Open cavity plastic package

Patent metadata

Field	Value
Publication number	US-9630352-B2
Application number	US-201615050438-A
Country	US
Kind code	B2
Filing date	Feb 22, 2016
Priority date	Jan 23, 2013
Publication date	Apr 25, 2017
Grant date	Apr 25, 2017

Abstract

A method for manufacturing open cavity integrated circuit packages, the method comprising: placing a wire-bound integrated circuit in a mold; forcing a pin to contact a die of the wire-bound integrated circuit by applying a force between the pin and the mold; injecting plastic into the mold; allowing the plastic to set around the integrated circuit to form a package having an open cavity defined by the pin; and removing the open cavity integrated circuit package from the mold. A mold for forming a package for an integrated circuit sensor device, comprising: a bottom part for supporting an integrated circuit die; a top part that is operable to be placed on top of said bottom part to form a cavity into which a plastic material can be injected to form the package, wherein the top part of the mold comprises a spring-loaded pin arrangement comprising a cover that covers a sensor area on the integrated circuit die and provides for an opening when the plastic material is injected.

First claim

The invention claimed is:

1. A mold for forming a package for an integrated circuit sensor device, comprising
a bottom part for supporting an integrated circuit die;
a top part that is operable to be placed on top of said bottom part to form a cavity into which a plastic material can be injected to form the package, wherein the top part of the mold comprises a spring-loaded pin arrangement comprising a pin extending from a cylindrical cover and being guided within a spring housing wherein the pin can be vertically moved against a spring force, wherein the cylindrical cover has a conical recess that is operable to cover a sensor area on the integrated circuit die and wherein the top part provides for an opening through which the plastic material can be injected.

2. The mold according to claim 1 , wherein the cylindrical cover comprises an annular contact face.

3. The mold according to claim 2 , wherein an outside diameter of the cylindrical cover is about 1.2 mm.

4. The mold according to claim 3 , wherein an inside diameter of the cylindrical cover is about 1 mm.

5. The mold according to claim 1 , wherein the cylindrical cover is made from high temperature plastic material.

6. The mold according to claim 1 , wherein the pin can extend about 4 to 5 mm from the spring housing.

7. The mold according to claim 6 , wherein the spring provides for a spring force of about 80-120 g.

8. A top mold comprising a plurality of spring-loaded pin arrangements, each spring-loaded pin arrangement comprising a pin extending from a cylindrical cover and being guided within an associated spring housing wherein the pin can be vertically moved against a spring force, wherein each cylindrical cover has a conical recess that is operable to covers a sensor area on the integrated circuit die; and wherein the top mold provides for an opening through which the plastic material can be injected into a mold formed by placing the top mold on a bottom mold.

9. The top mold according to claim 8 , wherein each cylindrical cover comprises an annular contact face.

10. The top mold according to claim 9 , wherein an outside diameter of each cylindrical cover is about 1.2 mm.

11. The top mold according to claim 10 , wherein an inside diameter of each cylindrical cover is about 1 mm.

12. The top mold according to claim 8 , wherein each cylindrical cover is made from high temperature plastic material.

13. The top mold according to claim 8 , wherein the pin can extend about 4 to 5 mm from the spring housing.

14. The top mold according to claim 13 , wherein the spring provides for a spring force of about 80-120 g.

15. A mold for forming a package for an integrated circuit sensor device, comprising
a bottom part for supporting an integrated circuit die;
a top part that is operable to be placed on top of said bottom part to form a cavity into which a plastic material can be injected to form the package, wherein the top part of the mold comprises a spring-loaded pin arrangement comprising a pin extending from a cover and being guided within a spring housing wherein the pin can be vertically moved against a spring force, wherein the cover has a recess that is operable to cover a sensor area on the integrated circuit die and wherein the top part provides for an opening through which the plastic material can be injected.

16. The mold according to claim 15 , wherein the cover comprises an annular contact face.

17. The mold according to claim 16 , wherein an outside diameter of the cover is about 1.2 mm and an inside diameter of the cover is about 1 mm.

18. The mold according to claim 15 , wherein the cover is made from high temperature plastic material.

19. The mold according to claim 15 , wherein the pin can extend about 4 to 5 mm from the spring housing.

20. The mold according to claim 19 , wherein the spring provides for a spring force of about 80-120 g.

Assignees

• Microchip Tech Inc

Inventors

• Fernandez Joseph D
• Kittiphinijnanta Sombat
• Yamputchong Nutthiwut
• Lertruttanaprecha Surachai
• Maikuthavorn Viwat

Classifications

• H10P72/0438

  Apparatus for making assemblies not otherwise provided for, e.g. package constructions · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W42/00

  Arrangements for protection of devices (arrangements for thermal protection H10W40/00) · CPC title