Infrared-sensor filter member, manufacturing method thereof, infrared sensor, and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-9638576-B2
Application number	US-201414763890-A
Country	US
Kind code	B2
Filing date	Feb 6, 2014
Priority date	Feb 14, 2013
Publication date	May 2, 2017
Grant date	May 2, 2017

Abstract

An infrared-sensor filter member includes an optical filter disposed in an opening portion of a second member and a first member. The infrared-sensor filter member includes a recess portion formed from a light-incident surface of the optical filter and the first member. At least a part of a bottom surface of the recess portion is formed by the light-incident surface and side walls of the recess portion, which are formed by the first member.

First claim

The invention claimed is:

1. An infrared-sensor filter member, comprising:
an optical filter for an infrared sensor; and
a recess portion formed by one surface of the optical filter and a first member, wherein
a bottom surface of the recess portion includes a center portion formed by one surface of the optical filter and a peripheral portion formed by the first member, and
side walls of the recess portion are formed by the first member.

2. The infrared-sensor filter member according to claim 1 , wherein
an inner side surface of the side wall is inclined relative to the bottom surface such that an area of an opening surface of the recess portion is larger than an area of the bottom surface of the recess portion.

3. The infrared-sensor filter member according to claim 1 , further comprising a second member with an emissivity equal to or smaller than 0.3, wherein
at least a part of the second member is exposed from an outer surface of the infrared-sensor filter member.

4. The infrared-sensor filter member according to claim 3 , wherein
another surface of the optical filter is exposed from one of outer surfaces of the infrared-sensor filter member, and
at least the part of the second member is exposed from the one of the outer surfaces of the infrared-sensor filter member.

5. The infrared-sensor filter member according to claim 4 , wherein at least the part of the second member is exposed from the outer surface of the infrared-sensor filter member so as to surround the other surface of the optical filter in a plan view.

6. The infrared-sensor filter member according to claim 3 , wherein at least the part of the second member is exposed from an outer side surface of the infrared-sensor filter member.

7. The infrared-sensor filter member according to claim 1 , wherein an emissivity of the first member is equal to or larger than 0.7.

8. The infrared-sensor filter member according to claim 1 , wherein an emissivity of the first member is equal to or smaller than 0.3.

9. The infrared-sensor filter member according to claim 8 , wherein an inner side surface of the side wall of the recess portion is subjected to blackening treatment.

10. An infrared sensor, comprising:
the infrared-sensor filter member according to claim 1 ;
an infrared sensor member including an infrared sensor element; and
a connecting member adopted to connect the infrared-sensor filter member and the infrared sensor member, wherein
the infrared-sensor filter member is disposed on the infrared sensor member such that the recess portion covers a light receiving surface of the infrared sensor element.

11. The infrared sensor according to claim 10 , wherein the infrared sensor member further includes:
a third member with an emissivity equal to or smaller than 0.3; and
a molded member adopted to seal the infrared sensor element and the third member, and wherein
the infrared-sensor filter member is disposed on one of outer surfaces of the infrared sensor member, and
at least a part of the third member is exposed from the one of the outer surfaces of the infrared sensor member.

12. The infrared sensor according to claim 11 , wherein at least the part of the third member is exposed from the one of the outer surfaces of the infrared sensor member in a region outside the infrared-sensor filter member in a plan view.

13. The infrared sensor according to claim 10 , wherein
the light receiving surface of the infrared sensor element is exposed from one of the outer surfaces of the infrared sensor member, and
the light receiving surface of the infrared sensor element is surround by a member with an emissivity equal to or larger than 0.7 on the one of the outer surfaces of the infrared sensor member.

14. An infrared sensor, comprising:
an infrared-sensor filter member including an optical filter for an infrared sensor and a first member having sidewall and bottom surface zones;
an infrared sensor member including an infrared sensor element; and
a recess portion formed between the infrared-sensor filter member and the infrared sensor member, wherein:
side walls of the recess portion are defined by the first member sidewall zones,
at least a part of a top surface of the recess portion is defined by a light receiving surface of the infrared sensor element,
a center portion of a bottom surface of the recess portion is defined by the optical filter, and
a peripheral portion of the bottom surface is defined by the first member bottom surface zones.

Assignees

• Asahi Kasei Microdevices Corp

Inventors

• Fukunaka Toshiaki
• Camargo Edson Gomes
• Nishida Sosuke
• Takagi Yuta

Classifications

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• G01J5/0801

  Means for wavelength selection or discrimination · CPC title

• G01J5/0862

  Physics · mapped topic

• G01J5/045

  Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements (getter arrangements per se H10W76/48, H10P36/03) · CPC title

• H01L31/02325

  Electricity · mapped topic