Buffer element and manufacturing method thereof, backlight module, and display device

Patent metadata

Field	Value
Publication number	US-9625643-B2
Application number	US-201414313600-A
Country	US
Kind code	B2
Filing date	Jun 24, 2014
Priority date	Apr 30, 2014
Publication date	Apr 18, 2017
Grant date	Apr 18, 2017

Abstract

A buffer element and a manufacturing method thereof, a backlight module, and a display device are disclosed. When the buffer element is applied to the backlight module, the problem caused by thermal expansion of the light guide plate can be effectively solved without needing to reserve a gap in the backlight module, the relative movement of the light guide plate is avoided and the optical quality of the backlight module is improved. The buffer element comprises a buffer body, wherein the buffer body comprises a curable adhesive, and a negative thermal expansion material dispersed in the curable adhesive.

First claim

The invention claimed is:

1. A backlight module, comprising:
a back plate;
a light guide plate disposed above the back plate, wherein the light guide plate comprises at least one non-light incident side; and
a buffer element,
wherein:
the buffer element is disposed adjacent to the at least one non-light incident side of the light guide plate and is in contact with the at least one non-light incident side of the light guide plate, and
the buffer element comprises:
a buffer body, wherein the buffer body comprises a curable adhesive, and a negative thermal expansion material dispersed in the curable adhesive such that the buffer element contracts when heated so as to provide a space for the light guide plate to expand therein while the buffer element is in contact with the at least one non-light incident side of the light guide plate.

2. The backlight module of claim 1 , wherein:
the curable adhesive comprises a UV curable adhesive or a thermal curable adhesive.

3. The backlight module of claim 2 , wherein:
a ratio of a mass of the negative thermal expansion material to a volume of the UV curable adhesive is within the range of 1 g/10 mL-1 g/3 mL.

4. The backlight module of claim 1 , wherein:
the negative thermal expansion material comprises a negative thermal expansion alloy material or a negative thermal expansion inorganic material.

5. The backlight module of claim 1 , wherein:
the negative thermal expansion material comprises a negative thermal expansion alloy material, and the negative thermal expansion alloy material comprises at least one of NiTi or FeNiCo.

6. The backlight module of claim 1 , wherein:
the negative thermal expansion material comprises a negative thermal expansion inorganic material, and the negative thermal expansion inorganic material comprises at least one of Zr 2 W 2 O 8 , ZrMo 2 O 8 , ZrV 2 O 7 , or Cd(CN) 2 .

7. The backlight module of claim 1 , further comprising:
a light reflection layer and/or an adhesive layer,
wherein the light reflection layer or the adhesive layer is disposed along a longitudinal extending direction of the buffer body on one side of the buffer body, or, the light reflection layer and the adhesive layer are disposed along the longitudinal extending direction of the buffer body on both sides of the buffer body, respectively.

8. The backlight module of claim 7 , wherein:
the light reflection layer is a white light reflection layer, and the white light reflection layer comprises an adhesive, and BaSO 4 and/or CaCO 3 dispersed in the adhesive.

9. The backlight module of claim 7 , wherein:
the light reflection layer has a thickness of 1-50 μm.

10. The backlight module of claim 7 , wherein:
the adhesive layer is a transparent adhesive layer.

11. The backlight module of claim 1 , wherein:
the buffer element further comprises a light reflection layer and/or an adhesive layer;
wherein the light reflection layer or the adhesive layer is disposed along a longitudinal extending direction of the buffer body on one side of the buffer body, or, the light reflection layer and the adhesive layer are disposed along the longitudinal extending direction of the buffer body on both sides of the buffer body, respectively; and
wherein the adhesive layer is disposed on the side of the buffer body away from the non-light incident side.

12. The backlight module of claim 11 , wherein:
the light reflection layer is a white light reflection layer, and the white light reflection layer comprises an adhesive, and BaSO 4 and/or CaCO 3 dispersed in the adhesive.

13. The backlight module of claim 11 , wherein:
the light reflection layer has a thickness of 1-50 μm.

14. The backlight module of claim 11 , wherein:
the adhesive layer is a transparent adhesive layer.

15. The backlight module of claim 11 , wherein:
the backlight module further comprises a frame disposed around the light guide plate, wherein the frame is in contact with the adhesive layer.

16. The backlight module of claim 1 , wherein:
the light guide plate further comprises a bottom surface facing the back plate and a top surface opposite to the bottom surface; and
the buffer element is also in contact with regions, closing to an edge of the non-light incident side, of the bottom surface and/or the top surface; and
wherein the buffer body further comprises a first sidewall connected to the buffer body and extending to a lower side of the bottom surface, and/or, a second sidewall connected to the buffer body and extending to an upper side of the top surface.

17. A display device, comprising the backlight module according to claim 1 .

Assignees

• Boe Technology Group Co Ltd
• Hefei Boe Display Light Co Ltd

Inventors

• Liu Gang

Classifications

• G02F2203/21

  Thermal instability, i.e. DC drift, of an optical modulator; Arrangements or methods for the reduction thereof · CPC title

• G02B6/0093

  Means for protecting the light guide · CPC title

• G02B6/0088 Primary

  of the light guide or other optical sheets in the package · CPC title

• C08K11/00

  Use of ingredients of unknown constitution, e.g. undefined reaction products · CPC title

• Y10T428/28

  Web or sheet containing structurally defined element or component and having an adhesive outermost layer · CPC title