Method for manufacturing liquid ejecting head

Patent metadata

Field	Value
Publication number	US-9634235-B2
Application number	US-201414222002-A
Country	US
Kind code	B2
Filing date	Mar 21, 2014
Priority date	Mar 26, 2013
Publication date	Apr 25, 2017
Grant date	Apr 25, 2017

Abstract

A method for manufacturing a liquid ejecting head including a laminate formed of a flow path substrate having a flow path communicating with nozzle openings that eject a liquid, a first electrode, a piezoelectric layer, and a second electrode, the method including stacking the first electrode, the piezoelectric material, the second electrode, and a reinforcing member on top of one another to form a laminate; heating the laminate to form a piezoelectric layer made of the piezoelectric material; bonding the laminate to the flow path substrate on a first electrode side; and removing the reinforcing member.

First claim

What is claimed is:

1. A method for manufacturing a liquid ejecting head including a laminate formed on a flow path substrate having a flow path communicating with nozzle openings that eject a liquid, the laminate including a first electrode, a piezoelectric material layer, and a second electrode, the method comprising:
forming the laminate, wherein a piezoelectric material is formed on the first electrode, the second electrode is formed on the piezoelectric material, and a reinforcing member is formed directly on the second electrode,
heating the laminate to form the piezoelectric material layer made of piezoelectric material,
bonding the laminate to the flow path substrate on a first electrode side, and
removing the reinforcing member,
wherein in the removing of the reinforcing member, the reinforcing member in a predetermined region excluding a connection region is partially removed to leave the reinforcing member having a predetermined thickness; at least part of the reinforcing member and at least part of the second electrode in the connection region are removed to form a through hole, and an electrically conductive material is disposed in the through hole to form an electric conductor.

2. A method for manufacturing a liquid ejecting head including a laminate formed on a flow path substrate having a flow path communicating with nozzle openings that eject a liquid, the laminate including a first electrode, a piezoelectric material layer, and a second electrode, the method comprising:
forming the laminate, wherein a piezoelectric material is formed on the first electrode, the second electrode is formed on the piezoelectric material, and a reinforcing member is formed directly on the second electrode,
heating the laminate to form the piezoelectric material layer made of piezoelectric material,
bonding the laminate to the flow path substrate on a first electrode side, and
removing the reinforcing member,
wherein the reinforcing member is formed of the same material as that used for the second electrode.

3. The method for manufacturing a liquid ejecting head according to claim 1 , wherein the connection region is a region in which the first electrode is not disposed.

4. The method for manufacturing a liquid ejecting head according to claim 1 , wherein in the bonding of the laminate, the flow path substrate is bonded to the laminate with a vibration plate being interposed between the flow path substrate and the laminate.

5. The method for manufacturing a liquid ejecting head according to claim 1 , wherein the reinforcing member is formed of the same material as that used for the second electrode.

6. The method for manufacturing a liquid ejecting head according to claim 1 , wherein the reinforcing member is formed of the same material as that used for the piezoelectric material.

7. The method for manufacturing a liquid ejecting head according to claim 2 , wherein in the bonding of the laminate, the flow path substrate is bonded to the laminate with a vibration plate being interposed between the flow path substrate and the laminate.

Assignees

• Seiko Epson Corp

Inventors

• Zhang Junhua

Classifications

• H01L41/273

  Electricity · mapped topic

• C04B2237/62

  Forming laminates or joined articles comprising holes, channels or other types of openings · CPC title

• C04B37/003

  by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts · CPC title

• B41J2002/14491

  Electrical connection · CPC title

• B41J2/161 Primary

  of film type, deformed by bending and disposed on a diaphragm · CPC title