Cu—Zr-based copper alloy plate and process for manufacturing same

Patent metadata

Field	Value
Publication number	US-9644251-B2
Application number	US-201214000043-A
Country	US
Kind code	B2
Filing date	Feb 10, 2012
Priority date	Feb 18, 2011
Publication date	May 9, 2017
Grant date	May 9, 2017

Abstract

Provided are a Cu—Zr-based copper alloy plate which retains satisfactory mechanical strength and, at the same time, has a good balance of bending formability and bending elastic limit at a high level and a process for manufacturing the Cu—Zr-based copper alloy plate. The copper alloy plate contains 0.05% to 0.2% by mass of Zr and a remainder including Cu and unavoidable impurities, and the average value of KAM values measured by an EBSD method using a scanning electron microscope equipped with a backscattered electron diffraction pattern system is 1.5° to 1.8°, the R/t ratio is 0.1 to 0.6 wherein R represents the minimum bending radius which does not cause a crack and t represents the thickness of the plate in a W bending test, and the bending elastic limit is 420 N/mm 2 to 520 N/mm 2 .

First claim

The invention claimed is:

1. A copper alloy plate consisting of, by mass %:
0.05% to 0.2% of Zr; and
a remainder including Cu and unavoidable impurities,
wherein an average value of KAM values measured by an EBSD method using a scanning electron microscope equipped with a backscattered electron diffraction image system is 1.5° to 1.8°, an R/t ratio is 0.1 to 0.6 in which R represents the minimum bending radius which does not cause a crack, and t represents the thickness of the plate in a W bending test, and bending elastic limit is 420 N/mm 2 to 520 N/mm 2 ,
wherein the copper alloy plate is produced by a process including hot-rolling, solution treatment, cold rolling, aging treatment and heat treatment in this order, a Vickers hardness of the surface of the copper alloy plate after the heat treatment is decreased from a Vickers hardness of the surface of the copper alloy plate after the aging treatment by 3 Hv to 20 Hv.

2. A copper alloy plate consisting of, by mass %:
0.05% to 0.2% of Zr;
0.001% to 0.3% of Co;
a remainder including Cu and unavoidable impurities; and
wherein an average value of KAM values measured by an EBSD method using a scanning electron microscope equipped with a backscattered electron diffraction image system is 1.5° to 1.8°, an R/t ratio is 0.1 to 0.6 in which R represents the minimum bending radius which does not cause a crack, and t represents the thickness of the plate in a W bending test, and bending elastic limit is 420 N/mm 2 to 520 N/mm 2 ,
wherein the copper alloy plate is produced by a process including hot-rolling, solution treatment, cold rolling, aging treatment and heat treatment in this order, a Vickers hardness of the surface of the copper alloy plate after the heat treatment is decreased from a Vickers hardness of the surface of the copper alloy plate after the aging treatment by 3 Hv to 20 Hv.

3. A process for manufacturing the copper alloy plate according to claim 1 , comprising:
hot-rolling a base material of a copper alloy at a starting temperature of 930° C. to 1030°;
subjecting a copper alloy plate to a solution treatment in a rapid cooling treatment by water cooling from a temperature region of equal or more than 600° C. and then, subjecting the copper alloy plate to cold rolling;
subjecting the copper alloy plate to an aging treatment at 320° C. to 460° C. for 2 to 8 hours; and
subjecting the copper alloy plate to a heat treatment at 500° C. to 750° C. for 10 to 40 seconds,
wherein a Vickers hardness of the surface of the copper alloy plate after the heat treatment is decreased from a Vickers hardness of the surface of the copper alloy plate after the aging treatment by 3 Hv to 20 Hv.

4. A process for manufacturing the copper alloy plate according to claim 2 , comprising:
hot-rolling a base material of a copper alloy at a starting temperature of 930° C. to 1030°;
subjecting a copper alloy plate to a solution treatment in a rapid cooling treatment by water cooling from a temperature region of equal or more than 600° C. and then, subjecting the copper alloy plate to cold rolling;
subjecting the copper alloy plate to an aging treatment at 320° C. to 460° C. for 2 to 8 hours; and
subjecting the copper alloy plate to a heat treatment at 500° C. to 750° C. for 10 to 40 seconds,
wherein a Vickers hardness of the surface of the copper alloy plate after the heat treatment is decreased from a Vickers hardness of the surface of the copper alloy plate after the aging treatment by 3 Hv to 20 Hv.

Assignees

• Sakurai Takeshi
• Abe Yoshio
• Hirano Naotake
• Mitsubishi Shindo Kk

Inventors

• Sakurai Takeshi
• Abe Yoshio
• Hirano Naotake

Classifications

• C22F1/08 Primary

  of copper or alloys based thereon · CPC title

• C22C9/00 Primary

  Alloys based on copper · CPC title

• C22C9/06

  with nickel or cobalt as the next major constituent · CPC title