Electrostatic discharge protection for modular equipment

Patent metadata

Field	Value
Publication number	US-9627884-B2
Application number	US-201414577729-A
Country	US
Kind code	B2
Filing date	Dec 19, 2014
Priority date	Jun 15, 2011
Publication date	Apr 18, 2017
Grant date	Apr 18, 2017

Abstract

A modular electrical assembly that includes a first enclosure that physically couples to a second enclosure to form a modular stackup arrangement. The first enclosure having a connection to an electrical ground for discharging electrostatic discharge (ESD) energy of ESD events of the modular electrical assembly. The first enclosure configured to enclose first circuitry and comprising at least one generally flat surface to electrically couple to the second enclosure. The second enclosure configured to enclose second circuitry and comprising at least one surface with a plurality of raised contact nodes arranged such that when in contact with the one surface of the first enclosure electrostatic discharge energy is directed over the raised contact nodes to the one surface of the first enclosure for discharging portions of the ESD energy through the electrical ground of the first enclosure.

First claim

What is claimed is:

1. A modular electrical assembly, comprising:
a modular stackup arrangement of the modular electrical assembly comprising a first enclosure that physically couples to a second enclosure to form the modular stackup arrangement, the first enclosure comprised of a first metal composition and having a connection to an electrical ground for at least discharging electrostatic discharge (ESD) energy of ESD events of the modular electrical assembly;
the first enclosure configured to enclose first circuitry and comprising at least one generally flat surface to electrically couple to the second enclosure for at least receiving portions of the ESD energy received at the second enclosure;
the second enclosure comprised of a second metal composition and configured to enclose second circuitry and having at least one surface with a plurality of raised contact nodes arranged on the one surface of the second enclosure such that when in contact with the one generally flat surface of the first enclosure, at least the portions of the ESD energy is directed over ones of the raised contact nodes to the one generally flat surface of the first enclosure for discharging the portions of the ESD energy through the electrical ground of the first enclosure, wherein the plurality of raised contact nodes are comprised of a third metal composition different than that of the first and second metal composition.

2. The modular electrical assembly of claim 1 wherein the modular stackup arrangement is connected to a modular visualization panel.

3. The modular electrical assembly of claim 1 wherein the plurality of raised contact nodes are disposed along a first edge of the one surface of the second enclosure.

4. The module electrical assembly of claim 3 wherein the first edge comprises an edge with the largest gapping between the one surface of the second enclosure and the one generally flat surface of the first enclosure.

5. The modular electrical assembly of claim 1 wherein the plurality of raised contact nodes are disposed along multiple edges of the one surface of the second enclosure.

6. The modular electrical assembly of claim 1 wherein the first circuitry comprises logic circuitry.

7. The modular electrical assembly of claim 1 wherein the second circuitry comprises communication circuitry.

8. The modular electrical assembly of claim 1 wherein the second enclosure and the plurality of raised contact nodes are formed from the same piece of material.

9. The modular electrical assembly of claim 1 further comprising:
a second modular stackup arrangement of the modular electrical assembly comprising a third enclosure that physically couples to a fourth enclosure to form the second modular stackup arrangement.

10. A modular electrical assembly, comprising:
a modular stackup arrangement of the modular electrical assembly comprising a first enclosure comprised of a first metal composition and that physically couples to a second enclosure comprised of a second metal composition to form the modular stackup arrangement, the first enclosure having a connection to an electrical ground for at least discharging electrostatic discharge (ESD) energy of ESD events of the modular electrical assembly;
the first enclosure configured to enclose first circuitry and having at least one surface with a plurality of raised contact nodes arranged on the one surface of the first enclosure such that when in contact with a generally flat surface of the second enclosure, at least portions of the ESD energy received at the second enclosure is directed over ones of the raised contact nodes from the generally flat surface of the second enclosure for discharging the portions of the ESD energy through the electrical ground of the first enclosure, wherein the plurality of raised contact nodes are comprised of a third metal composition different than that of the first and second metal composition.

11. The modular electrical assembly of claim 10 wherein the modular stackup arrangement is connected to a modular visualization panel.

12. The modular electrical assembly of claim 10 wherein the plurality of raised contact nodes are disposed along a first edge of the one surface of the first enclosure.

13. The module electrical assembly of claim 12 wherein the first edge comprises an edge with the largest gapping between the one surface of the first enclosure and the one generally flat surface of the second enclosure.

14. The modular electrical assembly of claim 10 wherein the plurality of raised contact nodes are disposed along multiple edges of the one surface of the first enclosure.

15. The modular electrical assembly of claim 10 wherein the first circuitry comprises logic circuitry.

16. The modular electrical assembly of claim 10 wherein the second enclosure is configured to enclose second circuitry.

17. The modular electrical assembly of claim 10 wherein the first enclosure and the plurality of raised contact nodes are formed from the same piece of material.

18. The modular electrical assembly of claim 10 further comprising: a second modular stackup arrangement of the modular electrical assembly comprising a third enclosure that physically couples to a fourth enclosure to form the second modular stackup arrangement.

Assignees

• Rockwell Automation Tech Inc

Inventors

• Kaufman Andrew P
• Satula Keith O

Classifications

• H10W42/80

  protecting against overcurrent or overload, e.g. fuses or shunts (integrated devices comprising arrangements for electrical protection H10D89/60) · CPC title

• G01R31/318513

  Test of Multi-Chip-Moduls · CPC title

• H01L2924/14

  Electricity · mapped topic

• H02H9/045 Primary

  adapted to a particular application and not provided for elsewhere · CPC title

• H05K7/1481

  User interface, e.g. status displays; Programming interface, e.g. connector for computer programming; Monitoring · CPC title