Silicon-containing compound having alkoxysilyl-ethylene group at its terminal, room temperature-curable organopolysiloxane composition, and molded product obtained by curing the composition

Patent metadata

Field	Value
Publication number	US-9644124-B2
Application number	US-201314649030-A
Country	US
Kind code	B2
Filing date	Dec 10, 2013
Priority date	Dec 20, 2012
Publication date	May 9, 2017
Grant date	May 9, 2017

Abstract

A silicon-containing compound having an alkoxysilyl-ethylene group at its terminal including at least one silyl-ethylene bond represented by the following structural formula (a) in one molecule, and according to this compound, a novel base polymer used in a room temperature-curable polyorganosiloxane composition capable of providing a cured product that is particularly excellent in rapid curability, storage stability and durability can be provided.

First claim

The invention claimed is:

1. A silicon-containing compound having an alkoxysilyl-ethylene group at its terminal which comprises at least one silyl-ethylene bond represented by the following structural formula (a) in one molecule,

wherein R 1 represents a monovalent hydrocarbon group having 1 to 20 carbon atoms which may have a substituent, and those having 3 or more carbon atoms among the hydrocarbon groups may be a cycloalkyl group which is cyclic; R 2 represents a hydrogen atom, or a monovalent hydrocarbon group having 1 to 20 carbon atoms which may have a substituent; “a” represents an integer of 1 to 3; two out of three bonds attached to Si on the left part of formula (a) are R 2 groups, and the other is an —O—Si— bond or an R 2 group; and “n” represents an integer of 0 to 10.

2. The silicon-containing compound having an alkoxysilyl-ethylene group at its terminal according to claim 1 , which is selected from the group consisting of the following formulae:

3. An organosiloxane compound having an alkoxysilyl-ethylene group at its terminal which comprises at least one silyl-ethylene bond represented by the following structural formula (1) in one molecule,

wherein R 1 represents a monovalent hydrocarbon group having 1 to 20 carbon atoms which may have a substituent, and those having 3 or more carbon atoms among the hydrocarbon groups may be a cycloalkyl group which is cyclic; R 2 represents a hydrogen atom, or a monovalent hydrocarbon group having 1 to 20 carbon atoms which may have a substituent; “a” represents an integer of 1 to 3; and “n” represents an integer of 0 to 10.

4. A silicon-containing compound having an alkoxysilyl-ethylene group at its terminal represented by the following structural formula (2),

wherein R 1 represents a monovalent hydrocarbon group having 1 to 20 carbon atoms which may have a substituent, and those having 3 or more carbon atoms among the hydrocarbon groups may be a cycloalkyl group which is cyclic; R 2 represents a hydrogen atom, or a monovalent hydrocarbon group having 1 to 20 carbon atoms which may have a substituent; “a” represents an integer of 1 to 3; and “n” represents an integer of 0 to 10; and “m” represents an integer of 0 to 2,000.

5. The silicon-containing compound having an alkoxysilyl-ethylene group at its terminal according to claim 4 , wherein “m” represents an integer of 0 to 500 in the structural formula (2).

6. The silicon-containing compound having an alkoxysilyl-ethylene group at its terminal according to claim 4 , wherein the silicon-containing compound having an alkoxysilyl-ethylene group at its terminal is a disiloxane compound, where “m” represents 0 in the structural formula (2).

7. A room temperature-curable organopolysiloxane composition comprising:
(A) a diorganopolysiloxane containing at least 2 silicon atoms to which a hydroxyl group and/or a hydrolyzable group are bonded in one molecule: 100 parts by mass;
(B) the silicon-containing compound having an alkoxysilyl-ethylene group at its terminal according to claim 6 ; 0.1 to 30 parts by mass;
(C) a curing catalyst: 0.001 to 15 parts by mass:
(D) a silane and/or a partial hydrolysis condensate thereof other than the component (B): 0 to 30 parts by mass;
(E) a filler: 0 to 1,000 parts by mass; and
(F) an adhesion promoter: 0 to 30 parts by mass.

8. The silicon-containing compound having an alkoxysilyl-ethylene group at its terminal according to claim 4 , wherein the silicon-containing compound having an alkoxysilyl-ethylene group at its terminal is a low-molecular-weight siloxane oligomer where “m” represents an integer of 1 to 10 in the structural formula (2).

