Optical fiber alignment device

Patent metadata

Field	Value
Publication number	US-9638859-B1
Application number	US-201614993460-A
Country	US
Kind code	B1
Filing date	Jan 12, 2016
Priority date	Jan 12, 2016
Publication date	May 2, 2017
Grant date	May 2, 2017

Abstract

A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.

First claim

We claim:

1. An optical fiber alignment device for aligning an optical fiber with an optical waveguide in a photonic integrated circuit (PIC) comprising:
a base;
a groove in said base for receiving a portion of the optical fiber, whereby a core of the optical fiber is aligned with a core of the optical waveguide of the PIC;
first alignment features extending from the base for abutting a hard stop layer on the PIC;
first bonding pads mounted on the base for bonding with corresponding second bonding pads on the PIC via a bonding material disposed therebetween; and
a cavity in the base for receiving an electronic or opto-electronic component extending from the PIC.

2. The device according to claim 1 , further comprising recesses in the base;
wherein the first bonding pads are disposed within the recesses, whereby excess adhesive material is trapped in the recesses during and after assembly.

3. The device according to claim 1 , further comprising a trough extending from an outer free end of the groove for collecting excess material used to bond the optical fiber in the groove.

4. The device according to claim 1 , further comprising a hermetically sealable material surrounding an opening to the cavity for hermetically sealing the electronic or opto-electronic component within the cavity.

5. The device according to claim 1 , wherein the first alignment features comprise pillars extending from the base for abutting the hard stop layer on the PIC.

6. A photonic integrated chip assembly comprising:
the optical fiber alignment device of claim 1 ; and
the PIC, including:
the hard stop layer abutting with the first alignment features;

the second bonding pads bonded to the first bonding pads with an adhesive material therebetween; and
an electronic or opto-electronic component received in the cavity.

7. The photonic integrated chip assembly to claim 6 , wherein the PIC further comprises second alignment features for receiving the first alignment features, and for enabling access to the hard stop layer.

8. The photonic integrated chip assembly according to claim 7 , wherein the second alignment features comprise openings in the PIC, down to the waveguide layer; and wherein the hard stop layer comprises the waveguide layer.

9. The photonic integrated chip assembly according to claim 6 , further comprising a hermetically sealable material surrounding an opening to the cavity for hermetically sealing the electronic or opto-electronic component within the cavity.

10. The photonic integrated chip assembly according to claim 6 , further comprising recesses in the base;
wherein the first bonding pads are disposed within the recesses, whereby excess adhesive material is trapped in the recesses during and after assembly.

11. The photonic integrated chip assembly according to claim 6 , further comprising a ground connection between the cavity in the base and the electronic or opto-electronic component extending from the PIC, for grounding the electronic or opto-electronic component to the fiber alignment device.

12. A method of aligning an optical fiber to a waveguide on a photonic optical chip (PIC) comprising:
providing an optical fiber alignment device for aligning an optical fiber with an optical waveguide on a photonic integrated circuit (PIC) comprising:
a base;
a groove in said base for receiving a portion of the optical fiber, whereby a core of the optical fiber is aligned with a core of the optical waveguide of the PIC;
first alignment features extending from the base for abutting a hard stop layer on the PIC;
first bonding pads mounted on the base for bonding with corresponding second bonding pads on the PIC via an adhesive material disposed therebetween; and
a cavity in the base for receiving an electronic or opto-electronic component extending from the PIC;

providing the PIC comprising:
the hard stop layer for abutting with the first alignment features;
the second bonding pads for bonding to the first bonding pads with the adhesive material therebetween; and
an electronic or opto-electronic component received in the cavity;

mounting the optical fiber alignment device on the PIC with the first alignment features aligned with the hard stop layer, and the first bonding pads aligned with the second bonding pads with the adhesive material therebetween, whereby the optical fiber alignment device is spaced from the photonic chip by the adhesive material; and
activating the adhesive, whereby the adhesive flows and the first alignment features of the fiber alignment device move into contact with the hard stop layer of the photonic optical chip.

13. The method according to claim 12 , further comprising aligning the fiber alignment device to the PIC in the X-Y plane.

14. The method according to claim 12 , further comprising mounting the optical fiber in the groove;
aligning the optical fiber with the optical waveguide; and
fixing the optical fiber to the optical fiber alignment device.

15. The method according to claim 14 , wherein a trough extends from an outer free end of the groove for collecting excess material used to bond the optical fiber in the groove.

16. The method according to claim 12 , wherein the fiber alignment device further comprises recesses in the base;
wherein the first bonding pads are disposed within the recesses, whereby excess adhesive is trapped in the recesses during activation.

17. The method according to claim 12 , wherein the fiber alignment device further comprises a hermetic seal, surrounding the cavity for hermetically sealing the electronic or opto-electronic component; and
wherein the step of activating the adhesive includes forming the hermetic seal around the cavity.

18. The method according to claim 12 , wherein the first alignment features comprise pillars extending from the base for abutting the hard stop layer on the PIC.

19. The method according to claim 18 , wherein the second alignment features include openings through which the pillars extend to the hard stop layer.

20. The method according to claim 19 , wherein the waveguide layer comprises the hard stop layer.

Assignees

• Coriant Advanced Tech Llc
• Elenion Tech Llc

Inventors

• Nuttall Nathan A
• Blumenthal Daniel J
• Novack Ari
• Klein Holger N

Classifications

• G02B6/4245

  Mounting of the opto-electronic elements · CPC title

• G02B6/428

  containing printed circuit boards [PCB] · CPC title

• G02B6/4253

  by embedding housing components in an adhesive or a polymer material (G02B6/4212 takes precedence) · CPC title

• G02B6/4239

  Adhesive bonding; Encapsulation with polymer material · CPC title

• G02B6/30 Primary

  for use between fibre and thin-film device · CPC title