High-density, fail-in-place switches for computer and data networks

Patent metadata

Field	Value
Publication number	US-9634959-B2
Application number	US-201414548345-A
Country	US
Kind code	B2
Filing date	Nov 20, 2014
Priority date	Apr 8, 2014
Publication date	Apr 25, 2017
Grant date	Apr 25, 2017

Abstract

A structure for a network switch. The network switch may include a plurality of spine chips arranged on a plurality of spine cards, where one or more spine chips are located on each spine card; and a plurality of leaf chips arranged on a plurality of leaf cards, wherein one or more leaf chips are located on each leaf card, where each spine card is connected to every leaf chip and the plurality of spine chips are surrounded on at least two sides by leaf cards.

First claim

What is claimed is:

1. A network switch comprising: a plurality of spine cards each comprising a liquid cooling plate in direct contact with one or more spine chips, the plurality of spine cards are stacked vertically one on top of another and separated by a predetermined space; a plurality of leaf cards each comprising one or more leaf chips in direct contact with a heat sink, the plurality of leaf cards are perpendicular to and circumferentially arrayed around the stack of spine cards, the leaf chips of each leaf card are electrically connected to the spine chips of each spine card; an inlet air plenum arranged directly below the stack of spine cards to direct an air flow across the heat sinks of the leaf cards in a direction perpendicular to the spine cards; an outlet air plenum for receiving the air flow from across the leaf cards; a supply piping connecting each liquid cooling plate to a heat exchanger via a supply manifold, wherein the supply piping is routed through a space between adjacent leaf cards at a first corner of the stack of spine cards; and a return piping connecting each liquid cooling plate to the heat exchanger via a return manifold, wherein the return piping is routed through a space between adjacent leaf cards at a second corner of the stack of spine cards.

2. The structure of claim 1 , wherein each leaf card is removably coupled to all of the spine cards.

3. The structure of claim 1 , wherein an orthogonal connector connects all the spine cards to each of the leaf cards.

4. The structure of claim 1 , wherein the leaf cards surround the stack of spine cards on all four sides, and all the leaf cards along each side of the stack of spine cards are separated from each other by a space at all four corners of the stack of spine cards.

5. The structure according to claim 1 , further comprising: lower card guide plate comprising perforations and guiding features corresponding with each of the plurality of leaf cards, the lower guide plate being positioned between the stack of spine cards and the air inlet plenum; and upper card guide plate comprising perforations and guiding features corresponding with each of the plurality of leaf cards, the upper guide plate being positioned between the stack of spine cards and the air outlet plenum.

Assignees

• IBM

Inventors

• Coteus Paul W
• Doany Fuad E
• Hall Shawn A
• Schultz Mark D
• Takken Todd E
• Tian Shurong

Classifications

• H05K7/20572

  within cabinets for removing heat from sub-racks, e.g. plenum · CPC title

• H05K7/20509

  Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures · CPC title

• H05K7/20254

  Cold plates transferring heat from heat source to coolant · CPC title

• H05K7/20309

  Evaporators · CPC title

• H05K7/20763

  Liquid cooling without phase change · CPC title