9. A room temperature-curable organopolysiloxane composition comprising:
(A) a diorganopolysiloxane containing at least 2 silicon atoms to which a hydroxyl group and/or a hydrolyzable group are bonded in one molecule: 100 parts by mass;
(B) the silicon-containing compound having an alkoxysilyl-ethylene group at its terminal according to claim 8 : 0.1 to 30 parts by mass;
(C) a curing catalyst: 0.001 to 15 parts by mass;
(D) a silane and/or a partial hydrolysis condensate thereof other than the component (B): 0 to 30 parts by mass;
(E) a filler: 0 to 1,000 parts by mass; and
(F) an adhesion promoter: 0 to 30 parts by mass.

10. A room temperature-curable organopolysiloxane composition comprising:
(A) a diorganopolysiloxane containing at least 2 silicon atoms to which a hydroxyl group and/or a hydrolyzable group are bonded in one molecule: 100 parts by mass;
(B) the silicon-containing compound having an alkoxysilyl-ethylene group at its terminal according to claims 7 : 0.1 to 30 parts by mass;
(C) a curing catalyst: 0.001 to 15 parts by mass;
(D) a silane and/or a partial hydrolysis condensate thereof other than the component (B): 0 to 30 parts by mass;
(E) a filler: 0 to 1,000 parts by mass; and
(F) an adhesion promoter: 0 to 30 parts by mass.

11. A room temperature-curable organopolysiloxane composition comprising:
(A) a diorganopolysiloxane containing at least 2 silicon atoms to which a hydroxyl group and/or a hydrolyzable group are bonded in one molecule: 100 parts by mass;
(B) a silicon-containing compound having an alkoxysilyl-ethylene group at its terminal which comprises at least one silyl-ethylene bond represented by the following structural formula (a) in one molecule: 0.1 to 30 parts by mass;

wherein R 1 represents a monovalent hydrocarbon group having 1 to 20 carbon atoms which may have a substituent, and those having 3 or more carbon atoms among the hydrocarbon groups may be a cycloalkyl group which is cyclic; R 2 represents a hydrogen atom, or a monovalent hydrocarbon group having 1 to 20 carbon atoms which may have a substituent; “a” represents an integer of 1 to 3; and “n” represents an integer of 0 to 10;
(C) a curing catalyst: 0.001 to 15 parts by mass;
(D) a silane and/or a partial hydrolysis condensate thereof other than the component (B): 0 to 30 parts by mass;
(E) a filler: 0 to 1,000 parts by mass; and
(F) an adhesion promoter; 0 to 30 parts by mass.

12. A coating agent, an adhesive or a sealing agent comprising the room temperature-curable organopolysiloxane composition according to claim 11 .

13. A molded product obtained by curing the room temperature-curable organopolysiloxane composition according to claim 11 .

14. A room temperature-curable organopolysiloxane composition comprising:
(A) a diorganopolysiloxane containing at least 2 silicon atoms to which a hydroxyl group and/or a hydrolyzable group are bonded in one molecule: 100 parts by mass;
(B) a silicon-containing compound having an alkoxysilyl-ethylene group at its terminal which comprises at least one silyl-ethylene bond represented by the following structural formula (1) in one molecule: 0.1 to 30 parts by mass;

wherein R 1 represents a monovalent hydrocarbon group having 1 to 20 carbon atoms which may have a substituent, and those having 3 or more carbon atoms among the

Assignees

• Shinetsu Chemical Co

Inventors

• Sakamoto Takafumi
• Yamaguchi Takahiro

Classifications

• C07F7/1804

  Compounds having Si-O-C linkages (Si-O-acyl linkages C07F7/1896) · CPC title

• C07F7/0838

  Compounds with one or more Si-O-Si sequences (compounds with a ring containing only alternating Si and O atoms, i.e. cyclosilanes C07F7/21) · CPC title

• C08K5/3465

  condensed with carbocyclic rings · CPC title

• C08F130/08

  containing silicon · CPC title

• C08L83/06

  containing silicon bound to oxygen-containing groups (C08L83/12 takes precedence) · CPC title