Optical semiconductor device and method of producing the same
US-2016026064-A1 · Jan 28, 2016 · US
US9638980B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9638980-B2 |
| Application number | US-201514805142-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 21, 2015 |
| Priority date | Jul 23, 2014 |
| Publication date | May 2, 2017 |
| Grant date | May 2, 2017 |
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A modulator including: a Mach-Zehnder modulator that includes an optical waveguide disposed on a substrate, the optical waveguide including an electrode thereon; a resin layer disposed on the substrate, the resin layer embedding the optical waveguide, the resin layer having a groove arranged besides the optical waveguide; a termination resistor disposed on the substrate in the groove of the resin layer; and a first wiring disposed on the resin layer, the first wiring being connected to the termination resistor and the electrode of the optical waveguide.
Opening claim text (preview).
What is claimed is: 1. A modulator comprising: a Mach-Zehnder modulator that includes an optical waveguide disposed on a substrate, the optical waveguide including an electrode thereon; a resin layer disposed on the substrate, the resin layer embedding the optical waveguide, the resin layer having a groove arranged beside the optical waveguide; a termination resistor disposed on the substrate in the groove of the resin layer; and a first wiring disposed on the resin layer, the first wiring being connected to the termination resistor and the electrode of the optical waveguide. 2. The modulator according to claim 1 , wherein the first wiring extends from a top surface of the resin layer toward a bottom surface of the groove. 3. The modulator according to claim 1 , further comprising: a first insulating layer disposed on the substrate, the first insulating layer being sandwiched between the termination resistor and the substrate. 4. The modulator according to claim 1 , wherein the resin layer embeds the termination resistor. 5. The modulator according to claim 1 , further comprising: a second wiring disposed on the resin layer, wherein the termination resistor has a first end and a second end opposite to the first end, the resin layer has a first inclined surface extending from a top surface of the resin layer toward a bottom surface of the groove and a second inclined surface extending from the top surface of the resin layer toward the bottom surface of the groove, the first wiring is disposed on the first inclined surface and connected to the first end of the termination resistor, and the second wiring is disposed on the second inclined surface and connected to the second end of the termination resistor. 6. The modulator according to claim 1 , wherein the resin layer includes a first resin layer disposed on the substrate and a second resin layer disposed on the first resin layer, the first resin layer embeds the optical waveguide, and the second resin layer embeds the termination resistor. 7. The modulator according to claim 6 , wherein the first resin layer includes an opening on the optical waveguide, and the first wiring is connected to the electrode of the optical waveguide through the opening.
controlled by a high-frequency electromagnetic component in an electric waveguide structure · CPC title
in an optical waveguide structure (G02F1/017, {G02F1/2257} take precedence) · CPC title
Physics · mapped topic
electrode · CPC title
Mach-Zehnder type · CPC title
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