Highly efficient diagnostic methods for monolithic sensor systems

US9638762B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9638762-B2
Application numberUS-201414187564-A
CountryUS
Kind codeB2
Filing dateFeb 24, 2014
Priority dateFeb 24, 2014
Publication dateMay 2, 2017
Grant dateMay 2, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Embodiments relate to integrated circuit (IC) sensors and more particularly to IC sensor diagnostics using multiple (e.g., redundant) communication signal paths, wherein one or more of the communication signal paths can be diverse (e.g., in hardware, software or processing, an operating principle, or in some other way) from at least one other of the multiple communication signal paths. Embodiments can relate to a variety of sensor types, implementations and applications, including 3D magnetic field and other sensors.

First claim

Opening claim text (preview).

What is claimed is: 1. A monolithic integrated circuit sensor system comprising: a first multiplexer in a first signal channel; a first analog-to-digital converter (ADC) in the first signal channel and coupled to the first multiplexer; a second multiplexer in a second signal channel; a second analog-to-digital converter (ADC) in the second signal channel and coupled to the second multiplexer; and a first sensor device configured to sense a physical characteristic, wherein the first sensor device is coupled to both the first and second ADCs to provide a signal related to the physical characteristic to both the first and second ADCs, the first sensor device being coupled to the first ADC by the first multiplexer and the first sensor device being coupled to the second ADC by the second multiplexer, wherein the sensor system is configured to detect an error in the sensor system based on a comparison of signals between the first and second signal channels after the first and second ADCs. 2. The sensor system of claim 1 , wherein the first sensor device is configured to provide a plurality of signals related to the physical characteristic, wherein a first of the plurality of signals is provided to the first ADC, a second of the plurality of signals is provided to the second ADC, and a third of the plurality is the signal related to the physical characteristic provided to both the first and second ADCs. 3. The sensor system of claim 2 , wherein the first sensor comprises a magnetic field sensor, and wherein the first of the plurality of signals relates to a first component of a magnetic field, the second of the plurality of signals relates to a second component of the magnetic field, and the third of the plurality of signals relates to a third component of the magnetic field. 4. The sensor system of claim 3 , wherein the sensor system is configured to determine an angle of the magnetic field from the first and second of the plurality of signals. 5. The sensor system of claim 4 , wherein the sensor system is coupled to a receiver, and wherein the receiver is configured to recalculate the angle of the magnetic field based on the first and second of the plurality of signals to verify the determined angle. 6. The sensor system of claim 1 , further comprising at least one second sensor device configured to sense a characteristic of an environment of the first sensor device. 7. The sensor system of claim 6 , wherein a first second sensor device is coupled to the first signal channel and a second sensor device is coupled to the second signal channel, and wherein the sensor system is configured to detect an error in the sensor system based on a comparison of signals related to the first and second sensor devices between the first and second signal channels after the first and second ADCs. 8. The sensor system of claim 7 , wherein the at least one second sensor device comprises at least one of a temperature sensor, an optical sensor, a light sensor, a stray field sensor, or a mechanical stress sensor. 9. The sensor system of claim 7 , wherein the first second sensor device is configured to implement a first type of measurement scheme and the second sensor device is configured to implement a second type of measurement scheme. 10. The sensor system of claim 9 , wherein the first and second types of measurement schemes are the inverse of one another. 11. The sensor system of claim 10 , wherein the first type of measurement scheme is a compensation scheme using a positive scheme or a direct scheme, and the second type of measurement scheme is a compensation scheme using a negative scheme or an inverse scheme. 12. The sensor system of claim 7 , wherein a first biasing is applied to the first second sensor device and a second biasing is applied to the second sensor device. 13. The sensor system of claim 6 , wherein a signal from the at least one second sensor device is used to compensate a signal related to the first sensor device. 14. The sensor system of claim 13 , further comprising a digital signal processor (DSP) coupled to the first and second signal channels, wherein the DSP is configured to implement a first compensation algorithm for a signal received from the first ADC and a second compensation algorithm for a signal received from the second ADC, wherein the first compensation algorithm and the second compensation algorithm are different, and wherein the DSP is configured to detect that an error has occurred in the sensor system based on a comparison of signals after the first and second compensation algorithms. 15. A method comprising: providing a sensor system comprising at least one sensor to sense a first physical characteristic and at least one multi-dimensional sensor; providing at least two analog-to-digital converters (ADCs) coupled to the at least one sensor, wherein the at least one multi-dimensional sensor is coupled to the at least two ADCs and configured to provide a signal related to one dimension to both of the at least two ADCs; and providing circuitry to compare signals from the at least two ADCs to detect whether an error has occurred in the sensor system. 16. The method of claim 15 , wherein providing a sensor system further comprises providing at least one additional sensor to sense a second physical characteristic related to an environmental characteristic. 17. The method of claim 16 , further comprising providing circuitry to do at least one of: compensate signals of the at least one sensor to sense the first physical characteristic by signals of the at least one additional sensor to sense the second physical characteristic; compare signals related to the at least one additional sensor to sense the second physical characteristic to detect whether an error has occurred in the sensor system; providing a second sensor to redundantly sense the first physical characteristic; and providing at least two additional sensors to sense the second physical characteristic related to an environmental characteristic, and comparing signals of the at least two additional sensors to detect an error in the sensor system. 18. The method of claim 17 , wherein the sensor system comprises at least two independent sensor paths related to the first physical characteristic, wherein providing circuitry further comprises providing circuitry to compensate signals of a first independent sensor path using a first compensation scheme, and providing circuitry to compensate signals of a second independent sensor path using a second compensation scheme that is different from the first compensation scheme. 19. The method of claim 18 , wherein the sensor system comprises at least two sensor paths related to the first physical characteristic, wherein at least a portion of the at least two sensor paths overlaps, and wherein providing circuitry further comprises providing circuitry to compensate signals of a first independent sensor path using a first compensation scheme, and providing circuitry to compensate signals of a second independent sensor path using a second compensation scheme that is different from the first compensation scheme.

Assignees

Inventors

Classifications

  • Vertical Hall-effect devices · CPC title

  • using multilayer structures, e.g. giant magnetoresistance sensors (thin magnetic films H01F10/00) · CPC title

  • anisotropic magnetoresistance sensors · CPC title

  • influenced by the relative movement between the Hall device and magnetic fields (see G01R33/06) · CPC title

  • Electronic aspects, e.g. circuits for stimulation, evaluation, control; Treating the measured signals; calibration (G01R33/0017 takes precedence) · CPC title

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Frequently asked questions

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What does patent US9638762B2 cover?
Embodiments relate to integrated circuit (IC) sensors and more particularly to IC sensor diagnostics using multiple (e.g., redundant) communication signal paths, wherein one or more of the communication signal paths can be diverse (e.g., in hardware, software or processing, an operating principle, or in some other way) from at least one other of the multiple communication signal paths. Embodime…
Who is the assignee on this patent?
Infineon Technologies Ag
What technology area does this patent fall under?
Primary CPC classification G01R33/0023. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue May 02 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).