Multilayer ceramic capacitor

Patent metadata

Field	Value
Publication number	US-9640323-B2
Application number	US-201514822916-A
Country	US
Kind code	B2
Filing date	Aug 11, 2015
Priority date	Aug 13, 2014
Publication date	May 2, 2017
Grant date	May 2, 2017

Abstract

A multilayer body includes an inner layer portion having a dimension in a stacking direction greater than a dimension of the inner layer portion in a width direction, a second outer layer portion including an outer portion including a second principle surface and an inner portion disposed adjacent to both of the outer portion and the inner layer portion, a dimension of the outer portion in the stacking direction being greater than a dimension of the inner portion, and a composition ratio of Si relative to Ti in the outer portion is greater than that in the inner portion.

First claim

What is claimed is:

1. A multilayer ceramic capacitor comprising:
a multilayer body including a plurality of dielectric layers and a plurality of conductive layers, which are stacked therein in a stacking direction, and including a first principle surface and a second principle surface that are opposite to each other in the stacking direction, a first end surface and a second end surface that are opposite to each other in a length direction and connect the first principle surface and the second principle surface, and a first side surface and a second side surface that are opposite to each other in a width direction and connect the first principle surface and the second principle surface as well as the first end surface and the second end surface; and
first and second outer electrodes provided on portions of a surface of the multilayer body and electrically connected to at least one of the plurality of conductive layers; wherein
the multilayer body includes a first outer layer portion which includes a first of the plurality of dielectric layers closest to the first principle surface, a second outer layer portion which includes a second of the plurality of dielectric layers closest to the second principle surface, and an inner layer portion adjacent to both of the first outer layer portion and the second outer layer portion, the inner layer portion including a portion extending from a first of the plurality of conductive layers closest to the first principle surface to a second of the plurality of conductive layers closest to the second principle surface in the stacking direction;
a dimension of the inner layer portion in the stacking direction is greater than a dimension of the inner layer portion in the width direction;
the second outer layer portion includes an outer portion including the second principle surface, and an inner portion disposed adjacent to both of the outer portion and the inner layer portion;
a dimension of the outer portion in the stacking direction is greater than a dimension of the inner portion; and
a composition ratio of Si relative to Ti in the outer portion is greater than that in the inner portion.

2. The multilayer ceramic capacitor according to claim 1 , wherein the dimension of the inner layer portion in the stacking direction is greater than a dimension of the multilayer body in the width direction.

3. The multilayer ceramic capacitor according to claim 2 , wherein a boundary region adjacent to the inner portion has a larger Si content compared to a central region of the outer portion in the stacking direction.

4. The multilayer ceramic capacitor according to claim 3 , wherein
the first and second outer electrodes are disposed on portions of the second principle surface of the multilayer body; and
a surface region including the second principle surface in the outer portion has a larger Si content compared to that of a central region of the outer portion in the stacking direction.

5. The multilayer ceramic capacitor according to claim 1 , wherein a composition ratio of a rare earth element relative to Ti of the dielectric layers in the inner layer portion is higher than that in the outer portion.

6. The multilayer ceramic capacitor according to claim 1 , wherein a composition ratio of Dy relative to Ti of the dielectric layers in the inner layer portion is higher than that in the outer portion.

7. The multilayer ceramic capacitor according to claim 5 , wherein each of a composition ratio of Mn relative to Ti of the dielectric layers in the inner layer portion, a composition ratio of Mn relative to Ti of the dielectric layers in the first outer layer portion, and a composition ratio of Mn relative to Ti of the dielectric layers in the inner portion, is higher than that in the outer portion.

8. The multilayer ceramic capacitor according to claim 4 , wherein
the composition ratio of Si relative to Ti in the outer portion is about 0.004 higher than that in the inner portion;
the composition ratio of Si relative to Ti in the outer portion is not less than about 0.013 and not larger than about 0.03;
a composition ratio of a rare earth element composition relative to Ti in the dielectric layers of the inner layer portion is not less than about 0.003, and a composition ratio of a rare earth element relative to Ti in the outer portion is less than about 0.003;
each of a composition ratio of Mn relative to Ti in the dielectric layers of the inner layer portion, a composition ratio of Mn relative to Ti of the dielectric layers in the first outer layer portion, and a composition ratio of Mn relative to Ti of the dielectric layers in the inner portion is not less than about 0.0008; and
a composition ratio of Mn relative to Ti in the outer portion is not more than about 0.0008.

9. A multilayer ceramic capacitor series comprising:
a plurality of multilayer ceramic capacitors, each of the plurality of multilayer ceramic capacitors being the multilayer ceramic capacitor according to claim 1 ; and
a package including a carrier tape and a cover tape, the carrier tape including a plurality of cavities disposed apart from each other in which the plurality of multilayer ceramic capacitors are stored, the cover tape being attached to the carrier tape and covering the plurality of cavities; wherein
the second principle surfaces of the plurality of multilayer ceramic capacitors face bottoms of the plurality of respective cavities.

10. A multilayer ceramic capacitor mount body comprising:
the multilayer ceramic capacitor according to claim 1 ; and
a substrate on which the multilayer ceramic capacitor is mounted; wherein
the second principle surface of the multilayer ceramic capacitor faces the substrate.

Assignees

• Murata Manufacturing Co

Inventors

• Sugita Hiroaki
• Kitano Shota

Classifications

• H01G4/228

  Terminals · CPC title

• H05K1/18

  structurally associated with non-printed electric components (H05K1/16 takes precedence) · CPC title

• H01G4/1218

  based on titanium oxides or titanates (H01G4/1245 takes precedence) · CPC title

• H01G4/38

  Multiple capacitors, i.e. structural combinations of fixed capacitors · CPC title

• H05K2201/10015

  Non-printed capacitor · CPC title