ATE thermal overload detection and recovery techniques

Patent metadata

Field	Value
Publication number	US-9638718-B2
Application number	US-201514703105-A
Country	US
Kind code	B2
Filing date	May 4, 2015
Priority date	Aug 7, 2014
Publication date	May 2, 2017
Grant date	May 2, 2017

Abstract

A system including an automated test equipment (ATE) and an interface board. The interface board includes a temperature monitor that compares a sensor temperature to a predetermined temperature. The associated temperature sensor may be located near one or more selected components on the device under test or the interface board. If the sensor temperature exceeds the predetermined temperature the temperature monitor turns off one or more power supplies of the ATE.

First claim

What is claimed is:

1. An apparatus comprising:
an automated test equipment including a power supply;
an interface board, communicatively coupled to the automated test equipment, including a temperature monitor, wherein the temperature monitor,
receives a sensor temperature signal received from a temperature sensor;
compares a value corresponding to the sensor temperature signal to a predetermined temperature value; and
drives an alert signal to an asserted state as the sensor temperature signal value exceeds the predetermined temperature value; and

wherein the alert signal is coupled to the power supply to turn off the power supply when the alert signal is in the asserted state.

2. The apparatus of claim 1 , wherein the temperature sensor is disposed on a device under test and is located adjacent one or more components operating at elevated temperatures or adjacent one or more temperature sensitive components on the device under test.

3. The apparatus of claim 1 , wherein the temperature sensor is disposed on the interface board and is located proximate one or more components operating at elevated temperatures or proximate one or more temperature sensitive components on the device under test.

4. The apparatus of claim 1 , wherein the temperature sensor is disposed on the interface board and is located adjacent one or more interfaces coupling the interface board to the device under test.

5. The apparatus of claim 1 , wherein the temperature sensor is disposed on the interface board and is located adjacent one or more components operating at elevated temperatures or adjacent one or more temperature sensitive components on the interface board.

6. The apparatus of claim wherein the temperature sensor is integral to the temperature monitor.

7. The apparatus of claim 6 , wherein the temperature monitor is located proximate one or more components operating at elevated temperatures or proximate one or more temperature sensitive components on the device under test.

8. The apparatus of claim 6 , wherein the temperature monitor is located adjacent one or more interfaces coupling the interface board to the device under test.

9. The apparatus of claim 6 , wherein the temperature monitor is located adjacent one or more components operating at elevated temperatures or adjacent one or more temperature sensitive components on the interface board.

10. The apparatus of claim 1 , wherein the interface board further includes a temperature activated switch coupled to the temperature monitor, wherein the temperature activated switch drives the alert signal to the asserted state when a temperature proximate the temperature activated switch raises above a threshold temperature of the temperature activated switch.

11. The apparatus of claim 10 wherein the temperature activated switch is located proximate one or more components operating at elevated temperatures or proximate one or more temperature sensitive components on the device under test.

12. The apparatus of claim 10 , wherein the temperature activated switch is located adjacent one or more interfaces coupling the interface board to the device under test.

13. The apparatus of claim 10 , wherein the temperature activated switch is located adjacent one or more components operating at elevated temperatures or adjacent one or more temperature sensitive components on the interface board.

14. The apparatus of claim 1 wherein
the automated test equipment further includes an emergency off functional module, and
the interface board further includes a temperature activated switch coupled to the emergency off functional module, wherein the temperature activated switch breaks a conductive chain of the emergency off functional module when a temperature proximate the temperature activated switch raises above a threshold temperature of the temperature activated switch.

15. The apparatus of claim 14 , wherein the temperature activated switch is located proximate one or more components operating at elevated temperatures or proximate one or more temperature sensitive components on the device under test.

16. The apparatus of claim 14 , wherein the temperature activated switch is located adjacent one or more interfaces coupling the interface board to the device under test.

17. The apparatus of claim 14 , wherein the temperature activated switch is located adjacent one or more components operating at elevated temperatures or adjacent one or more temperature sensitive components on the interface board.

18. An apparatus comprising:
an automated test equipment including a power supply;
an interface board, communicatively coupling the automated test equipment and a device under test, wherein the interface board includes a temperature monitor having,
a means for comparing a value corresponding to a sensor temperature signal received from a temperature sensor to a predetermined temperature value, wherein the temperature sensor is located proximate one or more components operating at elevated temperatures or proximate one or more temperature sensitive components on the interface board or the device under test, and
a means for turning off the power supply as the sensor temperature signal value exceeds the predetermined temperature value and comprising a means for issuing an alert signal that turns off the power supply when the alert signal is asserted.

19. The apparatus of claim 18 , wherein the interface board further has a means for further turning of the power supply when a temperature proximate one or more components operating at elevated temperatures or proximate one or more temperature sensitive components on the interface board or the device under test raises above a threshold temperature.

20. The apparatus of claim 18 , wherein,
the automated test equipment further includes an emergency functional module; and
the interface board further has a means for breaking a conductive chain of the emergency functional module when a temperature proximate one or more components operating at elevated temperatures or proximate one or more temperature sensitive components on the interface board or the device under test raises above a threshold temperature.

Assignees

• Advantest Corp

Inventors

• Haefner Ralf
• Ploetz Claus

Classifications

• G01K13/00 Primary

  Thermometers specially adapted for specific purposes · CPC title

• G01K7/00

  Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat (giving results other than momentary value of temperature G01K3/00) {; Power supply therefor, e.g. using thermoelectric elements} · CPC title

• G01R1/02

  General constructional details · CPC title

• G01R1/36 Primary

  Overload-protection arrangements or circuits for electric measuring instruments · CPC title

• G01R35/00

  Testing or calibrating of apparatus covered by the other groups of this subclass · CPC title