Molding packaging material and battery case

US9623629B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9623629-B2
Application numberUS-201214007653-A
CountryUS
Kind codeB2
Filing dateMar 29, 2012
Priority dateMar 29, 2011
Publication dateApr 18, 2017
Grant dateApr 18, 2017

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

Provided is a molding packaging material that can have an increased use life, can suppress a decrease over time in inter-layer lamination strength, and has superior molding properties in extrusion molding, draw forming, and the like. The laminate molding packaging material contains: an outside substrate layer ( 2 ) comprising a heat-resistant resin; an inside sealant layer ( 3 ) comprising a thermoplastic resin; and a metal foil provided between the two layers as a barrier layer ( 4 ). In the heat-resistant resin of the outside substrate layer ( 2 ), a biaxially oriented polyethyleneterephthalate film is used that, when the tensile breaking strength in the M direction is MB and the tensile breaking strength in the T direction is TB, the following are satisfied: 500 MPa= MB+TB =700 MPa; and  formula (I) | MB−TB |=30 MPa.  formula (II)

First claim

Opening claim text (preview).

The invention claimed is: 1. A molding packaging material, comprising: an outside substrate layer containing a heat-resistant resin; an inside sealant layer containing a thermoplastic resin; a metallic foil as a barrier layer provided between the outside substrate layer and the inside sealant layer; and an inside adhesion resin layer; wherein the outside substrate layer contains a biaxially oriented polyethylene terephthalate film, and the biaxially oriented polyethylene terephthalate film satisfies the following Expressions (I) and (II), 500 MPa≦ MB+TB≦ 700 MPa  Expression (I) | MB−TB|≦ 30 MPa  Expression (II) the MB is a tensile breaking strength in a direction M of the biaxially oriented polyethylene terephthalate film and the TB is a tensile breaking strength in a direction T of the biaxially oriented polyethylene terephthalate film; the inside adhesion resin layer contains an adhesive containing a multifunctional isocyanate compound and a polyolefin resin having a carboxyl group, which is a modified polyolefin resin of graft polymerized ethylenic unsaturated carboxylic acid or an acid anhydride thereof with polyolefin, or a copolymerization resin of an olefin monomer and ethylenic unsaturated carboxylic acid, such that the inside adhesion resin layer has adhesiveness to both the metallic foil and the thermoplastic resin of the inside sealant layer; the inside sealant layer contains a propylene homopolymer or a copolymer containing at least propylene and ethylene as a copolymerization component; and the inside sealant layer is a polymer or copolymer having a melting point of 130° C. to 160° C. and an MFR of 1 to 25 g/10 min. 2. A battery case, which is obtained by performing deep draw forming or bulging of the molding packaging material according to claim 1 . 3. The molding packaging material according to claim 1 , which is used as a packaging material for foods or pharmaceuticals. 4. The molding packaging material according to claim 1 , wherein the polyolefin resin having the carboxyl group is a modified polyolefin resin of graft polymerized ethylenic unsaturated carboxylic acid or an acid anhydride thereof with a homopolymer of polypropylene or a copolymer of propylene and ethylene.

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What does patent US9623629B2 cover?
Provided is a molding packaging material that can have an increased use life, can suppress a decrease over time in inter-layer lamination strength, and has superior molding properties in extrusion molding, draw forming, and the like. The laminate molding packaging material contains: an outside substrate layer ( 2 ) comprising a heat-resistant resin; an inside sealant layer ( 3 ) comprising a th…
Who is the assignee on this patent?
Kuramoto Tetsunobu, MINAMIBORI Yuuji, Showa Denko Packaging Co Ltd
What technology area does this patent fall under?
Primary CPC classification H01M50/124. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Apr 18 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).