Polishing method

US9643291B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9643291-B2
Application numberUS-201615066896-A
CountryUS
Kind codeB2
Filing dateMar 10, 2016
Priority dateNov 11, 2013
Publication dateMay 9, 2017
Grant dateMay 9, 2017

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A polishing method comprising: arranging a polishing tool and a workpiece on lower and upper shaft sides of a polishing device, respectively, the polishing tool including: a polishing surface having a spherical zone shape; and a hole that is provided inside the polishing surface and concentric with an outer edge of the polishing surface around a rotation axis on a projection plane orthogonal to the rotation axis, a ratio of an outer diameter of the polishing surface to an inner diameter of the polishing surface being greater than 1.0 and 6.0 or less; and swinging the polishing tool relative to a reference point while rotating the polishing tool around the rotation axis. The reference point is positioned where a straight line, which passes through a center of the workpiece and intersects with the rotation axis, passes through a center of a spherical zone of the polishing surface in width direction.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for polishing a workpiece executed by a polishing device having a polishing tool, the method comprising the steps of: arranging the polishing tool on a lower shaft side of the polishing device, the polishing tool including: a polishing surface having a predetermined radius of curvature; and a hole that is provided inside the polishing surface and is concentric with an outer edge of the polishing surface around a rotation axis on a projection plane orthogonal to the rotation axis, wherein the polishing surface has a spherical zone shape, and a ratio of an outer diameter of the polishing surface to an inner diameter of the polishing surface is greater than 1.0 and equal to or less than 6.0, and a ratio of a spherical zone width of the polishing surface to an outer diameter of the workpiece is equal to or greater than 0.9; arranging only the workpiece on an upper shaft side of the polishing device; and swinging the polishing tool at a constant swing width with respect to a reference point while rotating the polishing tool around the rotation axis to polish the workpiece, wherein the reference point is provided at a position where a straight line, which passes through a center of the workpiece and intersects with the rotation axis, passes through a center of a spherical zone of the polishing surface in a width direction.

Assignees

Inventors

Classifications

  • B24B13/02Primary

    by means of tools with abrading surfaces corresponding in shape with the lenses to be made · CPC title

  • B24B1/00Primary

    Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes · CPC title

  • with cooling provisions · CPC title

  • the grinding wheel support being angularly adjustable · CPC title

  • Specific tools, e.g. bowl-like; Production, dressing or fastening of these tools · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9643291B2 cover?
A polishing method comprising: arranging a polishing tool and a workpiece on lower and upper shaft sides of a polishing device, respectively, the polishing tool including: a polishing surface having a spherical zone shape; and a hole that is provided inside the polishing surface and concentric with an outer edge of the polishing surface around a rotation axis on a projection plane orthogonal to…
Who is the assignee on this patent?
Olympus Corp
What technology area does this patent fall under?
Primary CPC classification B24B13/02. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 09 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).