced apart and have diameters of between about 20 micrometers to about 25 micrometers; forming a blasted texture on the two-dimensional array of pits and the remainder portion by propelling a stream of abrasive material at the aluminum alloy surface; after forming the blasted texture, chemically brightening the blasted two-dimensional array of pits and the remainder portion by exposing the aluminum alloy surface to an acidic solution; and forming an oxide layer on the chemically brightened and blasted two-dimensional array of pits and the remainder portion using an anodizing process, wherein the oxide layer is sufficiently transparent such that the two-dimensional array of pits and the remainder portion are observable through the oxide layer. 2. The method of claim 1 , wherein the pulsed laser beam is passed over the polished aluminum alloy surface at least four times. 3. The method of claim 1 , wherein forming the two-dimensional array of pits modifies a grain structure of the polished aluminum alloy surface. 4. The method of claim 1 , wherein a first portion of the pits have a first depth and a second portion of the pits have a second depth different than the first depth. 5. The method of claim 1 , wherein the pits are arranged in columns that are offset with respect to each other. 6. The method of claim 1 , wherein the pits are spaced about 50 micrometers apart. 7. A method of treating an aluminum alloy surface of an enclosure of an electronic device, the method comprising: polishing the aluminum alloy surface forming a polished metal surface; creating a decorative pattern on the polished metal surface by making multiple passes of a pulsed laser beam along a designated path over and impinging the polished metal surface, the pulsed laser beam forming a two-dimensional array of substantially uniformly spaced pits surrounded by a remainder portion that is substantially unaffected by the pulsed laser beam, wherein the pulsed laser beam increases depths of the pits with each pass, wherein the pits have diameters of between about 20 micrometers to about 25 micrometers; forming a blasted texture on the two-dimensional array of pits and the remainder portion by propelling a stream of abrasive material at the aluminum alloy surface; after forming the blasted texture, chemically brightening the blasted two-dimensional array of pits and the remainder portion by exposing the aluminum alloy surface to an acidic solution; and anodizing the aluminum alloy surface after propelling the stream of abrasive material, thereby forming an oxide layer on the chemically brightened and blasted two-dimensional array of pits and the remainder portion, wherein the oxide layer is sufficiently transparent such that the pits and the remainder portion are observable through the oxide layer, wherein the depths of the pits are associated with a visual appearance of the enclosure. 8. The method of claim 7 , wherein a first portion of the pits have a first average depth and a second portion of the pits have a second average depth different than the first average depth. 9. The method of claim 7 , wherein each of the pits is characterized as having a substantially circular shape. 10. The method of claim 7 , wherein the pits are characterized as having substantially the same diameter. 11. The method of claim 7 , wherein a first portion of the pits have a first diameter and a first depth, and a second portion of the pits having a second diameter different than the first diameter and a second depth different than the first depth. 12. The method of claim 7 , wherein the pits modify a tactile quality of the polished metal surface. 13. The method of claim 7 , wherein the pits are spaced a predetermined distance apart from each other, the predetermined distance chosen to reduce an appearance of surface defects, fingerprints or smudges on the enclosure of the electronic device. 14. The method of claim 7 , wherein the pulsed laser beam is directed at a substantially perpendicular direction relative to the polished metal surface. 15. The method of claim 7 , wherein the abrasive material includes at least one of beads, sand, or glass. 16. The method of claim 7 , wherein the pulsed laser beam is passed over the polished aluminum surface at least four times. 17. The method of claim 7 , wherein creating the decorative pattern on the polished metal surface modifies a grain structure of the polished metal surface. 18. The method of claim 7 , wherein the pits are arranged in columns that are offset from one another. 19. The method of claim 7 , wherein the pits are approximately 50 micrometers apart. 20. The method of claim 7 , wherein creating the decorative pattern comprises the use of a computer numerical control machine along three or more axes.

Assignees

Inventors

Classifications

  • of refractory metals or alloys based thereon · CPC title

  • of magnesium or alloys based thereon · CPC title

  • C25D11/16Primary

    Pretreatment {, e.g. desmutting} · CPC title

  • by providing a line or line pattern, e.g. a dotted break initiation line · CPC title

  • for making a groove or trench, e.g. for scribing a break initiation groove · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9644283B2 cover?
A method of treating a metallic surface of an article including the steps of providing an article having a metallic surface; texturizing the surface using a laser to create a controlled pattern across the surface; and anodizing the surface. The controlled pattern may include a series of pits etched in a predetermined repeating pattern across the surface, such as an array of dots or a grid. The …
Who is the assignee on this patent?
Hankey Evans, Nashner Michael S, Russell-Clarke Peter, and 1 more
What technology area does this patent fall under?
Primary CPC classification C25D11/16. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue May 09 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).