Memory device structure and fabricating method thereof

Patent metadata

Field	Value
Publication number	US-9640432-B2
Application number	US-201615180508-A
Country	US
Kind code	B2
Filing date	Jun 13, 2016
Priority date	Jun 12, 2015
Publication date	May 2, 2017
Grant date	May 2, 2017

Abstract

The disclosed subject matter provides a memory device structure and a fabricating method thereof. The memory device structure includes a substrate including a device region and a peripheral region; multiple gate structures; a first dielectric layer, a second barrier layer, multiple source interconnecting lines, and multiple drain region plugs; a second dielectric layer in the device region include multiple source line plugs, and multiple second drain region plugs, and multiple controlling gate plugs; a third dielectric layer including multiple first conductive layers; a fourth dielectric layer including multiple interconnecting structures; a fifth dielectric layer including multiple second conductive layers; and a sixth dielectric layer including multiple third conductive layers.

First claim

What is claimed is:

1. A method for forming a memory device structure, comprising:
providing a substrate including a peripheral region and a device region including a plurality of isolation structures, wherein the substrate between adjacent isolation structures includes active regions;
forming a plurality of gate structures on the surface of the substrate, wherein a plurality of source region trenches and a plurality of drain region trenches are located on two sides of the gate structures respectively, a plurality of source regions are located in the active regions at the bottom of the source region trenches, a plurality of drain regions are located in the active regions at the bottom of the drain region trenches, and the gate structures include a plurality of controlling gate layers, and a first barrier layer on the surfaces of the controlling gate layers;
forming a first dielectric layer, a second barrier layer, a plurality of source interconnecting lines, and a plurality of drain region plugs, wherein the source interconnecting line are located in the source region trenches in the device region, and the first drain region plugs are located on the surfaces of the drain regions in the device region;
forming a second dielectric layer on the surfaces of the first dielectric layer, the second barrier layer, the first drain region plugs, and the source interconnecting lines, wherein the second dielectric layer in the device region include a plurality of source line plugs on the surfaces of the source interconnecting lines, and a plurality of second drain region plugs on the first drain region plugs, and the second dielectric layer and the first barrier layer in the peripheral region include a plurality of controlling gate plugs on the surfaces of the controlling gate layers;
forming a third dielectric layer on the surface of the second dielectric layer, wherein the third dielectric layer includes a plurality of first conductive layers on the source line plugs, the second drain region plugs, and the controlling gate plugs;
forming a fourth dielectric layer on the third dielectric layer and the first conductive layers, wherein the fourth dielectric layer includes a plurality of interconnecting structures on the surfaces of the first conductive layers;
forming a fifth dielectric layer on the surfaces of the fourth dielectric layer and the interconnecting structures, wherein the fifth dielectric layer includes a plurality of second conductive layers; and
forming a sixth dielectric layer on the surfaces of the fifth dielectric layer and the second conductive layers, wherein the sixth dielectric layer includes a plurality of third conductive layers.

2. The method of claim 1 , wherein:
the gate structures extend from the device region to the surface of the peripheral region and extend cross the surfaces of the active regions;
the bottom portions of the source region trenches and the drain region trenches expose the surfaces of the active regions and the isolation structures in the device region and the peripheral region;
the first dielectric layer is located on the surfaces of the active regions and the isolation structures, the second barrier layer is located on the surfaces of the isolation structures in the device region trenches, and in the drain region trenches and the source region trenches in the peripheral region;
the source line plugs on top of a same source interconnecting line are connected to a same first conductive layer;
the interconnecting structures in the device region are connected to corresponding adjacent source interconnecting lines through the first conductive layers and the source line plugs;
the second conductive layers in the device region are connected to the second drain region plugs that are located on top of the adjacent drain region trenches through the interconnecting structures; and
the third conductive layers are connected to the controlling gate plugs in the peripheral region through the second conductive layers and the interconnecting structures.

3. The method of claim 1 , further comprising a method for forming the first dielectric layer, the second barrier layer, the source interconnecting lines and the first drain region plugs, including:
forming the first dielectric layer on the surfaces of the source regions and the isolation structures, wherein the surface of the first dielectric layer levels with the surface of gate structures;
removing the first dielectric layer on the surfaces of the drain region trenches in the device region to form a plurality of drain region via holes in the drain region trenches, and removing the first dielectric layer in the drain region trenches and the source region trenches that are in the peripheral region to expose the drain region trenches and the source region trenches that are in the peripheral region;
forming a second barrier layer in the drain region via holes, and in the drain region trenches and the source region trenches that are in the peripheral region;
after forming the second barrier layer, removing the first dielectric layer in the source region trenches and the drain region trenches; and
after removing the first dielectric layer in the source region trenches and the drain region trenches, forming a plurality of first drain region plugs on the surfaces of the active regions in the drain region trenches in the device region, and forming a plurality of source interconnecting lines in the source region trenches in the device region.

4. The method of claim 3 , further comprising a method for forming the first drain region plugs and the source interconnecting lines, including:
forming a conductive material film on the surfaces of the source region trenches, the drain region trenches, the first dielectric layer, the gate structures, and the second barrier later; and
planarizing the conductive material film until the surfaces of the first dielectric layer, the gate structures, and the second barrier layer are exposed, to form the first drain region plugs and the source interconnecting lines.

5. The method of claim 1 , wherein the gate structures further comprises:
a first gate dielectric layer on the surfaces of the source regions of the substrate;
a floating gate layer on the surface of the first gate dielectric layer; and
a second gate dielectric layer on the surface of the floating gate layer and the isolation structures;
wherein the controlling gate layers are located on the surface of the second gate dielectric layer.

6. The method of claim 5 , wherein the gate structures further comprises:
a plurality of sidewalls on the side surfaces of the first gate dielectric layer, the floating gate layer, the second gate dielectric layer, the controlling gate layers, and the first barrier layer.

7. The method of claim 1 , wherein the interconnecting structures comprise:
a plurality of interconnecting plugs on the surfaces of the first conductive layers; and
a plurality of interconnecting layers on the surfaces of the interconnect plugs;
wherein the interconnecting layers in the device region are connected to source line plugs on the surfaces of adjacent source interconnecting lines through the interconnect plugs.

8. The method of claim 1 , further comprising:
forming a plurality of second plugs in the fifth dielectric layer, wherein: the second plugs are located on the surfaces of the interconnecting structures;
the second conductive layers are located on the top surface of the second plugs; and
the second conductive layers in the device region are connected to the second drain region plugs that are located on top of adjacent drain region trenches through the second plugs and the interconnecting structures.

9. The method of claim 1 , fu

Assignees

• Semiconductor Mfg Int Shanghai Corp

Inventors

• Zhang Jinshuang
• Li Shaobin
• Chiu Sheng-Fen

Classifications

• H10W20/089

  using processes for implementing desired shapes or dispositions of the openings, e.g. double patterning · CPC title

• H10W20/033

  in openings in dielectrics · CPC title

• H10W20/056 Primary

  by filling conductive material into holes, grooves or trenches · CPC title

• H01L21/76877 Primary

  Electricity · mapped topic

• H01L27/11521

  Electricity · mapped topic