Component carrier assembly having a trench structure which separates component carrier regions, and method for producing a plurality of component carrier regions

Patent metadata

Field	Value
Publication number	US-9623527-B2
Application number	US-201114115854-A
Country	US
Kind code	B2
Filing date	May 6, 2011
Priority date	May 6, 2011
Publication date	Apr 18, 2017
Grant date	Apr 18, 2017

Abstract

A component carrier assembly ( 1 ) is provided which has a plurality of component carrier regions ( 10 ), which are intended for mounting semiconductor components. The component carrier assembly comprises a carrier body ( 2 ) with a first major face ( 21 ). On the first major face a trench pattern ( 3 ) is formed in the carrier body, with first trenches ( 31 ) extending parallel to one another in a first direction, the first trenches delimiting the component carrier regions in a second direction extending transversely of the trenches. A coating ( 4 ) is formed on the carrier body, such that the component carrier regions each have a first major face of the carrier body which is coated at least in places and a side face ( 5 ) of the trench pattern which is coated at least in places.

First claim

The invention claimed is:

1. A component carrier assembly comprising:
a plurality of component carrier regions, which are intended for mounting semiconductor components,
wherein:
the component carrier assembly comprises a carrier body with a first major face and a second major face opposite the first major face,
on the first major face a trench pattern is formed in the carrier body, with first trenches extending in a first direction, the first trenches delimiting the component carrier regions in a second direction extended transversely of the trenches,
a coating is formed on the carrier body, such that the component carrier regions each have a first major face of the carrier body which is coated at least in places and a side face of the trench pattern which is coated at least in places,
the carrier body is based on a semiconductor material,
the first trenches do not extend to an edge of the carrier body, the carrier body being of continuous construction,
the second major face of the carrier body is free of material of the coating, and
the carrier body is formed as a single and contiguous piece.

2. The component carrier assembly according to claim 1 , wherein at least two side faces of a component carrier region are coated.

3. The component carrier assembly according to claim 1 , wherein component carrier regions arranged adjacent one another in the second direction are separated from one another in the continuous carrier body by one of the first trenches.

4. The component carrier assembly according to claim 1 , wherein the trench pattern comprises second trenches extending parallel to one another in the second direction, the second trenches delimiting the component carrier regions in the first direction.

5. A method for producing a plurality of component carrier regions, comprising the steps of:
a) providing a component carrier comprising a carrier body having a first major face and a second major face opposite the first major face;
b) forming a trench pattern in the carrier body in the first major face, wherein the trench pattern comprises first trenches extending in a first direction, which first trenches separate from one another at least in places the component carrier regions arranged adjacent one another in a second direction extending transversely of the first direction;
c) forming a coating, which covers the first major face at least in places and a side face of the trench pattern at least in places; and
d) thinning the carrier body at the second major face in such a way that the trench pattern extends completely through the carrier body at least in places in a direction extending obliquely or perpendicularly to the first major face,
wherein:
the first trenches do not extend to an edge of the carrier body,
the component carrier comprises a continuous carrier body forming a plurality of component carrier regions,
the thinning of the carrier body in step d) is performed after step b), and is performed over the entire area of the second major face of the carrier body.

6. The method according to claim 5 , wherein the coating in step c) is formed by means of a coating source and a main coating direction of the coating source is oblique to a normal to the first major face.

7. The method according to claim 6 , wherein the carrier body is thinned in step d) over its entire area.

8. The method according to claim 5 , wherein the trench pattern is formed using a dry chemical method or using erosion.

9. The method according to claim 5 , wherein components are mounted on the component carrier, the components being operated prior to singulation.

10. The method according to claim 5 , wherein the carrier body is thinned in step d) mechanically.

11. The method according to claim 5 , wherein the carrier body is thinned by grinding, lapping or polishing.

12. A component carrier assembly comprising a plurality of component carrier regions, which are intended for mounting semiconductor components,
wherein:
the component carrier assembly comprises a carrier body with a first major face and a second major face opposite the first major face,
on the first major face a trench pattern is formed in the carrier body, with first trenches extending in a first direction, the first trenches delimiting the component carrier regions in a second direction extended transversely of the trenches,
a coating is formed on the carrier body, such that the component carrier regions each have a first major face of the carrier body which is coated at least in places and a side face of the trench pattern which is coated at least in places,
the carrier body is based on a semiconductor material,
the first trenches do not extend to an edge of the carrier body, the carrier body being of continuous construction, and
the second major face of the carrier body is free of material of the coating,
the carrier body is formed as a single and contiguous piece, and
the first trenches extend completely through the carrier body in a direction that extends vertically to the first major face.

Assignees

• Dachs Jürgen
• Osram Opto Semiconductors Gmbh

Inventors

• Dachs Jürgen

Classifications

• H10P74/20

  characterised by the properties tested or measured, e.g. structural or electrical properties · CPC title

• H10P72/7418

  of passive members, e.g. a chip mounting substrate · CPC title

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10P72/7402

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• H10P72/74 Primary

  using temporarily an auxiliary support · CPC title