Copper alloy sheet for electric and electronic part

Patent metadata

Field	Value
Publication number	US-9644250-B2
Application number	US-201213585076-A
Country	US
Kind code	B2
Filing date	Aug 14, 2012
Priority date	Jul 21, 2006
Publication date	May 9, 2017
Grant date	May 9, 2017

Abstract

A shear plane ratio is reduced by a dislocation density in which a value obtained by dividing the half-value width β of the intensity of diffraction of {311} plane in the surface of a Cu—Fe—P alloy sheet, by its peak height H, is 0.015 or more. In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which a ratio (I(200)/I(220)) of intensity of diffraction of (I(200)) from the (200) plane in the sheet surface to intensity of diffraction of (I(220)) from the (220) plane, is 0.3 or less. In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which the orientation distribution density of Brass orientation measured by the crystal orientation analysis method using an EBSP by an FE-SEM, is 25% or more; and an average grain size in the sheet is 6.0 μm or less.

First claim

The invention claimed is:

1. A copper alloy sheet, comprising:
Cu;
0.01 to 0.50 mass % Fe;
0.005 to 5.0 mass % Sn; and
0.01 to 0.15 mass % P,
wherein the copper alloy sheet has an improved stampability and which has a microstructure in which a value obtained by dividing the half-value-width of the intensity of diffraction of {311} plane in the sheet surface, by its peak height, is 0.015 or more.

2. The copper alloy sheet of claim 1 , further comprising: 0.005 to 3.0 mass % Zn.

3. A copper alloy sheet for an electric and electronic part comprising:
Cu;
0.01 to 0.50 mass % Fe;
0.005 to 5.0 mass % Sn; and
0.01 to 0.15 mass % P,
wherein the copper alloy sheet has an improved softening resistance and which has a microstructure in which a ratio (I(200)/I(220)) of the intensity (I(200)) of diffraction of the (200) plane in the sheet surface, to intensity (I(220)) of diffraction of the (220) plane, is 0.3 or less.

4. The copper alloy sheet of claim 3 , further comprising: 0.005 to 3.0 mass % Zn.

5. A copper alloy sheet, comprising:
Cu;
0.01 to 0.50 mass % Fe;
0.005 to 5.0 mass % Sn; and
0.01 to 0.15 mass % P,
wherein the copper alloy sheet has an improved resistance of peel off of an oxidation film and has a texture such that that two crystals adjacent with each other having an orientation difference between them of 15° or less are viewed that they are located in the same crystal plane, the orientation distribution density from Brass orientation measured by the crystal orientation analysis method using an Electron Backscatter Diffraction Pattern (EBSP) obtained by an Field Emission Scanning Electron Microscope (FE-SEM), is 25% or more.

6. The copper alloy of claim 5 , wherein an average grain size of the copper alloy is 6.0 μm or less.

7. The copper alloy sheet of claim 6 , further comprising: 0.005 to 3.0 mass % Zn.

8. The copper alloy sheet of claim 1 having a tensile strength of 500 MPa or more and a hardness of 150 Hv or more.

9. The copper alloy sheet of claim 1 , further comprising one or more selected from the group consisting of A, B, C, and D:
A: a total content of 0.0001 to 1.0 mass % of one or more elements selected from the group consisting of Mn, Mg, and Ca;
B: a total content of 0.001 to 1.0 mass % of one or more elements selected from the group consisting of Zr, Ag, Cr, Cd, Be, Ti, Co, Ni, Au, and Pt;
C: a total content of 0.0001 to 1.0 mass % of one or more elements selected from the group consisting of Mn, Mg, and Ca, and a total content of 0.001 to 1.0 mass % of one or more elements selected from the group consisting of Zr, Ag, Cr, Cd, Be, Ti, Co, Ni, Au, and Pt, respectively, wherein a total content of these elements is 1.0 mass % or less; and
D: a total content of 0.1 mass % or less of Hf, Th, Li, Na, K, Sr, Pd, W, S, Si, C, Nb, Al, V, Y, Mo, Pb, In, Ga, Ge, As, Sb, Bi, Te, B, and misch metal.

