Thickness measurement apparatus and method thereof

US9625273B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9625273-B2
Application numberUS-201113879153-A
CountryUS
Kind codeB2
Filing dateOct 11, 2011
Priority dateOct 12, 2010
Publication dateApr 18, 2017
Grant dateApr 18, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A thickness measurement apparatus and method to measure an object to be inspected. The thickness measurement apparatus includes: an ultrasonic wave transmission/reception device that receives/transmits an ultrasonic wave to/from a wall of a pipe to be inspected, covered with a heat insulation material; a support device that supports the ultrasonic wave transmission/reception device from an outer surface of the pipe to be inspected; a thickness calculation device that measures a propagation time of the ultrasonic wave received/transmitted by the ultrasonic wave transmission/reception device, and calculates thickness of the pipe to be inspected; a calibration board with a predetermined thickness greater than a thickness of a dead zone of the ultrasonic wave transmission/reception device; and a calibration board adjustment device that moves the calibration board toward and away from a gap between the ultrasonic wave transmission/reception device and the outer surface of the pipe to be inspected.

First claim

Opening claim text (preview).

The invention claimed is: 1. A thickness measurement apparatus comprising: at least one ultrasonic wave transmission/reception device that receives and transmits an ultrasonic wave to/from a wall of a pipe to be inspected, covered with a heat insulation material; at least one ultrasonic wave transmission device respectively inserted in a gap between the ultrasonic wave transmission/reception device and an outer surface of the pipe to be inspected, and configured by soft metal transmitting the ultrasonic wave; a support device that supports the ultrasonic wave transmission/reception devices from the outer surface of the pipe to be inspected and contacts the ultrasonic wave transmission/reception devices with the pipe to be inspected in a circumferential direction and an axial direction of the pipe to be inspected; a thickness calculation device that measures a propagation time of the ultrasonic wave received and transmitted by the ultrasonic wave transmission/reception device, and calculates a thickness of the pipe to be inspected; a calibration board of which a thickness is predetermined, the calibration board is set in the gap between the electromagnetic ultrasonic wave transmission/reception device and the outer surface of the pipe when calibrating measurement accuracy of the at least one ultrasonic transmission/reception device and more than a thickness of a dead zone of the ultrasonic wave transmission/reception device; and a calibration board adjustment device that moves the calibration board toward and away from the gap between the ultrasonic wave transmission/reception device and the outer surface of the pipe to be inspected. 2. The thickness measurement apparatus according to claim 1 , wherein the support device is fixed to the heat insulation material. 3. The thickness measurement apparatus according to claim 1 , wherein the ultrasonic wave transmission/reception device includes an electromagnetic acoustic transducer. 4. The thickness measurement apparatus according to claim 1 , wherein the ultrasonic wave transmission/reception device includes an ultrasonic wave probe including an ultrasonic wave vibrator. 5. The thickness measurement apparatus according to claim 1 , further comprising a heat radiation device of which one end is contacted with an outer surface of the heat insulation material and another end is contacted with the support device, wherein the heat radiation device radiates a heat generated from the ultrasonic wave transmission/reception device through the support device. 6. The thickness measurement apparatus according to claim 1 , further comprising a statistics processing device that measures the thickness of the pipe to be inspected by statistically calculating a plurality of measurement values obtained by the plurality of the ultrasonic wave transmission/reception devices. 7. The thickness measurement apparatus according to claim 1 , a thickness distribution calculation device that calculates a thickness distribution based on a plurality of measurement values obtained by the plurality of the ultrasonic wave transmission/reception devices. 8. The thickness measurement apparatus according to claim 1 , further comprising an electromotive force generation device that generates an electrical power from at least one of a heat or a vibration, of the pipe to be inspected and a light radiated from a lighting device therearound, and supplies the electrical power to at least the thickness calculation device. 9. A thickness measurement method, by using a plurality of apparatus including at least one ultrasonic wave transmission/reception device that receives and transmits an ultrasonic wave to/from a wall of a pipe to be inspected, covered with a heat insulation material, at least one ultrasonic wave transmission device respectively inserted in a gap between the ultrasonic wave transmission/reception device and an outer surface of the pipe to be inspected, and configured by soft metal transmitting the ultrasonic wave; a support device that supports the ultrasonic wave transmission/reception device from the outer surface of the pipe to be inspected and contacts the ultrasonic wave transmission/reception devices with the pipe to be inspected in a circumferential direction and an axial direction of the pipe to be inspected, and a thickness calculation device that measures a propagation time of the ultrasonic wave received and transmitted by the ultrasonic wave transmission/reception device, and calculates a thickness of the pipe to be inspected, a calibration board of which a thickness is predetermined and more than a thickness of a dead zone of the ultrasonic wave transmission/reception device, and a calibration board adjustment device that moves the calibration board toward and away from a gap between the ultrasonic wave transmission/reception device and the outer surface of the pipe to be inspected, comprising: measuring the thickness of the pipe to be inspected by the ultrasonic wave transmission/reception device, the support device and the thickness calculation device; setting the calibration board in the gap between the ultrasonic wave transmission/reception device and the pipe outer surface; and calibrating a setting for using the thickness measurement of the pipe to be inspected by measuring a thickness of the calibration board and comparing a measurement result of the thickness of the calibration board to the thickness of the calibration board which is predetermined, the calibration board is set in the gap between the electromagnetic ultrasonic wave transmission/reception device and the outer surface of the pipe when calibrating measurement accuracy of the at least one ultrasonic transmission/reception device.

Assignees

Inventors

Classifications

  • Arrangements for calibrating or comparing, e.g. with standard objects · CPC title

  • Length, thickness · CPC title

  • cylindrical from outside · CPC title

  • Internal reflections (echoes), e.g. on walls or defects · CPC title

  • by measuring propagation velocity or propagation time of acoustic waves · CPC title

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What does patent US9625273B2 cover?
A thickness measurement apparatus and method to measure an object to be inspected. The thickness measurement apparatus includes: an ultrasonic wave transmission/reception device that receives/transmits an ultrasonic wave to/from a wall of a pipe to be inspected, covered with a heat insulation material; a support device that supports the ultrasonic wave transmission/reception device from an oute…
Who is the assignee on this patent?
Kuroda Hidehiko, Yamashita Yoshihiro, Sumita Akio, and 1 more
What technology area does this patent fall under?
Primary CPC classification G01C25/005. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Apr 18 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).