Thermally actuated printed circuit board retainers

Patent metadata

Field	Value
Publication number	US-9629232-B2
Application number	US-201313897336-A
Country	US
Kind code	B2
Filing date	May 17, 2013
Priority date	May 17, 2012
Publication date	Apr 18, 2017
Grant date	Apr 18, 2017

Abstract

Thermally actuated printed circuit board (PCB) retainer assemblies that utilize at least one thermally actuated element to secure a received PCB to a heat sink in accordance with embodiments of the invention are disclosed. In one embodiment, a thermally actuated PCB retainer assembly includes a heat sink having an elongated groove configured to receive a PCB and a PCB retainer that includes a pair of complementary elongated bodies each having a first elongated face and a second elongated face where the second elongated faces of the elongated bodies are disposed in a cooperative sliding relation and at least one thermally actuated element in contact with at least one of the elongated bodies such that the thermally actuated element applies a force on the at least one elongated body in response to temperature changes such that the elongated bodies move in the cooperative sliding relation.

First claim

What is claimed is:

1. A thermally actuated printed circuit board (PCB) retainer assembly comprising:
a heat sink having an elongated groove having first and second elongated walls configured to receive a printed circuit board; and
a printed circuit board retainer comprising:
a first and second complementary elongated bodies each having a first elongated face and a second elongated face disposed opposite said first elongated face, wherein the second elongated face of each elongated body is angled relative to the first elongated face, wherein the second elongated faces of the elongated bodies are disposed in a cooperative sliding relation such that movement of the second elongated faces relative to each other causes the first elongated faces of the elongated bodies to move laterally apart, wherein the first elongated face of the first elongated body is in contact with the printed circuit board and wherein the first elongated face of the second elongated body is in contact with the second elongated wall of the groove, and at least one thermally actuated element in contact with at least one of the elongated bodies such that heat from the received printed circuit board causes the temperature actuated element to expand and thereby apply a force on the at least one elongated body in response to temperature changes such that the elongated bodies move in the cooperative sliding relation thereby securing the printed circuit board to the heat sink,
wherein the first elongated body is constrained such that the applied force does not result in the significant movement of the first elongated body in a direction parallel to the first elongated face.

2. The thermally actuated PCB retainer assembly of claim 1 , wherein the heat sink having an elongated groove further includes a third elongated wall.

3. The thermally actuated PCB retainer assembly of claim 1 , wherein the PCB retainer includes two thermally actuated elements.

4. The thermally actuated PCB retainer assembly of claim 3 , wherein the PCB retainer includes a first and second side support beams.

5. The thermally actuated PCB retainer assembly of claim 4 , wherein the first and second side support beams are integral with the first elongated body.

6. The thermally actuated PCB retainer assembly of claim 4 , wherein the PCB retainer includes the first and the second side support beams that are separate structures attached to the first elongated body.

7. The thermally actuated PCB retainer assembly of claim 4 , wherein, the thermally actuated elements are attached to the side support beams.

8. The thermally actuated PCB retainer assembly of claim 1 , wherein the at least one thermally actuated element is made of materials that exhibit shape memory.

9. The thermally actuated PCB retainer assembly of claim 8 , wherein the at least one thermally actuated element is made of materials that exhibit superelasticity.

10. The thermally actuated PCB retainer assembly of claim 1 , wherein the at least one thermally actuated element is made using Nickel Titanium.

11. The thermally actuated PCB retainer assembly of claim 1 , wherein the first and second elongated bodies are made of Aluminum.

12. The thermally actuated PCB retainer assembly of claim 1 , wherein the PCB retainer has a dis-engaged configuration when the at least one thermally actuated element is below its transition temperature.

13. The thermally actuated PCB retainer assembly of claim 1 , wherein the PCB retainer has an engaged configuration when the at least one thermally actuated element reaches its transition temperature.

14. The thermally actuated PCB retainer assembly of claim 1 , further comprising a received PCB wherein the received PCB includes electronic components that generate heat when the electronic components are utilized.

15. The thermally actuated PCB retainer assembly of claim 1 , wherein the at least one thermally actuated element has a transition temperature of 30+/−5 degrees Celsius.

16. The thermally actuated PCB retainer assembly of claim 1 , wherein the at least one thermally actuated element has a transition temperature greater than 25 degrees Celsius.

17. The thermally actuated PCB retainer assembly of claim 1 , wherein the at least one thermally actuated element has a transition temperature greater than 30 degrees Celsius.

18. The thermally actuated PCB retainer assembly of claim 1 , wherein the at least one thermally actuated element has a transition temperature greater than 35 degrees Celsius.

19. The thermally actuated PCB retainer assembly of claim 1 , wherein the PCB retainer utilizes a single thermally actuated element.

Assignees

• Univ California

Inventors

• Reilly Sean
• Supowit Jacob
• Stubblebine Michael J

Classifications

• H05K2201/068

  wherein the coefficient of thermal expansion is important · CPC title

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• H05K7/1404 Primary

  by edge clamping, e.g. wedges · CPC title

• H05K1/0201 Primary

  Thermal arrangements, e.g. for cooling, heating or preventing overheating · CPC title