10. The copper alloy sheet of claim 3 , having a tensile strength of 500 MPa or more and a hardness of 150 Hv or more.

11. The copper alloy sheet of claim 5 , having a tensile strength of 500 MPa or more and a hardness of 150 Hv or more.

12. The copper alloy sheet of claim 3 , further comprising one or more selected from the group consisting of A, B, C, and D:
A: a total content of 0.0001 to 1.0 mass % of one or more elements selected from the group consisting of Mn, Mg, and Ca;
B: a total content of 0.001 to 1.0 mass % of one or more elements selected from the group consisting of Zr, Ag, Cr, Cd, Be, Ti, Co, Ni, Au, and Pt;
C: a total content of 0.0001 to 1.0 mass % of one or more elements selected from the group consisting of Mn, Mg, and Ca, and a total content of 0.001 to 1.0 mass % of one or more elements selected from the group consisting of Zr, Ag, Cr, Cd, Be, Ti, Co, Ni, Au, and Pt, respectively, wherein a total content of these elements is 1.0 mass % or less; and
D: a total content of 0.1 mass % or less of Hf, Th, Li, Na, K, Sr, Pd, W, S, Si, C, Nb, Al, V, Y, Mo, Pb, In, Ga, Ge, As, Sb, Bi, Te, B, and misch metal.

13. The copper alloy sheet of claim 5 , further comprising one or more selected from the group consisting of A, B, C, and D:
A: a total content of 0.0001 to 1.0 mass % of one or more elements selected from the group consisting of Mn, Mg, and Ca;
B: a total content of 0.001 to 1.0 mass % of one or more elements selected from the group consisting of Zr, Ag, Cr, Cd, Be, Ti, Co, Ni, Au, and Pt;
C: a total content of 0.0001 to 1.0 mass % of one or more elements selected from the group consisting of Mn, Mg, and Ca, and a total content of 0.001 to 1.0 mass % of one or more elements selected from the group consisting of Zr, Ag, Cr, Cd, Be, Ti, Co, Ni, Au, and Pt, respectively, wherein a total content of these elements is 1.0 mass % or less; and
D: a total content of 0.1 mass % or less of Hf, Th, Li, Na, K, Sr, Pd, W, S, Si, C, Nb, Al, V, Y, Mo, Pb, In, Ga, Ge, As, Sb, Bi, Te, B, and misch metal.

14. The copper alloy sheet of claim 3 , wherein the copper alloy sheet has an improved softening resistance which is provided by a microstructure in which a ratio (I(200)/I(220)) of the intensity (I(200)) of diffraction of the (200) plane in a surface of the sheet, to the intensity (I(220)) of diffraction of the (220) plane, is 0.25 or less.

15. The copper alloy sheet of claim 1 , comprising 0.01 to 0.0061 mass % P.

16. The copper alloy sheet of claim 3 , comprising 0.01 to 0.0061 mass % P.

17. The copper alloy sheet of claim 5 , comprising 0.01 to 0.0061 mass % P.

18. The copper alloy sheet of claim 1 , having a tensile strength of at least 520 MPa.

19. The copper alloy sheet of claim 3 , having a tensile strength of at least 520 MPa.

20. The copper alloy sheet of claim 5 , having a tensile strength of at least 520 MPa.

Assignees

• Aruga Yasuhiro
• Ozaki Ryoichi
• Miwa Yosuke
• Kobe Steel Ltd

Inventors

• Aruga Yasuhiro
• Ozaki Ryoichi
• Miwa Yosuke

Classifications

• C22F1/00

  Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working (apparatus for mechanical working of metal B21, B23, B24) · CPC title

• C22C9/02

  with tin as the next major constituent · CPC title

• C22C9/04

  with zinc as the next major constituent · CPC title

• H05K2201/0355

  Metal foils · CPC title

• C22F1/08

  of copper or alloys based thereon · CPC title