High density networking shelf and system
US-2016050796-A1 · Feb 18, 2016 · US
US9622388B1 · US · B1
| Field | Value |
|---|---|
| Publication number | US-9622388-B1 |
| Application number | US-201615019991-A |
| Country | US |
| Kind code | B1 |
| Filing date | Feb 10, 2016 |
| Priority date | Feb 10, 2016 |
| Publication date | Apr 11, 2017 |
| Grant date | Apr 11, 2017 |
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Systems and methods for providing airflow in an electronic chassis supporting operation in an extended temperature range for components therein include providing airflow in a first configuration in high-temperature operation; and providing airflow in a second configuration, different from the first configuration, in low-temperature operation, wherein the airflow in the second configuration is directed to provide preheated air to one or more components in the electronic chassis which support operation in a limited temperature range, to enable operation of the one or more components in the extended temperature range.
Opening claim text (preview).
What is claimed is: 1. A method of providing airflow in an electronic chassis supporting operation in an extended temperature range for components therein, the method comprising: providing airflow in a first configuration in high-temperature operation; and providing airflow in a second configuration, different from the first configuration, in low-temperature operation, wherein the airflow in the second configuration is directed to provide preheated air to one or more components in the electronic chassis that operate in a limited temperature range, to enable operation of the one or more components in the extended temperature range; wherein the limited temperature range is a smaller range than the extended temperature range, and wherein the second configuration extends the operation of the one or more components from the limited temperature range to the extended temperature range. 2. The method of claim 1 , wherein the airflow in the second configuration is provided first over heat-generating electronics before being provided to the one or more components, to heat the one or more components in the low-temperature operation. 3. The method of claim 1 , wherein the airflow in the first configuration is provided by a first set of fans and the airflow in the second configuration is provided by a second set of fans. 4. The method of claim 3 , wherein the first set of fans are located at a rear section of the electronic chassis and is configured to draw air from a front of the electronic chassis through an interior of the electronic chassis, and wherein the second set of fans are located in the interior configured to draw air from the interior and exhaust air in the front. 5. The method of claim 3 , wherein the second set of fans are coupled to an air duct with an air turning foil to guide air firstly over heat-generating electronics and secondly over the one or more components. 6. The method of claim 1 , wherein the airflow in the first configuration is provided by a set of fans operating in a forward direction and the airflow in the second configuration is provided by the set of fans operating in a reverse direction. 7. The method of claim 1 , wherein the one or more components comprise optical modules comprising one of a C Small Form Factor Pluggable 4 (CFP4) and a Quad Small Form Factor Pluggable (QSFP). 8. The method of claim 1 , wherein the preheated air is preheated by one or more of electronics in the electronic chassis and a heater. 9. An electronic chassis adapted to support operation in an extended temperature range for components therein, the electronic chassis comprising: a first set of fans adapted to provide airflow in a first configuration in high-temperature operation; and a second set of fans adapted to provide airflow in a second configuration, different from the first configuration, in low-temperature operation, wherein the airflow in the second configuration is directed to provide preheated air to one or more components in the electronic chassis that operate in a limited temperature range, to enable operation of the one or more components in the extended temperature range; wherein the limited temperature range is a smaller range than the extended temperature range, and wherein the second configuration extends the operation of the one or more components from the limited temperature range to the extended temperature range. 10. The electronic chassis of claim 9 , wherein the airflow in the second configuration is provided first over heat-generating electronics before being provided to the one or more components, to heat the one or more components in the low-temperature operation. 11. The electronic chassis of claim 9 , wherein the first set of fans are located at a rear section of the electronic chassis and is configured to draw air from a front of the electronic chassis through an interior of the electronic chassis, and wherein the second set of fans are located in the interior configured to draw air from the interior and exhaust air in the front. 12. The electronic chassis of claim 9 , wherein the second set of fans are coupled to an air duct with an air turning foil to guide air firstly over heat-generating electronics and secondly over the one or more components. 13. The electronic chassis of claim 9 , wherein the one or more components comprise optical modules comprising one of a C Small Form Factor Pluggable 4 (CFP4) and a Quad Small Form Factor Pluggable (QSFP). 14. The electronic chassis of claim 9 , wherein the preheated air is preheated by one or more of electronics in the electronic chassis and a heater. 15. An apparatus adapted to provide airflow in an electronic chassis supporting operation in an extended temperature range for components therein, the apparatus comprising: circuitry adapted to cause airflow in a first configuration in high-temperature operation; and circuitry adapted to cause airflow in a second configuration, different from the first configuration, in low-temperature operation, wherein the airflow in the second configuration is directed to provide preheated air to one or more components in the electronic chassis that operate in a limited temperature range, to enable operation of the one or more components in the extended temperature range; wherein the limited temperature range is a smaller range than the extended temperature range, and wherein the second configuration extends the operation of the one or more components from the limited temperature range to the extended temperature range. 16. The apparatus of claim 15 , wherein the airflow in the second configuration is provided first over heat-generating electronics before being provided to the one or more components, to heat the one or more components in the low-temperature operation. 17. The apparatus of claim 15 , wherein the airflow in the first configuration is provided by a first set of fans and the airflow in the second configuration is provided by a second set of fans. 18. The apparatus of claim 15 , wherein the airflow in the first configuration is provided by a set of fans operating in a forward direction and the airflow in the second configuration is provided by the set of fans operating in a reverse direction.
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