Inertial sensor with nested seismic masses and method for manufacturing such a sensor

Patent metadata

Field	Value
Publication number	US-9631929-B2
Application number	US-201415037532-A
Country	US
Kind code	B2
Filing date	Oct 21, 2014
Priority date	Nov 20, 2013
Publication date	Apr 25, 2017
Grant date	Apr 25, 2017

Abstract

An inertial sensor comprising a frame to which at least two seismic bodies are connected by resilient means so as to be movable in a suspension plane, and transducers to keep the seismic bodies vibrating and to determine a relative movement of the seismic bodies relative to one another, characterized in that the seismic bodies have a single shape and a single mass, and in that the seismic bodies comprise interlocking parts such that the seismic bodies are nested inside one another while being movable in the suspension plane relative to the other of the seismic bodies, with the seismic bodies having centers of gravity that coincide with one another. A method for manufacturing such a sensor.

First claim

The invention claimed is:

1. An inertial sensor, comprising:
at least two seismic bodies;
a frame to which the at least two seismic bodies are connected by resilient means so as to be movable in a suspension plane; and
transducers to keep the seismic bodies vibrating and to determine a relative movement of the seismic bodies relative to one another,
wherein the seismic bodies have a single shape and a single mass, the seismic bodies comprising interlocking parts such that the seismic bodies are nested inside one another while being movable in the suspension plane relative to the other of the seismic bodies, with the seismic bodies having centers of gravity that coincide with one another.

2. The sensor according to claim 1 , wherein each seismic body comprises two parallelepiped wings which extend parallel with one another and are connected together by a parallelepiped central core which extends back from the wings, with the seismic bodies being oriented at 90° with respect to one another about an axis normal to the suspension plane and at 180° about an axis of the suspension plane, so that the core of each seismic body extends opposite the core and between the wings of the other of the seismic bodies and that the wings of each seismic body has end portions which extend in the same plane as the core and opposite end portions of the wings of the other of the seismic bodies.

3. The sensor according to claim 2 , wherein each wing has a mass equal to half the mass of the core.

4. The sensor according to claim 1 , wherein the seismic bodies are connected by first resilient means to a support framework connected to the frame by second resilient means to form a first suspension stage and a second suspension stage.

5. The sensor according to claim 1 , wherein the transducers extend between the seismic bodies.

6. The sensor according to claim 2 , wherein the seismic bodies are made of a semi-conductor material and an electrically insulating layer extends between the wings and the core so as to electrically insulate the wings from the core.

7. The sensor according to claim 6 , wherein the semi-conductor material is silicon and the insulating layer is made of silicon dioxide.

8. The sensor according to claim 6 , wherein the sensor is of the MEMS type.

9. A method for manufacturing a sensor according to claim 8 , comprising the step of etching the sensor into a wafer comprising at least one electrically insulating layer between two layers of semi-conductor material so that the electrically insulating layer extends between the wings and the core of each seismic body.

Assignees

• Safran Electronics & Defense

Inventors

• Jeanroy Alain
• Onfroy Philippe

Classifications

• B81B3/0021

  Transducers for transforming electrical into mechanical energy or vice versa (dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00) · CPC title

• B81B2201/0242

  Gyroscopes · CPC title

• G01C19/5769

  Manufacturing; Mounting; Housings · CPC title

• G01C19/5733

  Structural details or topology · CPC title

• B81B2201/0271

  Resonators; ultrasonic resonators · CPC title