Feedthrough assembly for an implantable medical device

Patent metadata

Field	Value
Publication number	US-9643020-B2
Application number	US-201313963103-A
Country	US
Kind code	B2
Filing date	Aug 9, 2013
Priority date	Aug 9, 2013
Publication date	May 9, 2017
Grant date	May 9, 2017

Abstract

Processes for manufacture and assembly of implantable medical devices are described. In particular, techniques are provided for nondestructive electrical isolation assessment of feedthrough assemblies of the implantable medical devices. The feedthrough assemblies may include an insulating structure, a plurality of terminal pins extending through the insulator and a ferrule having an inner lumen into which the insulating structure is disposed. One or more insulating seals may be disposed at the interface of the ferrule-to-insulating structure and/or the terminal pin-to-insulating structure. The electrical isolation assessments may be based on the dielectric properties of the components of the feedthrough assemblies, such as the insulating structure.

First claim

What is claimed is:

1. A method of manufacturing a feedthrough assembly, comprising:
providing an insulating structure having a top portion, a bottom portion and at least one aperture extending from the top portion to the bottom portion, the aperture having a first diameter;
providing a ferrule having an outer surface, the ferrule defining an inner lumen surface;
disposing the insulating structure within the inner lumen surface to fixedly secure the insulating structure to the ferrule;
inserting a terminal pin into the aperture, the terminal pin having a diameter sized to correspond to the first diameter;
performing an electrical isolation evaluation of the insulating structure, wherein the evaluation comprises applying a pulse signal between the terminal and the ferrule at one of the top portion and the bottom portion using a first electrode and a second electrode, wherein the first electrode is engaged with a surface along the top portion and the second electrode is engaged with a surface along the bottom portion; monitoring for occurrence of electrical conduction in response to the application of the pulse signal, wherein the presence of conduction provides an indication of a foreign material disposed on the insulating structure;
measuring a first electrical parameter through the two electrodes responsive to the applied pulse signal;
comparing the first electrical parameter to criteria for detecting foreign material;
detecting foreign material on one of the top portion and the bottom portion in response to the first electrical parameter meeting the criteria for detecting foreign material;
moving at least one of the two electrodes to a different location along the one of the top portion and the bottom portion;
applying a next pulse signal using the two electrodes; and
measuring a second electrical parameter in response to the next pulse signal;
wherein comparing the first electrical parameter to criteria for detecting foreign material comprises comparing the first electrical parameter to the second electrical parameter to determine a variation in the first electrical parameter and the second electrical parameter and comparing the variation to a threshold, and
wherein detecting the foreign material on the one of the top portion and the bottom portion comprises detecting the foreign material when the variation is greater than the threshold.

2. The method of manufacturing the feedthrough assembly of claim 1 , wherein the pulse signal is characterized by a voltage that is less than a breakdown voltage of the insulating structure.

3. The method of manufacturing the feedthrough assembly of claim 2 , wherein the insulating structure is evaluated to assess presence of conduction through the insulating structure in response to the applied pulse signal having the voltage that is less than the breakdown voltage of the insulating structure.

4. The method of manufacturing the feedthrough assembly of claim 1 , wherein the presence of conduction provides an indication of a foreign material disposed within the insulating structure.

5. The method of manufacturing the feedthrough assembly of claim 1 , wherein the pulse signal is characterized by a voltage in the range of 900 volts to 1700 volts.

6. The method of manufacturing the feedthrough assembly of claim 1 , wherein the applied pulse signal comprises a plurality of positive pulses and a plurality of negative pulses, with a predetermined interval being provided between the delivery of each of the pulses.

7. The method of manufacturing the feedthrough assembly of claim 1 , wherein the insulating structure is selecting having properties to provide electrical isolation between the terminal pin and the ferrule.

8. The method of manufacturing the feedthrough assembly of claim 1 , further comprising brazing the lumen surface and at least a portion of the outer surface with a braze material.

9. The method of manufacturing the feedthrough assembly of claim 1 , further comprising coupling the outer surface of the ferrule to the implantable medical device.

10. The method of manufacturing the feedthrough assembly of claim 1 , further comprising coupling the ferrule to a housing of an implantable medical device.

11. The method of manufacturing the feedthrough assembly of claim 1 , further comprising providing a sealing material to fixedly-secure the terminal pin with the insulating structure.

12. The method of manufacturing the feedthrough assembly of claim 1 , further comprising providing two test probe electrodes having a surface area and geometry corresponding to the one of the top portion and the bottom portion and applying the pulse signal to the one of the top portion and the bottom portion by engaging both of the two test probe electrodes with a surface of the one of the top portion and the bottom portion.

13. The method of manufacturing the feedthrough assembly of claim 1 , further comprising:
applying the pulse signal by:
engaging both the first electrode and the second electrode with the surface of the respective one of the top portion and the bottom portion at which the pulse signal is being applied, and
applying the pulse signal across the first electrode and the second electrode that are both engaged with the surface; and

monitoring for the presence of the electrical conduction through the first electrode and the second electrode.

Assignees

• Medtronic Inc

Inventors

• Goldman Simon E
• Iyer Rajesh V
• Burgardt Curtis E
• Fang Zhi
• Galloway Michael J
• Jensen Ryan J
• Martin James A
• Pena Fabian A

Classifications

• G01R31/1227

  of components, parts or materials (G01R31/1209, G01R31/1218, G01R31/18 take precedence; circuits therefor G01R31/14; testing vessels of electrodes G01R31/16) · CPC title

• Y10T29/49147

  Assembling terminal to base · CPC title

• H05K5/0247

  Electrical details of casings, e.g. terminals, passages for cables or wiring · CPC title

• A61N1/3754 Primary

  Feedthroughs · CPC title

• Y10T29/49004

  including measuring or testing of device or component part · CPC title