Electrical apparatus

Patent metadata

Field	Value
Publication number	US-9640508-B2
Application number	US-201514885356-A
Country	US
Kind code	B2
Filing date	Oct 16, 2015
Priority date	Nov 12, 2014
Publication date	May 2, 2017
Grant date	May 2, 2017

Abstract

An electrical apparatus includes a first electrical component; a second electrical component; and an In—Sn—Ag alloy connecting the first electrical component and the second electrical component, the In—Sn—Ag alloy containing AgIn 2 and Ag 2 In, a Ag 2 In content being lower than a AgIn 2 content.

First claim

What is claimed is:

1. An electrical An apparatus, comprising:
a first electrical component;
a second electrical component; and
an In—Sn—Ag alloy connecting the first electrical component and the second electrical component, the In—Sn—Ag alloy containing AgIn 2 and Ag 2 In, a Ag 2 In content being lower than a AgIn 2 content.

2. The electrical apparatus according to claim 1 , further comprising:
a first electrode provided at the first electrical component; and
a second electrode provided at the second electrical component, the In—Sn—Ag alloy connecting the first electrode and the second electrode.

3. The electrical apparatus according to claim 1 ,
wherein the In—Sn—Ag alloy contains not less than 43% by weight and not more than 60% by weight In.

4. The electrical apparatus according to claim 1 ,
wherein the In—Sn—Ag alloy contains not more than 3% by weight Ag.

5. The electrical apparatus according to claim 1 , further comprising:
a third electrical component; and
an alloy connecting the second electrical component and the third electrical component, the alloy being made of a material different from the In—Sn—Ag alloy.

6. The electrical apparatus according to claim 5 , further comprising:
a third electrode provided at the third electrical component, the alloy connecting the second electrode and the third electrode.

7. The electrical apparatus according to claim 5 ,
wherein a melting point of the material different from the In—Sn—Ag alloy is higher than a melting point of the In—Sn—Ag alloy.

8. The electrical apparatus according to claim 1 ,
wherein the first electrical component is a semiconductor device, and the second electrical component is a circuit board.

9. The electrical apparatus according to claim 1 ,
wherein the first electrical component is a semiconductor device, and the second electrical component is a package substrate.

10. The electrical apparatus according to claim 1 ,
wherein the first electrical component is a semiconductor device, and the second electrical component is an interposer.

11. The electrical apparatus according to claim 1 ,
wherein the first electrical component is a package substrate, and the second electrical component is a circuit board.

12. The electrical apparatus according to claim 1 ,
wherein the first electrical component is an interposer, and the second electrical component is a package substrate.

13. The electrical apparatus according to claim 9 ,
wherein the third electrical component is a circuit board.

14. The electrical apparatus according to claim 10 ,
wherein the third electrical component is a circuit board.

15. The electrical apparatus according to claim 12 ,
wherein the third electrical component is a circuit board.

16. The electrical apparatus according to claim 8 ,
wherein the third electrical component is a package substrate.

17. The electrical apparatus according to claim 10 ,
wherein the third electrical component is a package substrate.

Assignees

• Fujitsu Ltd

Inventors

• Uemura Taiki
• Shimizu Kozo
• Sakuyama Seiki

Classifications

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/29

  Bond pads specially adapted therefor · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/923

  Bond pads having multiple stacked layers · CPC title

• H10W72/073

  of die-attach connectors · CPC title