Industrial process field device with humidity-sealed electronics module

Patent metadata

Field	Value
Publication number	US-9642273-B2
Application number	US-201314036787-A
Country	US
Kind code	B2
Filing date	Sep 25, 2013
Priority date	Sep 25, 2013
Publication date	May 2, 2017
Grant date	May 2, 2017

Abstract

A field device for use in an industrial process includes a housing having a cavity formed therein. A humidity-sealed electronics module has a first compartment formed therein and is positioned in the cavity. The humidity-sealed electronics module includes a seal board. The seal board separates the first compartment of the humidity sealed electronics module from a second compartment in the housing. A first electrical component in the first compartment is mounted to the seal board and a second electrical component in the second compartment is electrically connected to the first electrical component.

First claim

What is claimed is:

1. A field device for use in an industrial process, comprising:
a housing having a cavity formed therein;
a humidity-sealed electronics module having a first compartment formed therein, the humidity-sealed electronics module positioned in the cavity and including a seal board, wherein the seal board separates the first compartment of the humidity sealed electronics module from a second compartment in the housing and forms a seal therebetween;
a first electrical component in the first compartment mounted to the seal board; and
a second electrical component in the second compartment electrically connected to the first electrical component;
wherein the humidity-sealed electronics module divides the housing into the second compartment and a third compartment and the first compartment is sealed with respect to the second and third compartments and the second compartment is further sealed with respect to the third compartment;
wherein the humidity-sealed electronics module includes a side wall and the seal board is sealed to the sidewall; and
wherein the humidity-sealed electronics module includes a second seal board sealed to the side wall opposite the seal board.

2. The field device of claim 1 , wherein the humidity-sealed electronics module includes the second seal board which carries a third electrical component.

3. The field device of claim 1 , wherein the side wall comprises metal.

4. The field device of claim 3 , wherein the metal comprises an aluminum alloy.

5. The field device of claim 1 , wherein the seal board comprises a multi-layer printed circuit board.

6. The field device of claim 1 , wherein the seal board includes at least two metal layers.

7. The field device of claim 1 , wherein the at least two metal layers comprise copper.

8. The field device of claim 1 , wherein the first electrical component comprises process variable measurement circuitry.

9. The field device of claim 1 , wherein the first electrical component comprises a communication circuitry.

10. The field device of claim 1 , wherein the second electrical component comprises communication circuitry.

11. The field device of claim 1 , wherein the humidity-sealed electronics module includes a flange which amounts to a wall of the housing.

12. The field device of claim 1 , wherein the third compartment includes a process control loop connection.

13. The field device of claim 1 , wherein the third compartment includes a process variable sensor connection.

14. The field device of claim 1 , wherein the seal board is soldered to the side wall.

15. The field device of claim 1 , wherein the second compartment is sealed in accordance with intrinsic safety standards.

16. The field device of claim 1 , wherein the humidity-sealed electronics module is cylindrical.

17. The field device of claim 1 including an electrical via which electrically couples to the first electrical component and extends through the seal board.

Assignees

• Rosemount Inc

Inventors

• Norman Kirsten Nicole
• Perrault Aaron Andrew
• Rud Jason Harold
• Holmstadt Clarence Edward

Classifications

• H05K5/069 Primary

  Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft · CPC title

• H05K7/1462

  for programmable logic controllers [PLC] for automation or industrial process control · CPC title

• G01D11/245 Primary

  Housings for sensors · CPC title

• G01D11/24 Primary

  Housings {; Casings for instruments} · CPC title