LED modules with ball joint adjustable support

Patent metadata

Field	Value
Publication number	US-9638382-B2
Application number	US-201314413673-A
Country	US
Kind code	B2
Filing date	Jun 29, 2013
Priority date	Jul 13, 2012
Publication date	May 2, 2017
Grant date	May 2, 2017

Abstract

A modular assembly for a headlight includes at least one semiconductor light module having at least one semiconductor light source mounted on a cooling element, having at least one ball socket in which the semiconductor light module is mounted and configured to be pivoted about a ball socket center, a curved cup formed in the cooling element and configured to be mounted in the ball socket, and a guide shell arranged between the curved cup and the ball socket. A method for adjusting the semiconductor light module is also disclosed.

First claim

The invention claimed is:

1. A modular assembly for a headlight, the assembly comprising:
at least one semiconductor light module having a cooling element and at least one semiconductor light source mounted on the cooling element;
a support frame having at least one ball socket in which the semiconductor light module is mounted and configured to be pivoted about a ball socket center;
a curved cup formed in the cooling element, and configured to be mounted in the at least one ball socket of the support frame; and
a guide shell arranged between the curved cup and the at least one ball socket.

2. The modular assembly according to claim 1 , further comprising:
a transverse rib formed on the guide shell; and
a transverse groove formed in the ball socket, wherein the transverse rib is received in the transverse groove.

3. The modular assembly according to claim 1 wherein further comprising an intermediate guide shell, and at least a screw element and an mounting plate, to fix the curved cup in the ball socket with the intermediate guide shell, wherein the mounting devices comprise at least a screw element and a mounting plate.

4. A vehicle headlight having at least one modular assembly according to claim 1 .

5. The modular assembly according to claim 1 , wherein the curved cup is configured to slide in the guide shell so as to allow the semiconductor light module to be pivoted about a Y axis located transverse to an X axis defined along the main light emission direction of the at least one semiconductor light source.

6. The modular assembly according to claim 5 , wherein the guide shell is configured in the ball socket so as to allow the semiconductor light module to be pivoted about a Z axis orthogonal to both the X and Y axes.

7. The modular assembly according to claim 5 , further comprising:
a guiding rib formed on the curved cup; and
a guiding groove formed in the guide shell,
wherein the guiding rib is received in the guiding groove to guide the pivoting movement of the semiconductor light module about the Y axis.

8. The modular assembly according to claim 7 , further comprising:
a pin formed on the curved cup, and extending through the guiding groove, the through-groove of the ball socket, and out of the rear surface of the ball socket of the support frame.

Assignees

• Hella Kgaa Hueck & Co

Inventors

• Pawliczek Gerhard
• Thanapaul Thomas Richesh

Classifications

• F21S45/48

  with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device · CPC title

• F21S41/151

  arranged in one or more lines · CPC title

• F21S41/141

  Light emitting diodes [LED] · CPC title

• Y10T29/49826

  Assembling or joining · CPC title

• F21S41/192

  Details of lamp holders, terminals or connectors · CPC title