Wireless communication device

Patent metadata

Field	Value
Publication number	US-9628115-B1
Application number	US-201615094684-A
Country	US
Kind code	B1
Filing date	Apr 8, 2016
Priority date	Apr 8, 2016
Publication date	Apr 18, 2017
Grant date	Apr 18, 2017

Abstract

A wireless communication device that has a circuit board, an RF signal module, a capacitive touch-sensing component and an antenna component is provided. The touch-sensing signal module is disposed on the circuit board. The capacitive touch-sensing component includes a sensing layer and a ground layer. The sensing layer is electrically connected to the touch-sensing signal module. The antenna component includes a feed point and a radiating body. The feed point is disposed on the ground layer and is electrically connected to the RF single module. The radiating body incorporates at least parts of the ground layer. Alternatively, the feed point is disposed on the sensing layer, and the radiating body incorporates at least parts of the sensing layer. Therefore, the radiating body is incorporated into the sensing layer or ground layer of the capacitive touch-sensing component and can save accommodating space.

First claim

What is claimed is:

1. A wireless communication device, comprising:
a circuit board, comprising a first ground layer;
a first input component, comprising a sensing layer, a dielectric layer and a second ground layer, the sensing layer being electrically connected to the first ground layer, the dielectric layer being disposed between the sensing layer and the second ground layer, and the second ground layer being electrically connected to the first ground layer; and
an antenna component, comprising a feed point and a radiating body, the feed point being disposed on the second ground layer of the first input component, and at least parts of the second ground layer forming a first part of the radiating body.

2. The wireless communication device of claim 1 , further comprising a ground conducting wire having a first end electrically connected to the first ground layer and a second end electrically connected to the second ground layer.

3. The wireless communication device of claim 2 , further comprising a radio frequency (RF) signal conducting wire having a first end electrically connected to the first ground layer and a second end electrically connected to the second ground layer.

4. The wireless communication device of claim 3 , wherein the ground conducting wire and the RF signal conducting wire form a second part of the radiating body.

5. The wireless communication device of claim 4 , further comprising:
an RF signal module and a touch-sensing signal module, both being disposed on the circuit board; and
a touch-sensing signal conducting wire having a first end electrically connected to the touch-sensing signal module and a second end electrically connected to the sensing layer, and the first end of the RF signal conducting wire being electrically connected to the RF signal module.

6. The wireless communication device of claim 5 , further comprising an RF signal filter, wherein the RF signal filter is electrically connected to the touch-sensing signal conducting wire to block an RF signal from propagating through the touch-sensing signal conducting wire.

7. The wireless communication device of claim 6 , wherein the RF signal filter comprises an inductor.

8. The wireless communication device of claim 3 , wherein the touch-sensing signal conducting wire and the RF signal conducting wire are disposed on one of the circuit board and a flexible printed circuit substrate.

9. The wireless communication device of claim 3 , further comprising a touch-sensing signal filter, wherein the touch-sensing signal filter is electrically connected to the RF signal conducting wire to block an RF signal from propagating through the RF signal conducting wire.

10. The wireless communication device of claim 9 , wherein the touch-sensing signal filter comprises a capacitor.

11. The wireless communication device of claim 2 , further comprising an RF signal filter, wherein the RF signal filter is electrically connected to the ground conducting wire to block an RF signal from propagating through the ground conducting wire.

12. The wireless communication device of claim 1 , further comprising:
a cover glass, wherein an input sensing area is formed by the first input component on the cover glass.

13. The wireless communication device of claim 12 , wherein the first input component comprises one of a capacitive touch-sensing component, a resistive touch-sensing component, an inductive touch-sensing component and an optical touch-sensing component.

14. The wireless communication device of claim 12 , further comprising:
a second input component, wherein the cover glass has an opening and the second input component is arranged in the opening.

15. The wireless communication device of claim 14 , wherein the input sensing area is disposed in a surrounding area of the second input component.

16. The wireless communication device of claim 14 , wherein the second input component comprises a biometirc identification module.

17. A wireless communication device, comprising:
a circuit board, comprising a ground layer;
a touch-sensing signal conducting wire and an RF signal conducting wire, a first end of the touch-sensing signal conducting wire being electrically connected to the ground layer, and a first end of the RF signal conducting wire being electrically connected to the ground layer;
an input component, comprising a sensing layer which is electrically connected to a second end of the touch-sensing signal conducting wire; and
an antenna component, comprising a feed point and a radiating body, the feed point being disposed on the sensing layer of the input component, and a second end of the RF signal conducting wire being electrically connected to the sensing layer via the feed point, wherein at least parts of the sensing layer form a first part of the radiating body.

18. The wireless communication device of claim 17 , wherein the input component comprises one of a capacitive touch-sensing component, a resistive touch-sensing component, an inductive touch-sensing component and an optical touch-sensing component.

19. The wireless communication device of claim 18 , wherein the touch-sensing signal filter comprises a capacitor, and the RF signal filter comprises an inductor.

20. The wireless communication device of claim 17 , further comprising a touch-sensing signal filter and an RF signal filter, wherein the touch-sensing signal filter is electrically connected to the RF signal conducting wire to block a touch-sensing signal from propagating through the RF signal conducting wire; and the RF signal filter is electrically connected to the touch-sensing signal conducting wire to block an RF signal from propagating through the touch-sensing signal conducting wire.

21. The wireless communication device of claim 17 , wherein a second end of the touch-sensing signal conducting wire and a second end of the RF signal conducting wire are electrically connected in parallel to the sensing layer.

22. The wireless communication device of claim 17 , further comprising a ground conducting wire having a first end electrically connected to the ground layer and a second end electrically connected to the sensing layer.

23. The wireless communication device of claim 22 , wherein the ground conducting wire and the RF signal conducting wire form a second part of the radiating body.

Assignees

• Htc Corp

Inventors

• Tsai Tiao-Hsing
• Chiu Chien-Pin
• Wu Hsiao-Wei
• Kung Yi-Hsiang
• Fang li-yuan

Classifications

• H01Q1/2283

  mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title

• H01Q1/44

  using equipment having another main function to serve additionally as an antenna {, e.g. means for giving an antenna an aesthetic aspect}(H01Q1/27 - H01Q1/34 take precedence) · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/5445

  being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title

• H10W44/248

  for antennas · CPC title