Method of manufacturing a heat dissipation device

US9625218B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9625218-B2
Application numberUS-201514597985-A
CountryUS
Kind codeB2
Filing dateJan 15, 2015
Priority dateMar 26, 2012
Publication dateApr 18, 2017
Grant dateApr 18, 2017

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  1. Title

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  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A heat dissipation device includes a mounting bracket and a thermal module. The mounting bracket has at least one retaining hole and a mounting section, and the thermal module includes a plurality of radiating fins, to which the mounting bracket is connected. On the radiating fins, at least one engaging zone is provided for correspondingly engaging with the mounting bracket, and at least one locking portion is formed for correspondingly engaging with the retaining hole. With the above structural design, the mounting bracket can be more firmly and stably connected to the thermal module and be more accurately located on the radiating fins without the need of welding, so that the manufacturing cost for welding is saved. A method of manufacturing the heat dissipation device is also disclosed.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of manufacturing heat dissipation device, comprising the following steps: providing a single L-shaped mounting bracket having at least one retaining hole and a mounting section; providing a thermal module including a plurality of radiating fins for engaging with the L-shaped mounting bracket; on one lateral side of the plurality of radiating fins, at least one engaging zone being recessed from the lateral side perpendicular to each of the plurality of radiating fins and formed for correspondingly engaging with the L-shaped mounting bracket, and at least one locking portion being formed for correspondingly engaging with the at least one retaining hole on the L-shaped mounting bracket, wherein the locking portion and the radiating fin are integrally molded; and positioning the L-shaped mounting bracket in the engaging zone from the lateral side of the radiating fins, and applying an amount of pressure on the at least one locking portion, so that the locking portion is deformed sufficiently to be allowed to extend into and become held in the retaining hole on the L-shaped mounting bracket, bringing the L-shaped mounting bracket and the thermal module to connect to each other to form the heat dissipation device. 2. The heat dissipation device manufacturing method as claimed in claim 1 , wherein the locking portion is brought to engage with the retaining hole on the L-shaped mounting bracket by way of mechanical processing. 3. The heat dissipation device manufacturing method as claimed in claim 2 , wherein the mechanical processing is stamping. 4. The heat dissipation device manufacturing method as claimed in claim 1 , wherein the L-shaped mounting bracket further has at least one stopper portion adapted to insert in between two adjacent radiating fins.

Assignees

Inventors

Classifications

  • the means having portions engaging further tubular elements · CPC title

  • F28F9/00Primary

    Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings · CPC title

  • Pressing means used to urge contact, e.g. springs · CPC title

  • Heat exchanger or boiler making · CPC title

  • heat exchangers {or the like (making heat exchangers by methods covered by other subclasses B21D53/02)} · CPC title

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Frequently asked questions

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What does patent US9625218B2 cover?
A heat dissipation device includes a mounting bracket and a thermal module. The mounting bracket has at least one retaining hole and a mounting section, and the thermal module includes a plurality of radiating fins, to which the mounting bracket is connected. On the radiating fins, at least one engaging zone is provided for correspondingly engaging with the mounting bracket, and at least one lo…
Who is the assignee on this patent?
Asia Vital Components Co Ltd
What technology area does this patent fall under?
Primary CPC classification F28F9/00. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Apr 18 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).