Resin composition, resin film, and semiconductor device and method for manufacturing same
US-2017009022-A1 · Jan 12, 2017 · US
US9637586B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9637586-B2 |
| Application number | US-201514620780-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 12, 2015 |
| Priority date | Feb 12, 2015 |
| Publication date | May 2, 2017 |
| Grant date | May 2, 2017 |
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The present invention provided a high temperature resistant epoxy resins for producing hollow fiber membrane modules for high temperature gas separation applications such as for natural gas upgrading and hydrogen purifications. This invention also relates to a hollow fiber membrane module comprising a bundle of multiple high performance hollow fiber membranes and a tube sheet formed by a high temperature resistant cured epoxy resin that is used to fix and bound said bundle of multiple high performance hollow fiber membranes. The invention also provides a process for separating at least one gas from a mixture of gases using the hollow fiber membrane modules comprising a bundle of multiple high performance hollow fiber membranes and a tube sheet formed by a high temperature resistant cured epoxy resin that is used to fix and bound said bundle of multiple high performance hollow fiber membranes.
Opening claim text (preview).
The invention claimed is: 1. An epoxy resin comprising an aromatic epoxy, a diluent, and an aromatic diamine, wherein said aromatic epoxy is represented by formula (I): wherein n is a positive integer from 1 to 10; wherein said diluent is selected from the group consisting of an epoxy represented by formula (II), an epoxy represented by formula (III), and a mixture thereof; wherein m is a positive integer from 2 to 10; and wherein said aromatic diamine is represented by formula (IV): wherein the weight ratio of said aromatic epoxy to said diluent is in a range of about 10:1 to 35:1. 2. The epoxy resin of claim 1 wherein the weight ratio of said aromatic epoxy to said diuent is in a range of about 15:1 to 25:1. 3. The epoxy resin of claim 1 wherein the weight ratio of said aromatic epoxy to said aromatic diamine is in a range of about 3:1 to 15:1. 4. The epoxy resin of claim 1 wherein the weight ratio of said aromatic epoxy to said aromatic diamine is in a range of about 4:1 to 10:1. 5. The epoxy resin of claim 1 wherein said aromatic epoxy is represented by a formula (Ia): 6. The epoxy resin of claim 1 wherien said dilutent is represented by a formula (IIa): 7. A hollow fiber membrane module comprising an epoxy resin prepared from comprising an aromatic epoxy, a diluent, and an aromatic diamine, wherein said aromatic epoxy is represented by formula (I): wherein n is a positive integer from 1 to 10; wherein said diluent is selected from the group consisting of an epoxy represented by formula (II), an epoxy represented by formula (III), and a mixture thereof; wherein m is a positive integer from 2 to 10; and wherein said aromatic diamine is represented by formula (IV): wherein the weight ratio of said aromatic epoxy to said diluent is in a range of about 10:1 to 35:1. 8. A process for separating at least one gas from a mixture of gases using hollow fiber membrane modules comprising a bundle of multiple high performance hollow fiber membranes and a tube sheet formed by a high temperature resistant cured epoxy resin wherein said high temperature resistant cured epoxy resin is used to fix and bound said bundle of multiple high performance hollow fiber membranes, the process comprising: (a) providing the hollow fiber membrane module comprising a bundle of multiple high performance hollow fiber membranes which are permeable to said at least one gas and a tube sheet formed by the high temperature resistant cured epoxy resin comprising an aromatic epoxy, a diluent, and an aromatic diamine, wherein said aromatic epoxy is represented by formula (I): wherein n is a positive integer from 1 to 10; wherein said diluent is selected from the group consisting of an epoxy represented by formula (II), an epoxy represented by formula (III), and a mixture thereof; wherein m is a positive integer from 2 to 10; and wherein said aromatic diamine is represented by formula (IV): wherein the weight ratio of said aromatic epoxy to said diluent is in a range of about 10:1 to 35:1 and that is used to fix and bound said bundle of multiple high performance hollow fiber membranes; (b) contacting the mixture on one side of said hollow fiber membrane module to cause said at least one gas to permeate said hollow fiber membranes; and (c) removing from the opposite side of said hollow fiber membrane module a permeate gas composition comprising a portion of said at least one gas which permeated said hollow fiber membranes. 9. The process of claim 8 wherein said aromatic epoxy is represented by a formula (Ia): 10. The process of claim 8 wherien said dilutent is represented by a formula (IIa): 11. The process of claim 8 wherein said mixture of gases comprises carbon dioxide or hydrogen sulfide in natural gas. 12. The process of claim 8 wherein said mixture of gases comprises at least one volatile organic gas in air. 13. The process of claim 8 wherein said mixture of gases comprises hydrogen, nitrogen, methane and argon in ammonia purge gas streams. 14. The process of claim 8 wherein said mixture of gases comprises hydrogen in gases from a refinery. 15. The process of claim 8 wherein said mixture of gases comprises a mixture of olefins and paraffins or iso paraffins and normal paraffins. 16. The process of claim 8 wherein said mixture of gases comprises a mixture of a at least two gases selected from the group consisting of nitrogen and oxygen, carbon dioxide and methane, hydrogen and methane or carbon monoxide, or helium and methane. 17. The process of claim 8 wherein the mixture of gases comprises at least two gases selected from the group consisting of carbon dioxide, oxygen, nitrogen, water vapor, hydrogen sulfide, helium, and other trace gases.
characterised by specific membranes · CPC title
Encapsulating materials · CPC title
aromatic · CPC title
with hollow fibres · CPC title
Polycondensates containing more than one epoxy group per molecule · CPC title
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