Wafer chuck
US-2016020128-A1 · Jan 21, 2016 · US
US9623679B1 · US · B1
| Field | Value |
|---|---|
| Publication number | US-9623679-B1 |
| Application number | US-201514944940-A |
| Country | US |
| Kind code | B1 |
| Filing date | Nov 18, 2015 |
| Priority date | Nov 18, 2015 |
| Publication date | Apr 18, 2017 |
| Grant date | Apr 18, 2017 |
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Methods and devices for creating an electrostatic force. An electrostatic platen device includes a continuous conductive layer; a first dielectric layer provided on a first surface of the continuous conductive layer; and a second dielectric layer provided on a second surface of the continuous conductive layer opposite to the first surface of the conductive layer. A power source is electrically coupled to the continuous conductive layer to generate an electric tacking field.
Opening claim text (preview).
What is claimed is: 1. An electrostatic platen device for an ink printing device, the electrostatic platen device comprising: a printing area over which a printing material is positioned during an ink printing process; a position outside the printing area; a continuous conductive layer having an unperforated printing area, wherein the continuous conductive layer comprises a continuous conductive material that is free from holes therethrough within an entirety of the printing area and is uninterrupted in extent within the entirety of the printing area; a first dielectric layer provided on a first surface of the continuous conductive layer; a second dielectric layer provided on a second surface of the continuous conductive layer opposite to the first surface of the conductive layer; and a power source electrically coupled to the continuous conductive layer to generate an electric field. 2. The electrostatic platen device of claim 1 , further comprising: a thermal spreader layer provided on a first surface of the second dielectric layer that is opposite to a second surface of the second dielectric layer on which the continuous conductor layer is provided; a third dielectric layer provided on a first surface of the thermal spreader layer that is opposite to a second surface of the thermal spreader layer on which the second dielectric layer is provided; a thermal layer provided on a first surface of the third dielectric layer that is opposite to a second surface of the third dielectric layer on which the thermal spreader layer is provided; and a fourth dielectric layer provided on a first surface of the thermal layer that is opposite to a second surface of the thermal layer on which the third dielectric layer is provided. 3. The electrostatic platen device of claim 2 , further comprising: a thermal temperature sensor provided on the thermal spreader layer. 4. The electrostatic platen device of claim 2 , further comprising: heating circuitry provided on the thermal layer. 5. The electrostatic platen device of claim 2 , further comprising: an insulation layer provided on a first surface of the fourth dielectric layer that is opposite to a second surface of the second dielectric layer on which the thermal layer is provided. 6. The electrostatic platen device of claim 1 , further comprising: an insulation layer provided on a first surface of the second dielectric layer that is opposite to a second surface of the second dielectric layer on which the continuous conductive layer is provided. 7. The electrostatic platen device of claim 1 , wherein the continuous conductive layer is made substantially of aluminum. 8. The electrostatic platen device of claim 1 , wherein the dielectric layers are made substantially of Kapton. 9. The electrostatic platen device of claim 2 , wherein the thermal spreader layer is made substantially of copper. 10. The electrostatic platen device of claim 1 , further comprising: a support frame having provided thereon the second dielectric layer. 11. An electrostatic platen device for an ink printing device, the electrostatic platen device comprising: a printing area over which a printing material is positioned during an ink printing process; a position outside the printing area; a continuous conductive layer having an unperforated printing area, wherein the continuous conductive layer comprises a continuous conductive material that is free from holes therethrough within an entirety of the printing area and is uninterrupted in extent within the entirety of the printing area; a first dielectric layer provided on a first surface of the continuous conductive layer; a second dielectric layer provided on a second surface of the continuous conductive layer opposite to the first surface of the conductive layer; a thermal spreader layer provided on a first surface of the second dielectric layer that is opposite to a second surface of the second dielectric layer on which the continuous conductor layer is provided; a third dielectric layer provided on a first surface of the thermal spreader layer that is opposite to a second surface of the thermal spreader layer on which the second dielectric layer is provided; a thermal layer provided on a first surface of the third dielectric layer that is opposite to a second surface of the third dielectric layer on which the thermal spreader layer is provided; and a fourth dielectric layer provided on a first surface of the thermal layer that is opposite to a second surface of the thermal layer on which the third dielectric layer is provided. 12. The electrostatic platen device of claim 11 , further comprising: a thermal temperature sensor provided on the thermal spreader layer. 13. The electrostatic platen device of claim 11 , further comprising: heating circuitry provided on the thermal layer. 14. The electrostatic platen device of claim 13 , wherein the heating circuitry includes a plurality of heaters. 15. The electrostatic platen device of claim 11 , further comprising: a thermal insulation layer provided on a first surface of the fourth dielectric layer that is opposite to a second surface of the forth dielectric layer on which the thermal layer is provided. 16. The electrostatic platen device of claim 15 , wherein the thermal insulation layer is made substantially of fiberglass. 17. The electrostatic platen device of claim 11 , wherein the continuous conductive layer is made substantially of aluminum. 18. The electrostatic platen device of claim 11 , wherein the dielectric layers are made substantially of Kapton. 19. The electrostatic platen device of claim 11 , wherein the thermal spreader layer is made substantially of copper. 20. The electrostatic platen device of claim 11 , further comprising: a support frame having provided thereon the fourth dielectric layer.
Platens · CPC title
Flat page-size platens {or smaller flat platens having a greater size than line-size platens (B41J11/0085 takes precedence)} · CPC title
for marking on special material · CPC title
Controlling the temperature of the conduction means · CPC title
Means for heating the copy materials before or during printing · CPC title
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