Low-loss coplanar waveguide bonding structure and manufacturing method thereof
US-2024045160-A1 · Feb 8, 2024 · US
US9627833B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9627833-B2 |
| Application number | US-201113196682-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 2, 2011 |
| Priority date | Aug 2, 2011 |
| Publication date | Apr 18, 2017 |
| Grant date | Apr 18, 2017 |
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A lead frame for attaching leads to a hermetic feedthrough includes a cross-member and a plurality of leads. Each of the leads has an elongate body extending from the cross-member in a direction substantially parallel with one another, and each lead includes at least one of a notch on an end thereof opposite to the cross-member or a hole proximate to the end.
Opening claim text (preview).
What is claimed is: 1. A lead frame for attaching leads to a hermetic feedthrough, comprising: a cross-member; and a plurality of leads, each lead having an elongate body extending from the cross-member in a direction substantially parallel with one another; wherein each lead defines an end opposite to the cross-member; wherein each lead comprises at least one of a notch on the end, a hole proximate to the end, or a protrusion proximate to the end; wherein the at least one of the notch, hole, or protrusion of each lead is configured to be aligned with at least one of an interposer or a pad of a feedthrough for joining the end of the corresponding lead to the at least one of the interposer or the pad aligned therewith, the at least one of the interposer or the pad being electrically coupled to a via extending through the feedthrough and having an upper surface facing away from the feedthrough, each lead of the plurality of leads positioned orthogonal to a corresponding via; and wherein the end of each lead is substantially planar, includes a lower surface configured to contact the upper surface of the at least one of the interposer or the pad for joining the lead thereto, and includes an upper surface configured to face away from the feedthrough. 2. The lead frame of claim 1 , wherein the at least one of the notch, hole, or protrusion is a hole proximate to the end. 3. The lead frame of claim 2 , wherein the hole is round. 4. The lead frame of claim 3 , wherein the diameter of the hole is less than half the width of the lead. 5. The lead frame of claim 1 , wherein the at least one of the notch, hole, or protrusion is a notch on the end opposite to the cross-member. 6. The lead frame of claim 5 , wherein the notch is V-shaped. 7. The lead frame of claim 1 , wherein at least one lead of the plurality of leads is coupled to a feedthrough, and the feedthrough comprises a ceramic insulator, a via, and a pad coupled to the via. 8. The lead frame of claim 7 , wherein the via and the pad are hermetically bonded to the insulator. 9. The lead frame of claim 7 , wherein the at least one lead of the plurality of leads is bonded to an upper surface of the pad. 10. The lead frame of claim 9 , wherein the end of a lead of the plurality of leads is laser welded to the pad. 11. The lead frame of claim 7 , wherein the feedthrough comprises an interposer coupled to an upper surface of the pad, and a lead of the plurality of leads is bonded to an upper surface of the interposer. 12. The lead frame of claim 1 , wherein the plurality of leads comprise at least one of niobium and an alloy comprising cobalt, chromium, and nickel. 13. The lead frame of claim 1 , wherein each lead comprises a protrusion proximate to the end. 14. The lead frame of claim 13 , wherein each lead comprises a dimple on the backside of the protrusion. 15. The lead frame of claim 1 , wherein the lead frame includes scoring or narrowing between each lead and the cross-member for each lead to decouple from the cross-member. 16. The lead frame of claim 15 , wherein the scoring or narrowing between each lead and the cross-member is a break-away feature for each lead to decouple from the cross-member. 17. The lead frame of claim 1 , wherein each lead is substantially planar.
Laser welding (H01R43/0228 takes precedence) · CPC title
Conductor or circuit manufacturing · CPC title
Welded connections (H01R4/021 - H01R4/028 take precedence) · CPC title
Feedthroughs · CPC title
for medicine and surgery · CPC title
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