Apparatus and method for processing a substrate

Patent metadata

Field	Value
Publication number	US-9627324-B2
Application number	US-94791210-A
Country	US
Kind code	B2
Filing date	Nov 17, 2010
Priority date	Nov 17, 2009
Publication date	Apr 18, 2017
Grant date	Apr 18, 2017

Abstract

A method of processing a substrate that displays out-gassing when placed in a vacuum comprises placing the substrate in a vacuum and performing an out-gassing treatment by heating the substrate to a temperature T 1 and removing gaseous contamination emitted from the substrate until the out-gassing rate is determined by the diffusion of the substrate's contamination and thus essentially a steady state has been established. Afterwards, the temperature is lowered to a temperature T 2 at which the diffusion rate of the substrate's contamination is lower than at T 1 . The substrate is further processed at said temperature T 2 until the substrate has been covered with a film comprising a metal.

First claim

The invention claimed is:

1. A method of processing a substrate, comprising the steps of:
providing a substrate that displays out-gassing when placed in a vacuum,
placing the substrate in a vacuum,
performing an out-gassing treatment by heating the substrate to a temperature T 1 and removing gaseous contamination emitted from the substrate until the out-gassing rate is determined by the diffusion of the substrate's contamination and thus essentially a steady state has been established,
determining whether or not said essentially a steady state has been established, and
upon determining that said essentially a steady state has been established, lowering the temperature to a temperature T 2 at which the diffusion rate of the substrate's contamination is lower than at T 1 ,
further processing the substrate at said temperature T 2 , said further processing including depositing a film comprising a metal onto the substrate, until the substrate has been covered with the film.

2. The method according to claim 1 , wherein the difference between T 1 and T 2 is at least 100K.

3. The method according to claim 1 , wherein the substrate is maintained at a temperature of T 2 or less during the further processing of the substrate.

4. The method according to claim 1 , wherein the further processing of the substrate comprises one or more of etching the substrate and depositing one or more metal layers onto the substrate.

5. The method according to claim 1 , wherein the substrate is a semiconductor wafer comprising a layer of organic material.

6. The method according to claim 5 , wherein the organic material comprises a polyimide layer arranged on the front surface of the semiconductor wafer.

7. The method according to claim 6 , wherein the semiconductor wafer is a silicon wafer.

8. The method according to claim 1 , wherein at least portions of one or more of the front side and the rear side of the substrate comprise organic material.

9. The method according to claim 1 , further comprising trapping gaseous matter emitted from the substrate in a cold trap positioned in a pumping line.

10. The method according to claim 1 , further comprising monitoring the gaseous matter removed from the substrate and identifying presence of one or more of the compounds CO 2 , H 2 O, C x H y .

11. The method according to claim 1 , further comprising, before depositing the first metal layer, carrying out a cleaning treatment at a temperature T 2 .

12. The method according to claim 11 , wherein the cleaning treatment is an etching treatment.

13. The method according to claim 11 , further comprising actively cooling the substrate during the cleaning treatment.

14. The method according to claim 1 , further comprising actively cooling the substrate during deposition of the first metal layer.

15. The method according to claim 1 , further comprising depositing a second metal layer on the first metal layer and, optionally, a third metal layer on the second metal layer.

16. The method according to claim 1 , further comprising depositing a sealing metal layer on the rear side of the substrate before depositing the first metal layer on the front side of the substrate.

17. A method of producing an electronic component, comprising performing the method of one of claims 1 to 16 , and singulating the substrate to produce one or more electronic components, the electronic component comprising a semiconductor chip embedded in a plastic composition and at least one metal layer positioned on at least one of the semiconductor chip and on the plastic composition.

18. The method according to claim 1 , wherein steps of performing the out-gassing treatment, lowering the temperature to a temperature T 2 , and further processing the substrate at said temperature T 2 including depositing the film comprising the metal onto the substrate, are performed using a cluster-type multi-station processing apparatus.

19. A method of processing a substrate, comprising the steps of:
providing a substrate that displays out-gassing when placed in a vacuum,
placing the substrate in a vacuum,
performing an out-gassing treatment by heating the substrate to a temperature T 1 and removing gaseous contamination emitted from the substrate until the out-gassing rate is determined by the diffusion of the substrate's contamination and thus essentially a steady state has been established, and afterwards
lowering the temperature to a temperature T 2 at which the diffusion rate of the substrate's contamination is lower than at T 1 ,
further processing the substrate at said temperature T 2 , said further processing including depositing a film comprising a metal onto the substrate, until the substrate has been covered with the film, wherein the temperature of the substrate is directly lowered from temperature T 1 to temperature T 2 without intermediate heating.

20. The method according to claim 19 , wherein no intermediate processing of the substrate occurs while the temperature of the substrate is directly lowered from temperature T 1 to temperature T 2 .

21. A method of processing a substrate, comprising the steps of:
providing a substrate that displays out-gassing when placed in a vacuum,
placing the substrate in a vacuum,
performing an out-gassing treatment by heating the substrate to a temperature T 1 and removing gaseous contamination emitted from the substrate until the out-gassing rate is determined by the diffusion of the substrate's contamination and thus essentially a steady state has been established, and afterwards
lowering the temperature to a temperature T 2 at which the diffusion rate of the substrate's contamination is lower than at T 1 ,
further processing the substrate at said temperature T 2 , said further processing including depositing a film comprising a metal onto the substrate, until the substrate has been covered with the film, wherein no intermediate processing of the substrate occurs during the step of lowering the temperature to the temperature T 2 .

Assignees

• Rietzler Wolfgang
• Van Mast Bart Scholte
• Evatec Ag

Inventors

• Rietzler Wolfgang
• Van Mast Bart Scholte

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W72/29

  Bond pads specially adapted therefor · CPC title

• H10W72/9413

  on encapsulations · CPC title

• H10W72/0198 Primary

  batch processes · CPC title