Method and apparatus for molding metal laminate film

US9636731B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9636731-B2
Application numberUS-201213687793-A
CountryUS
Kind codeB2
Filing dateNov 28, 2012
Priority dateMar 13, 2012
Publication dateMay 2, 2017
Grant dateMay 2, 2017

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A punch ( 2 ) and a pad ( 5 ) are opposed to each other such that a molded portion ( 3 a ) of a metal laminate film ( 3 ) to be processed is interposed between the punch ( 2 ) and the pad ( 5 ). An enclosed space ( 6, 7 ) is compressed to raise only the temperature of the molded portion ( 3 a ) while keeping the vicinity of the molded portion ( 3 a ) at a low temperature (S 1 , S 2 ). After that, the enclosed space ( 6, 7 ) is moved with respect to the molded portion ( 3 a ) to perform first molding (S 3 ) on the molded portion ( 3 a ), and then gas in the enclosed space ( 6 ) is released to perform second molding (S 4 ) on the molded portion ( 3 a ) by means of the punch ( 2 ) and the pad ( 5 ).

First claim

Opening claim text (preview).

What is claimed is: 1. A method for molding a metal laminate film, comprising the steps of: raising a temperature of a molded portion of the metal laminate film to be processed, by moving a punch of a cope to a pad inside a die of a drag to compress gas in a first enclosed space defined by the punch, an inner surface of a plate provided around the punch and the molded portion with an area, of the metal laminate film, surrounding the molded portion interposed between the plate and the die; first molding including primary molding on the molded portion, the primary molding including the step of moving the punch to the pad to press the gas in the first enclosed space while partially pressing the pad, which has been pressed upward close to the punch by a spring, by means of an end of a pin to move the pad against an urging force of the spring, the pin being connected to the cope at a proximal end of the pin, the primary molding being completed when the pad reaching a molding depth is stopped at a bottom dead center by an action of a cam mechanism; and second molding performed on the molded portion by further moving the punch to the pad while releasing the gas from the first enclosed space to mold the molded portion by means of the punch, the die, and the pad.

Assignees

Inventors

Classifications

  • B21D5/16Primary

    Folding; Pleating · CPC title

  • Making containers by moulding of a thermoplastic material · CPC title

  • Means for controlling fluid parameters, e.g. pressure or temperature · CPC title

  • characterised by the material of the blanks · CPC title

  • B21D11/18Primary

    Joggling · CPC title

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Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9636731B2 cover?
A punch ( 2 ) and a pad ( 5 ) are opposed to each other such that a molded portion ( 3 a ) of a metal laminate film ( 3 ) to be processed is interposed between the punch ( 2 ) and the pad ( 5 ). An enclosed space ( 6, 7 ) is compressed to raise only the temperature of the molded portion ( 3 a ) while keeping the vicinity of the molded portion ( 3 a ) at a low temperature (S 1 , S 2 ). Aft…
Who is the assignee on this patent?
Panasonic Corp, Panasonic Ip Man Co Ltd
What technology area does this patent fall under?
Primary CPC classification B21D5/16. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 02 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).