Antenna module for transmitting or receiving terahertz waves and focal plane array structure for real-time terahertz imaging

Patent metadata

Field	Value
Publication number	US-9625322-B2
Application number	US-201414509264-A
Country	US
Kind code	B2
Filing date	Oct 8, 2014
Priority date	May 28, 2014
Publication date	Apr 18, 2017
Grant date	Apr 18, 2017

Abstract

Provided is an antenna module that comprises an antenna comprising a radiation patch for transmitting or receiving the terahertz wave, and a first ground disposed away from the radiation patch, the first ground having a hole, an integrated circuit board having a signal processing unit configured to generate the terahertz wave or to process the terahertz wave received through the antenna, the integrated circuit board being disposed under the antenna and a via configured to connect the radiation patch with the signal processing unit, the via passing through the hole.

First claim

What is claimed is:

1. An antenna module for transmitting or receiving a terahertz wave, the antenna module comprising:
an antenna comprising a radiation patch for transmitting or receiving the terahertz wave, a first ground disposed away from the radiation patch, and the first ground having a hole;
an integrated circuit board having a signal processing unit configured to generate the terahertz wave or to process the terahertz wave received through the antenna, and the integrated circuit board being disposed under the antenna; and
a via configured to connect the radiation patch with the signal processing unit, and the via passing through the hole,
wherein the integrated circuit board comprises:
a detector configured to detect the terahertz wave received through the antenna;

a voltage-controlled oscillator configured to output an oscillation frequency according to an output voltage of the detector;
a frequency digital convertor configured to convert the oscillation frequency from the voltage-controlled oscillator to a digital signal; and
a digital signal processing unit configured to generate a data based on the converted digital signal.

2. The antenna module of claim 1 , further comprising: a transmission line matching an impedance between the antenna and the signal processing unit included in the integrated circuit board, and the transmission line is disposed away from the first ground and located under the first ground.

3. The antenna module of claim 2 , wherein the transmission line comprises: a metal line combined with the via, the metal line is disposed away from the first ground and being located under the first ground; and a second ground is disposed away from the metal line and being located under the metal line.

4. The antenna module of claim 3 , wherein the first ground is configured to function as a ground for the radiation patch and the metal line.

5. The antenna module of claim 1 further comprising:
a mutual connecting line configured to mutually connect the detector, the voltage-controlled oscillator, the frequency digital convertor, and the digital signal processing unit, and the mutual connecting line being disposed under the antenna.

6. An antenna nodule for transmitting or receiving a terahertz wave, the antenna module comprising:
an antenna comprising radiation patch for transmitting or receiving the terahertz wave, a first ground disposed away from the radiation patch, and the first ground having a hole;
an integrated circuit board having a signal processing unit configured to generate the terahertz wave or to process the terahertz wave received through the antenna, and the integrated circuit board being disposed under the antenna; and
a via configured to connect the radiation patch with the signal processing unit, and the via passing through the hold,
wherein, the integrated circuit board comprises:
an oscillator configured to generate the terahertz wave; and
an amplifier configured to amplify the generated terahertz wave,

further comprising a mutual connecting line configured to mutually connect the oscillator and the amplifier, and the mutual connecting Line being disposed under the antenna.

7. A focal plane array for real-time terahertz imaging, comprising;
an antenna array where the plurality of antenna modules are spaced to be disposed, the antenna module including a radiation patch receiving the terahertz wave, a first ground disposed away from the radiation patch, and the first ground having a hole;
an integrated circuit board comprising a signal processing unit disposed under the antenna array and configured to process the terahertz wave received through the antenna; and
a via configured to connect the radiation patch and the signal processing unit, and the via passing through the hole,
wherein the integrated circuit board comprises:
a detector configured to detect the terahertz wave received through the antenna;
a voltage-controlled oscillator configured to output an oscillation frequency according to an output voltage of the detector;
a frequency digital convertor configured to convert the oscillation frequency from the voltage-controlled oscillator to a digital signal; and
a digital signal processing unit configured to generate data based on the converted digital signal.

8. The focal plane array of claim 7 , further comprising: a transmission line matching an impedance between the antenna and the signal processing unit included in the integrated circuit board, and the transmission line disposed away from the first ground and located under the first ground.

9. The focal plane array of claim 8 , wherein the transmission line comprises: a metal line combined with the via, the metal line is disposed away from the first ground and located under the first ground; and a second ground is disposed away from the metal line and located under the metal line.

10. The focal plane array of claim 7 , wherein the first ground is formed as a single ground corresponding to the antenna array.

11. The focal plane array of claim 7 , wherein the signal processing unit is correspondently disposed with the each antenna.

12. The focal plane array of claim 7 , wherein the detector is correspondently disposed with the each antenna, and each of the voltage-controlled oscillator, the frequency digital convertor, and the digital signal processing unit is a single component, and configured to process the received terahertz wave through the detector.

13. The focal plane array of claim 7 , further comprising: a mutual connecting line configured to mutually connect the detector, the voltage-controlled oscillator, the frequency digital convertor, and the digital signal processing unit, and the mutual connecting line is disposed under the antenna.

Assignees

• Korea Advanced Inst Sci & Tech

Inventors

• Lee Sang-Gug
• Kim Sun-A
• Choi Kyoung-Young
• Park Dae-Woong
• Han Seok-Kyun

Classifications

• G01J2005/0077

  Imaging · CPC title

• G01J5/0215

  Compact construction · CPC title

• H01Q1/2283

  mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title

• G01J5/10 Primary

  using electric radiation detectors · CPC title

• H01Q21/065

  Patch antenna array · CPC title