Copper alloy sheets for electrical/electronic part

Patent metadata

Field	Value
Publication number	US-9631260-B2
Application number	US-37415407-A
Country	US
Kind code	B2
Filing date	Jun 20, 2007
Priority date	Jul 21, 2006
Publication date	Apr 25, 2017
Grant date	Apr 25, 2017

Abstract

A shear plane ratio is reduced by a dislocation density in which a value obtained by dividing the half-value width p of the intensity of diffraction of {311} plane in the surface of a Cu—Fe—P alloy sheet, by its peak height H, is 0.015 or more. In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which a ratio (I (200) /I (220)) of intensity of diffraction of (1 (200)) from the (200) plane in the sheet surface to intensity of diffraction of (I (220)) from the (220) plane, is 0.3 or less. In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which the orientation distribution density of Brass orientation measured by the crystal orientation analysis method using an EBSP by an FE-SEM, is 25% or more; and an average grain size in the sheet is 6.0 μm or less.

First claim

The invention claimed is:

1. A copper alloy sheet, comprising:
Cu;
inevitable impurities;
from more than 0.04 to 0.50 mass % Fe;
at most 0.003 mass % Mg; and
from 0.01 to 0.15 mass % P,
wherein the copper alloy sheet has an improved stampability which is provided by a microstructure in which a value obtained by dividing the half-value-width of the intensity of diffraction of {311} plane in a surface of the sheet, by its peak height, is 0.015 or more.

2. The copper alloy sheet according to claim 1 , further comprising:
from 0.005 to 5.0 mass % Sn.

3. A copper alloy sheet, comprising:
Cu;
inevitable impurities;
from more than 0.04 to 0.50 mass % Fe;
at most 0.003 mass % Mg; and
from 0.01 to 0.15 mass % P,
wherein the copper alloy sheet has an improved softening resistance which is provided by a microstructure in which a ratio (I(200)/I(220)) of the intensity (I(200)) of diffraction of the (200) plane in a surface of the sheet, to the intensity (I(220)) of diffraction of the (220) plane, is 0.3 or less.

4. The copper alloy sheet according to claim 3 , further comprising:
from 0.005 to 5.0 mass % Sn.

5. A copper alloy sheet, comprising:
Cu;
inevitable impurities;
from more than 0.04 to 0.50 mass % Fe;
at most 0.003 mass % Mg; and
from 0.01 to 0.15 mass % P,
wherein the copper alloy sheet has an improved resistance of peel off of an oxidation film which is provided by a texture in which two crystals adjacent to each other having an orientation difference between them of 15° or less are viewed that they are located in the same crystal plane, an orientation distribution density from Brass orientation measured by crystal orientation analysis with an Electron Backscatter Diffraction Pattern (EBSP) obtained by an Field Emission Scanning Electron Microscope (FE-SEM), is 25% or more.

6. The copper alloy sheet according to claim 5 , wherein an average grain size of a copper alloy of the copper sheet is 6.0 μm or less.

7. The copper alloy sheet according to claim 6 , further comprising:
from 0.005 to 5.0 mass % Sn.

8. The copper alloy sheet according claim 1 , wherein the copper alloy sheet has a tensile strength of 500 MPa or more and a hardness of 150 Hv or more.

9. The copper alloy sheet according to claim 1 , further comprising at least one member selected from the group consisting of A, B, C, and D:
A: a total content of 0.0001 to 1.0 mass % of one or more elements selected from the group consisting of Mn, and Ca;
B: a total content of 0.001 to 1.0 mass % of one or more elements selected from the group consisting of Zr, Ag, Cr, Cd, Be, Ti, Co, Ni, Au, and Pt;
C: comprising a total content of 0.0001 to 1.0 mass % of one or more elements selected from Mn, Mg, and Ca, and a total content of 0.001 to 1.0 mass % of one or more elements selected from the group consisting of Zr, Ag, Cr, Cd, Be, Ti, Co, Ni, Au, and Pt, respectively, wherein the total content of these elements is 1.0 mass % or less; and
D: a total content of 0.1 mass % or less of Hf, Th, Li, Na, K, Sr, Pd, W, S, Si, C, Nb, Al, V, Y, Mo, Pb, In, Ga, Ge, As, Sb, Bi, Te, B, and misch metal.

10. The copper alloy sheet according to claim 3 , wherein the copper alloy sheet has a tensile strength of 500 MPa or more and a hardness of 150 Hv or more.

