Optoelectronic component and method for producing same
US-12176444-B2 · Dec 24, 2024 · US
Semiconductor component and method of producing a semiconductor component
US9634207B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9634207-B2 |
| Application number | US-201615146984-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 5, 2016 |
| Priority date | Jun 22, 2010 |
| Publication date | Apr 25, 2017 |
| Grant date | Apr 25, 2017 |
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- Title
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- Abstract
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Abstract
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A method of producing a semiconductor component includes providing an optoelectronic semiconductor chip; applying a molding compound for an optical element, wherein the molding compound is based on a highly refractive polymer material; precuring the molding compound at a temperature of at most 50° C.; and curing the molding compound.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of producing a semiconductor component comprising: a) providing an optoelectronic semiconductor chip; b) applying a molding compound for an optical element, wherein the molding compound is based on a highly refractive polymer material; c) precuring the molding compound at a temperature of at most 50° C.; and d) curing the molding compound. 2. The method according to claim 1 , wherein the precuring is induced by electromagnetic radiation. 3. The method according to claim 2 , wherein the molding compound is exposed to radiation with an energy input of 0.2 J/cm 2 to 2.0 J/cm 2 in step c). 4. The method according to claim 1 , wherein the molding compound is activated by mixing at least two components of the molding compound in step c). 5. The method according to claim 1 , wherein step d) is carried out at a higher temperature than step c). 6. The method according to claim 1 , wherein thermal curing is carried out in step d).
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Frequently asked questions
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- What does patent US9634207B2 cover?
- A method of producing a semiconductor component includes providing an optoelectronic semiconductor chip; applying a molding compound for an optical element, wherein the molding compound is based on a highly refractive polymer material; precuring the molding compound at a temperature of at most 50° C.; and curing the molding compound.
- Who is the assignee on this patent?
- Osram Opto Semiconductors Gmbh
- What technology area does this patent fall under?
- Primary CPC classification H10H20/855. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 25 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).