Method for producing composite material
US-2024052186-A1 · Feb 15, 2024 · US
Composition for production of metal film, method for producing metal film and method for producing metal powder
US9624581B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9624581-B2 |
| Application number | US-200913121005-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 21, 2009 |
| Priority date | Oct 22, 2008 |
| Publication date | Apr 18, 2017 |
| Grant date | Apr 18, 2017 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A composition that includes a high-valent compound of copper, silver or indium; a linear, branched or cyclic C 1-18 alcohol; and a Group VIII metal catalyst forms a metal film of copper, silver or indium on a substrate when the composition is coated on the substrate and heated to reduce the high-valent compound. The composition may alternatively include metal particles of silver, copper or indium in which the surface layer of the particle includes a high-valent compound of copper, silver or indium. A metal film of copper, silver or indium may also be formed on a substrate by coating a substrate with the composition including the metal particles, and heating to reduce the high-valent compound in the same manner as above.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method for producing a copper metal film, the method comprising: forming a coating film of a composition on a substrate, the composition comprising: a high-valent compound of copper selected from the group consisting of copper(I) oxide, and copper(I) nitride; glycerin; and dichlorotris(triphenylphosphine) ruthenium, triruthenium dodecacarbonyl, dihydrido (dinitrogen) tris (triphenylphosphine) ruthenium, or dichloro(ethylenediamine) bis (tri-p-tolylphosphine) ruthenium; and heating the substrate coated with the coating film to reduce the high-valent compound.
Assignees
Inventors
Classifications
- C23C18/08Primary
characterised by the deposition of metallic material · CPC title
- H01B1/026Primary
Alloys based on copper · CPC title
Apparatus or processes specially adapted for manufacturing conductors or cables · CPC title
Supplementary information concerning processes or compositions relating to powder metallurgy · CPC title
mainly consisting of metals or alloys · CPC title
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Frequently asked questions
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- What does patent US9624581B2 cover?
- A composition that includes a high-valent compound of copper, silver or indium; a linear, branched or cyclic C 1-18 alcohol; and a Group VIII metal catalyst forms a metal film of copper, silver or indium on a substrate when the composition is coated on the substrate and heated to reduce the high-valent compound. The composition may alternatively include metal particles of silver, copper or ind…
- Who is the assignee on this patent?
- Yamakawa Tetsu, Oshima Noriaki, Kawabata Takahiro, and 4 more
- What technology area does this patent fall under?
- Primary CPC classification C23C18/08. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Apr 18 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).