11. The copper sheet according to claim 3 , further comprising at least one member selected from the group consisting of A, B, C, and D:
A: a total content of 0.00001 to 1.0 mass % of one or more elements selected from the group consisting of Mn, and Ca;
B: a total content of 0.001 to 1.0 mass % of one or more elements selected from the group consisting of Zr, Ag, Cr, Cd, Be, Ti, Co, Ni, Au, and Pt;
C: comprising a total content of 0.0001 to 1.0 mass % of one or more elements selected from the group consisting of Mn, Mg, and Ca, and a total content of 0.001 to 1.0 mass % of one or more elements selected from the group consisting of Zr, Ag, Cr, Cd, Be, Ti, Co, Ni, Au and Pt, respectively, wherein the total content of these elements is 1.0 mass % or less; and
D: a total content of 0.1 mass % or less of Hf, Th, Li, Na, K, Sr, Pd, W, S, Si, C, Nb, Al, V, Y, Mo, Pb, In, Ga, Ge, As, Sb, Bi, Te, B, and misch metal.

12. The copper alloy sheet according to claim 5 , wherein the copper alloy sheet has a tensile strength of 500 MPa or more and a hardness of 150 Hv or more.

13. The copper alloy sheet according to claim 5 , further comprising at least one member selected from the group consisting of A, B, C, and D:
A: a total content of 0.0001 to 1.0 mass % of one or more elements selected from the group consisting of Mn, and Ca;
B: a total content of 0.001 to 1.0 mass % of one or more elements selected from the group consisting of Zr, Ag, Cr, Cd, Be, Ti, Co, Ni, Au, and Pt;
C: comprising a total content of 0.0001 to 1.0 mass % of one or more elements selected from the group consisting of Mn, Mg, and Ca, and a total content of 0.001 to 1.0 mass % of one or more elements selected from the group consisting of Zr, Ag, Cr, Cd, Be, Ti, Co, Ni, Au, and Pt, respectively, wherein the total content of these elements is 1.0 mass % or less; and
D: a total content of 0.1 mass % or less of Hf, Th, Li, Na, K, Sr, Pd, W, S, Si, C, Nb, Al, V, Y, Mo, Pb, In, Ga, Ge, As, Sb, Bi, Te, B, and misch metal.

14. The copper alloy sheet according to claim 1 , further comprising:
from 0.005 to 3.0 mass % Zn.

15. The copper alloy sheet according to claim 2 , further comprising:
from 0.005 to 3.0 mass % Zn.

16. The copper alloy sheet according to claim 3 , further comprising:
from 0.005 to 3.0 mass % Zn.

17. The copper alloy sheet according to claim 4 , further comprising:
from 0.005 to 3.0 mass % Zn.

18. The copper alloy sheet according to claim 5 , further comprising:
from 0.005 to 3.0 mass % Zn.

19. The copper alloy sheet according to claim 7 , further comprising:
from 0.005 to 3.0 mass % Zn.

20. The copper alloy sheet according to claim 3 , wherein the copper alloy sheet has an improved softening resistance which is provided by a microstructure in which a ratio(I(200)/I(220)) of the intensity (I(200)) of diffraction of the (200) plane in a surface of the sheet, to the intensity (I(220)) of diffraction of the (220) plane, is 0.25 or less.

21. The copper alloy sheet according to claim 1 , comprising from 0.05 to 0.50 mass % of Fe.

22. The copper alloy sheet according to claim 3 , comprising from 0.05 to 0.50 mass % of Fe.

23. The copper alloy sheet according to claim 5 , comprising from 0.05 to 0.50 mass % of Fe.

24. The copper alloy sheet according to claim 1 , wherein the copper alloy sheet has an improved stampability which is provided by a microstructure in which a value obtained by dividing the half-value-width of the intensity of diffraction of {311} plane in a surface of the sheet, by its peak height, is 0.015 or more after final cold-rolling with a roll having a small diameter of less than 80 mmφ; a minimum reduction ratio per one pass(cold-rolling ratio, processing ratio) of 20% or more; a roll having a length of 500 mm or more, or a combination thereof.

25. The copper alloy sheet according to claim 1 , which is produced by a process comprising final cold-rolling with a roll having a small diameter of less than 80 mmφ; a minimum reduction ratio per one pass (cold-rolling ratio, processing ratio) of 20% or more; a roll having a length of 500 mm or more, or a combination thereof.

Assignees

• Aruga Yasuhiro
• Ozaki Ryoichi
• Miwa Yosuke
• Kobe Steel Ltd

Inventors

• Aruga Yasuhiro
• Ozaki Ryoichi
• Miwa Yosuke

Classifications

• C22C9/00 Primary

  Alloys based on copper · CPC title

• C22C9/04

  with zinc as the next major constituent · CPC title

• C22F1/08

  of copper or alloys based thereon · CPC title

• C22C9/02

  with tin as the next major constituent · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title