Carrier-tape fabrication die and carrier-tape fabrication method

US9623582B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9623582-B2
Application numberUS-201314104910-A
CountryUS
Kind codeB2
Filing dateDec 12, 2013
Priority dateDec 14, 2012
Publication dateApr 18, 2017
Grant dateApr 18, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A die for fabricating a carrier tape such that the carrier tape is provided with a plurality of housing holes for housing electronic components therein in a state where the housing holes are arranged in a longitudinal direction and penetrates the carrier tape in a thickness direction. The die is less prone to be damaged and is less prone to induce breakages in the interval portions between the housing holes in the carrier tape. A male die includes housing-hole formation convex portions which are constituted by a plurality of first housing-hole formation convex portions having respective tip ends at a relatively-higher heightwise position, and a plurality of second housing-hole formation convex portions having respective tip ends at a relatively-lower heightwise position.

First claim

Opening claim text (preview).

What is claimed is: 1. A carrier-tape fabrication method comprising: preparing a tape material; preparing a carrier-tape fabrication die for use in fabricating a carrier tape from the tape material, the carrier tape being provided with a plurality of housing holes for housing an electronic component therein in a state where the housing holes are arranged in a longitudinal direction and penetrates the carrier tape in a thickness direction, including a male die and a female die which are provided such that the male die and the female die are brought together and separated from each other; the male die having a plurality of housing-hole formation convex portions arranged therein corresponding to the plurality of the housing holes to be formed, and the female die having a plurality of housing-hole formation concave portions arranged to receive the respective housing-hole formation convex portions; the housing-hole formation convex portions being adapted to be fitted into the housing-hole formation concave portions while punching a portion of the tape material, thereby forming the housing holes in the tape material, when the male die and the female die are brought into engagement with each other with the tape material sandwiched therebetween; the plurality of housing-hole formation convex portions including a plurality of first housing-hole formation convex portions having a tip end at a relatively-higher heightwise position, and a plurality of second housing-hole formation convex portions having a tip end at a relatively-lower heightwise position; and the plurality of housing-hole formation convex portions being arranged such that at least one of the second housing-hole formation convex portions is positioned between the two first housing-hole formation convex portions and the two first housing-hole formation convex portions are spaced from each other, wherein an interval portion between the housing holes has a smaller dimension than a dimension of the housing holes measured in a direction of arrangement of the housing holes, the carrier tape includes a plurality of feeding holes arranged in parallel with the longitudinal direction of the arrangement of the plurality of the housing holes, the male die has a plurality of protruding feeding-hole formation pins arranged therein corresponding to the plurality of the feeding holes to be formed, and the female die has a plurality of feeding-hole formation concave portions arranged to receive the respective feeding-hole formation pins, the feeding-hole formation pins are adapted to be fitted into the feeding-hole formation concave portions while punching a portion of the tape material, thereby forming the feeding holes in the tape material, when the male die and the female die are brought into engagement with each other with the tape material sandwiched therebetween, and the plurality of the feeding-hole formation pins include a pilot pin having a tip end at a higher heightwise position than a heightwise position of the tip ends of the other feeding-hole formation pins, and the pilot pin is positioned at one end of the plurality of feeding-hole formation pins; placing the tape material between the male die and the female die; and bringing the male die and the female die into engagement with other for forming housing holes in the tape material. 2. The carrier-tape fabrication method according to claim 1 , further comprising transferring the tape material by a predetermined distance in a longitudinal direction; wherein the steps of placing the tape material between the male die and the female die and bringing the male die and the female die into engagement with other for forming housing holes in the tape material are repeated after transferring the tape material by the predetermined distance in the longitudinal direction, and the transferring of the tape material by the predetermined distance in the longitudinal direction includes transferring the tape material such that the first housing-hole formation convex portion positioned at a starting end, in the transfer direction of the tape material, of the plurality of housing-hole formation convex portions, is fitted into the housing hole positioned at a termination end in the transfer direction of the tape material. 3. A carrier-tape fabrication die for use in fabricating a carrier tape from a tape material, the carrier tape being provided with a plurality of housing holes for housing an electronic component therein in a state where the housing holes are arranged in a longitudinal direction and penetrates the carrier tape in a thickness direction, the carrier-tape fabrication die comprising: a male die and a female die which are provided such that the male die and the female die are brought together and separated from each other; the male die having a plurality of housing-hole formation convex portions arranged therein corresponding to the plurality of the housing holes to be formed, and the female die having a plurality of housing-hole formation concave portions arranged to receive the respective housing-hole formation convex portions; the housing-hole formation convex portions being adapted to be fitted into the housing-hole formation concave portions while punching a portion of the tape material, thereby forming the housing holes in the tape material, when the male die and the female die are brought into engagement with each other with the tape material sandwiched therebetween; the plurality of housing-hole formation convex portions including a plurality of first housing-hole formation convex portions having a tip end at a relatively-higher heightwise position, and a plurality of second housing-hole formation convex portions having a tip end at a relatively-lower heightwise position; and the plurality of housing-hole formation convex portions being arranged such that at least one of the second housing-hole formation convex portions is positioned between the two first housing-hole formation convex portions and the two first housing-hole formation convex portions being spaced from each other, wherein an interval portion between the housing holes has a smaller dimension than a dimension of the housing holes measured in a direction of arrangement of the housing holes, the carrier tape includes a plurality of feeding holes arranged in parallel with the longitudinal direction of the arrangement of the plurality of the housing holes, the male die has a plurality of protruding feeding-hole formation pins arranged therein corresponding to the plurality of the feeding holes to be formed, and the female die has a plurality of feeding-hole formation concave portions arranged to receive the respective feeding-hole formation pins, the feeding-hole formation pins are adapted to be fitted into the feeding-hole formation concave portions while punching a portion of the tape material, thereby forming the feeding holes in the tape material, when the male die and the female die are brought into engagement with each other with the tape material sandwiched therebetween, and the plurality of the feeding-hole formation pins include a pilot pin having a tip end at a higher heightwise position than a heightwise position of the tip ends of the other feeding-hole formation pins, and the pilot pin is positioned at one end of the plurality of feeding-hole formation pins. 4. The carrier-tape fabrication die according to claim 3 , wherein the first housing-hole formation convex portions are positioned at least at opposite ends of the plurality of the housing-hole formation convex portions. 5. The carrier-tape fabrication die according to claim 3 , wherein the first housing-hole formation convex portions and the second housing-hole formation convex portions are alternately arranged. 6. The carrier-tape fabrication die

Assignees

Inventors

Classifications

  • having special lateral or edge outlines or special surface shapes, e.g. apertures · CPC title

  • Processes · CPC title

  • Tool pair · CPC title

  • B26F1/14Primary

    Punching tools; Punching dies · CPC title

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Frequently asked questions

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What does patent US9623582B2 cover?
A die for fabricating a carrier tape such that the carrier tape is provided with a plurality of housing holes for housing electronic components therein in a state where the housing holes are arranged in a longitudinal direction and penetrates the carrier tape in a thickness direction. The die is less prone to be damaged and is less prone to induce breakages in the interval portions between the …
Who is the assignee on this patent?
Murata Manufacturing Co
What technology area does this patent fall under?
Primary CPC classification B26F1/14. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Apr 18 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).