Resin composition and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-9644057-B2
Application number	US-201514686954-A
Country	US
Kind code	B2
Filing date	Apr 15, 2015
Priority date	Apr 17, 2014
Publication date	May 9, 2017
Grant date	May 9, 2017

Abstract

An alkoxysilane containing reactive organic functional groups is prepared as one of raw materials. The reactive organic functional groups are caused to react to bond with each other in advance so as to form an oligomer. The oligomer is swollen in an alkoxysilane of an identical or different kind, so that a sol solution is prepared and the sol solution is cured through a sol-gel reaction.

First claim

What is claimed is:

1. A resin composition comprising:
an oligomer of a first metal alkoxide containing a reactive organic functional group, the oligomer being formed through polymerization of the reactive organic functional group;
a second metal alkoxide of at least one kind, the second metal alkoxide forming a siloxane skeleton with the oligomer, wherein the reactive organic functional group comprises a glycidoxy group.

2. The resin composition according to claim 1 ,
wherein the first metal alkoxide is alkoxysilane, and
the alkoxysilane contains an alkoxy group having a carbon number of 1 to 5 inclusive.

3. The resin composition according to claim 2 ,
wherein an organic reactive group bonded with the alkoxysilane has a carbon number of 1 to 10 inclusive.

4. A semiconductor device comprising:
a semiconductor element mounted on a substrate; and
a protective film comprising the resin composition according to claim 1 ,
wherein the semiconductor element is protected by the protective film.

5. A semiconductor device comprising:
a semiconductor element mounted on a substrate;
a phosphor-containing resin which protects the semiconductor element; and
the resin composition according to claim 1 , the resin composition protecting the phosphor-containing resin.

6. A semiconductor device comprising:
a resin container having a recessed portion;
a semiconductor element disposed in the recessed portion; and
the resin composition according to claim 1 , the resin composition being disposed in the recessed portion and covering the semiconductor element,
wherein the resin composition includes a phosphor.

7. The resin composition according to claim 1 ,
wherein the second metal alkoxide includes hydrocarbon radicals.

8. The resin composition according to claim 1 ,
wherein the second metal alkoxide is represented as E p F q G r M(OR1) l (OR2) m (OR3) n where: E, F, and G are hydrocarbon radicals and R is an alkyl group; p, q, r, l, m, and n are each an integer; (p+q+r) and (l+m+n) are each an integer of 1 to 3; p+q+r+l+m+n=4; and M denotes silicon, titanium, aluminium, zirconium, or stannum.

9. The resin composition according to claim 8 ,
wherein each of E, F, and G is a carbon hydride having a carbon number of 1 to 10.

10. The resin composition according to claim 8 ,
wherein R is a carbon hydride having a carbon number of 1 to 5.

11. The resin composition according to claim 1 ,
wherein the oligomer is not hydrolyzed.

12. A method for manufacturing a resin composition, the method comprising:
polymerizing a reactive organic functional group in a first metal alkoxide; and
causing sol-gel reaction of the reactive organic functional group polymerized in the first metal alkoxide, using a second metal alkoxide of at least one kind, wherein the reactive organic functional group comprises a glycidoxy group.

13. A method for manufacturing the resin composition according to claim 12 ,
wherein the reactive organic functional group polymerized in the polymerizing is not hydrolyzed.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Toyota Kei
• Oikawa Kazuma

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/075

  of bond wires · CPC title