Exhaust system

Patent metadata

Field	Value
Publication number	US-9625168-B2
Application number	US-201113813850-A
Country	US
Kind code	B2
Filing date	Jul 25, 2011
Priority date	Aug 5, 2010
Publication date	Apr 18, 2017
Grant date	Apr 18, 2017

Abstract

An exhaust system ( 2 ) is used for evacuating a chamber of a manufacturing apparatus ( 1 ) for manufacturing semiconductor devices, liquid crystal panels, LEDs, or solar cells. The exhaust system ( 2 ) includes a vacuum pump apparatus ( 3 ) for evacuating the chamber, an exhaust gas treatment apparatus ( 5 ) for treating an exhaust gas discharged from the chamber, and a controller ( 6 ) for controlling the vacuum pump apparatus ( 3 ) and/or the exhaust gas treatment apparatus ( 5 ). Information of operation process of the manufacturing apparatus ( 1 ), and the kind of gas and the flow rate of the gas supplied to the manufacturing apparatus ( 1 ) is inputted into the controller ( 6 ) to control the vacuum pump apparatus ( 3 ) and/or the exhaust gas treatment apparatus ( 5 ).

First claim

The invention claimed is:

1. An exhaust system for evacuating a chamber of a manufacturing apparatus for manufacturing semiconductor devices, liquid crystal panels, LEDs, or solar cells comprising:
a vacuum pump apparatus configured to evacuate said chamber;
an exhaust gas treatment apparatus configured to treat an exhaust gas discharged from said chamber;
a pipe for connecting said manufacturing apparatus, said vacuum pump apparatus and said exhaust gas treatment apparatus; and
a controller configured to control said vacuum pump apparatus and/or said exhaust gas treatment apparatus;
wherein information of operation process of said manufacturing apparatus, and the kind of gas and the flow rate of the gas supplied to said manufacturing apparatus is inputted into said controller to control said vacuum pump apparatus and/or said exhaust gas treatment apparatus;
wherein said vacuum pump apparatus comprises a first vacuum pump having two compression stages and a second vacuum pump having two compression stages, and a pump suction port connected to said chamber is provided in said first vacuum pump and a pump exhaust port connected to said exhaust gas treatment apparatus is provided in said second vacuum pump;
wherein pressure at an interstage part between said two compression stages of said second vacuum pump is measured by a pressure sensor, and said controller judges whether a process gas is introduced from said pump suction port to an interior of said first vacuum pump or not based on a measured pressure value; and
wherein said controller is configured to predict the time when maintenance is required of said vacuum pump apparatus or said exhaust gas treatment apparatus based at least in part on the kind of gas and quantity of the gas supplied to said manufacturing apparatus, and to output the prediction information to said manufacturing apparatus.

2. The exhaust system according to claim 1 , wherein said controller is configured to control one or more of supply quantity of N 2 gas, supply quantity of water, electric power, supply quantities of fuel, oxygen and air, heater temperature, and plasma output based on the information of the operation process of said manufacturing apparatus and the kind of gas and the flow rate of the gas supplied to said manufacturing apparatus.

3. The exhaust system according to claim 1 , wherein when maintenance is required for said vacuum pump apparatus or said exhaust gas treatment apparatus, said controller outputs information of maintenance request to said manufacturing apparatus.

4. The exhaust system according to claim 1 , wherein said controller is configured to control rotational speeds of said vacuum pump apparatus based on the information of the operation process of said manufacturing apparatus and the kind of gas and the flow rate of the gas supplied to said manufacturing apparatus.

5. The exhaust system according to claim 3 , wherein said information of maintenance request is obtained from the kind of gas and an accumulated supply quantity of the gas supplied to said manufacturing apparatus.

6. The exhaust system according to claim 1 , further comprising:
an N 2 unit configured to supply an N 2 gas into the exhaust gas discharged from said chamber; and
wherein the information of the operation process of said manufacturing apparatus, and the kind of gas and the flow rate of the gas supplied to said manufacturing apparatus is inputted into said controller to control said N 2 unit.

