RFID transponder chip modules

Patent metadata

Field	Value
Publication number	US-9634391-B2
Application number	US-201514619170-A
Country	US
Kind code	B2
Filing date	Feb 11, 2015
Priority date	Aug 8, 2011
Publication date	Apr 25, 2017
Grant date	Apr 25, 2017

Abstract

The planar antenna (PA) of a transponder chip module (TCM) may have a U-shaped portion so that an outer end (OE) of the antenna may be positioned close to an RFID chip (IC) disposed at a central area of a module tape (MT) for the transponder chip module. A module tape (MT 2 ) may have contact pads (CP) on one side thereof and a connection bridge (CBR) on another side thereof, and may be joined with a module tape (MT 1 ) having a planar antenna (PA). Metal of a conductive layer (CL) within a conductive element such as a coupling frame (CF) or a planar antenna (PA) may be scribed to have many small segments. A metal sheet may be stamped to have contact side metallization, and joined with a module tape (MT) having a planar antenna (PA).

First claim

What is claimed is:

1. A transponder chip module (TCM) comprising:
a first module tape (MT 1 ) comprising a first substrate having two opposite top and bottom surfaces and having an antenna structure (AS) disposed on the bottom surface thereof; and
a second module tape (MT 2 ) comprising a second substrate having two opposite top and bottom surfaces and having contact pads (CP) disposed on the top surface thereof and a connection bridge (CBR) on the bottom surface thereof;
wherein the second module tape (MT 2 ) is joined to the first module tape (MT 1 );
wherein the top of the first module tape (MT 1 ) is joined to the bottom of the second module tape (MT 2 ).

2. The transponder chip module of claim 1 , further comprising:
conductive elements extending through the second module tape and aligned with at least some of the contact pads.

3. The transponder chip module of claim 2 , further comprising:
through holes (TH) extending through the first module tape and aligned with the conductive elements extending through the second module tape.

4. The transponder chip module of claim 1 , further comprising:
through holes (TH) extending through the first module tape and aligned with outer and inner portions of the connection bridge.

5. The transponder chip module of claim 1 , further comprising:
an RFID chip (IC) disposed through an opening (OP) extending through the first module tape allowing mounting of the RFID chip on the second module tape.

6. A method of making a transponder chip module (TCM) comprising:
providing a first module tape (MT 1 ) comprising a first substrate having two opposite top and bottom surfaces and having an antenna structure (AS) disposed on the bottom surface thereof;
providing a second module tape (MT 2 ) comprising a second substrate having two opposite top and bottom surfaces and having contact pads (CP) disposed on the top surface thereof and a connection bridge (CBR) on the bottom surface thereof; and
joining the second module tape (MT 2 ) to the first module tape (MT 1 );
wherein the top of the first module tape (MT 1 ) is joined to the bottom of the second module tape (MT 2 ).

7. The method of claim 6 , further comprising:
providing conductive elements extending through the second module tape and aligned with at least some of the contact pads.

8. The method of claim of claim 7 , further comprising:
providing through holes (TH) extending through the first module tape and aligned with the conductive elements extending through the second module tape.

9. The method of claim of claim 6 , further comprising:
providing through holes (TH) extending through the first module tape (MT 1 ) and aligned with outer and inner portions of the connection bridge.

10. The method of claim 6 , further comprising:
providing an opening (OP) extending through the first module tape allowing mounting of an RFID chip (IC) on the second module tape.

Assignees

• Finn David
• Lotya Mustafa
• Molloy Darren
• Féinics Amatech Teoranta

Inventors

• Finn David
• Lotya Mustafa
• Molloy Darren

Classifications

• H01Q7/00 Primary

  Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop · CPC title

• G06K19/07754

  the connection being galvanic · CPC title

• G06K19/07794

  the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit · CPC title

• G06K19/07747

  at least one of the integrated circuit chips being mounted as a module · CPC title

• G06K19/07722

  the record carrier being multilayered, e.g. laminated sheets (flat articles in general, see B32B37/00) · CPC title