Method of encapsulating an electronic component

Patent metadata

Field	Value
Publication number	US-9623591-B2
Application number	US-201414760605-A
Country	US
Kind code	B2
Filing date	Jan 13, 2014
Priority date	Jan 15, 2013
Publication date	Apr 18, 2017
Grant date	Apr 18, 2017

Abstract

An encapsulated electronic assembly comprises an electronic component and a foamed thermoplastic shell disposed about the electronic component. The foamed thermoplastic shell is formed from a thermoplastic encapsulant comprising a thermoplastic resin and a filler and is foamed with a foaming agent. A method of encapsulating the electronic component to form the encapsulated electronic assembly is also provided. The method includes the steps of melting the thermoplastic encapsulant, foaming the thermoplastic encapsulant, and injection molding the foamed thermoplastic encapsulant about the electronic component to form the foamed thermoplastic shell.

First claim

What is claimed is:

1. A method of forming an encapsulated electronic assembly, said method comprising the steps of:
melting a thermoplastic encapsulant composition comprising polyamide and greater than 50 parts by weight of a filler based on 100 parts by weight of the composition;
foaming the melted composition;
injection molding the foamed composition against an electronic component; and
solidifying the injected composition to form a foamed thermoplastic shell encapsulating the electronic component, the shell being substantially free of cells at an outermost skin thereof and at portions thereof contacting the electronic component, with remaining interior portions of the shell comprising evenly dispersed generally uniform cells.

2. A method as set forth in claim 1 wherein the filler comprises talc.

3. A method as set forth in claim 1 wherein the step of foaming is further defined as injecting a physical foaming agent into the composition during the step of melting.

4. A method as set forth in claim 3 wherein the physical foaming agent is selected from the group of liquid carbon dioxide, liquid nitrogen, and combinations thereof and wherein the step of foaming is further defined as injecting into the composition from 0.1 to 0.8 parts by weight of the physical foaming agent based on 100 parts by weight of the composition.

5. A method as set forth in claim 1 wherein the composition comprises from 0.1 to 10 parts by weight of a chemical foaming agent based on 100 parts by weight of the composition and wherein the step of foaming is further defined as heating the composition to a temperature sufficient to decompose the chemical foaming agent included therein.

6. A method as set forth in claim 1 wherein the step of forming decreases density of the composition by from 2 to 40% as tested in accordance with ISO 1183.

7. A method as set forth in claim 1 wherein the generally uniform cells are generally uniform in size and shape.

8. A method as set forth in claim 1 wherein any cells arranged in the shell portions substantially free of cells are smaller and fewer in number than the evenly dispersed cells.

9. A method as set forth in claim 1 wherein the filler comprises one or more materials selected from the group consisting of talc, fumed silica, calcium carbonate, magnesium oxide, barium sulfate, kaolin clay, and glass spheres.

10. A method as set forth in claim 1 wherein the amount of filler is greater than 70 parts by weight based on 100 parts by weight of the composition.

11. A method as set forth in claim 1 wherein the amount of filler is from 65 to 85 parts by weight based on 100 parts by weight of the composition.

12. A method as set forth in claim 1 wherein said thermoplastic encapsulant composition has a coefficient of linear thermal expansion of less than 80×10 −6 mm/mm/° C. when tested in accordance with ISO 11359-1.

13. A method as set forth in claim 1 wherein an electrical connector is connected to said electronic component and extends through the foamed thermoplastic shell to provide electrical interconnection between said electronic component and an external device.

14. A method as set forth in claim 1 wherein said electronic component comprises a printed circuit board.

15. A method as set forth in claim 1 wherein said electronic component is selected from the group of a jump drive, an air bag module, a key fob, a seat module, an antenna module, an antenna, an electric power steering control, a suspension control, a Yaw rate sensor, a low tire pressure sensor, a crash sensor, a blind spot detection sensor, a wheel speed sensor, a door module, an ignition module, a transmission control module, a temperature sensor, a crank position sensor, a mass air flow sensor, an oxygen sensor, a cam sensor, and a power inverter subcomponent.

Assignees

• Basf Se

Inventors

• Colwell Harold
• Balke Inga Marie
• Dombrowski Lee Ann
• Lair Richard J
• Lange David M
• Wilms Axel

Classifications

• H05K2201/0116

  Porous, e.g. foam · CPC title

• B29C44/355 Primary

  Characteristics of the foam, e.g. having particular surface properties or structure · CPC title

• B29K2509/00

  Use of inorganic materials not provided for in groups {B29K2503/00 - B29K2507/00,} as filler · CPC title

• H05K5/0034

  having an overmolded housing covering the PCB · CPC title

• H05K5/065

  sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding · CPC title