7. The exhaust system according to claim 1 , further comprising:
a pipe heater configured to heat at least part of said pipe for connecting said manufacturing apparatus, said vacuum pump apparatus and said exhaust gas treatment apparatus; and
wherein the information of the operation process of said manufacturing apparatus, and the kind of gas and the flow rate of the gas supplied to said manufacturing apparatus is inputted into said controller to control said pipe heater.

8. The exhaust system according to claim 1 , wherein a cleaning gas is evacuated from said manufacturing apparatus to perform cleaning of each apparatus of said exhaust system.

9. The exhaust system according to claim 8 , wherein when said vacuum pump apparatus, said exhaust gas treatment apparatus or said pipe is required for said cleaning due to powder adhesion of said vacuum pump apparatus, said exhaust gas treatment apparatus or said pipe, said controller outputs information of the cleaning request to said manufacturing apparatus.

10. The exhaust system according to claim 1 , wherein said controller comprises a controller for controlling all the apparatuses of said exhaust system, or an individual controller for controlling each apparatus of said exhaust system.

11. A control method of an exhaust system for evacuating a chamber of a manufacturing apparatus for manufacturing semiconductor devices, liquid crystal panels, LEDs, or solar cells, said exhaust system comprising:
a vacuum pump apparatus configured to evacuate said chamber;
an exhaust gas treatment apparatus configured to treat an exhaust gas discharged from said chamber; and
a controller configured to control said vacuum pump apparatus and/or said exhaust gas treatment apparatus;
said control method comprising:
inputting information of operation process of said manufacturing apparatus, and the kind of gas and the flow rate of the gas supplied to said manufacturing apparatus into said controller to control said vacuum pump apparatus and/or said exhaust gas treatment apparatus;
wherein said vacuum pump apparatus comprises a first vacuum pump having two compression stages and a second vacuum pump having two compression stages, and a pump suction port connected to said chamber is provided in said first vacuum pump and a pump exhaust port connected to said exhaust gas treatment apparatus is provided in said second vacuum pump;
wherein pressure at an interstage part between said two compression stages of said second vacuum pump is measured by a pressure sensor, and said controller judges whether a process gas is introduced from said pump suction port to an interior of said first vacuum pump or not based on a measured pressure value; and
wherein said controller is configured to predict the time when maintenance is required of said vacuum pump apparatus or said exhaust gas treatment apparatus based at least in part on the kind of gas and quantity of the gas supplied to said manufacturing apparatus or to predict the kind of gas to be treated and an available supply quantity of the gas to be treated until maintenance is required for said vacuum pump apparatus or said exhaust gas treatment apparatus, and to output the prediction information to said manufacturing apparatus.

12. The control method according to claim 11 , further comprising outputting information of maintenance request from said controller to said manufacturing apparatus when maintenance is required for said vacuum pump apparatus or said exhaust gas treatment apparatus.

13. An exhaust system for evacuating a chamber of a manufacturing apparatus for manufacturing semiconductor devices, liquid crystal panels, LEDs, or solar cells comprising:
a vacuum pump apparatus configured to evacuate said chamber;
an exhaust gas treatment apparatus configured to treat an exhaust gas discharged from said chamber;
a pipe for connecting said manufacturing apparatus, said vacuum pump apparatus and said exhaust gas treatment apparatus; and
a controller configured to control said vacuum pump apparatus and/or said exhaust gas treatment apparatus;
wherein information of operation process of said manufacturing apparatus, and the kind of gas and the flow rate of

Assignees

• Shinohara Toyoji
• Kawamura Kohtaro
• Nakazawa Toshiharu
• Ebara Corp

Inventors

• Shinohara Toyoji
• Kawamura Kohtaro
• Nakazawa Toshiharu

Classifications

• H10P72/0604 Primary

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• B01D53/78

  with gas-liquid contact · CPC title

• F04B37/14

  to obtain high vacuum · CPC title

• B01D2258/0216

  from CVD treatment or semi-conductor manufacturing · CPC title

• B01D53/005 Primary

  by heat treatment · CPC title