Graphics card cooler

Patent metadata

Field	Value
Publication number	US-9622386-B2
Application number	US-201514729010-A
Country	US
Kind code	B2
Filing date	Jun 2, 2015
Priority date	Jun 2, 2014
Publication date	Apr 11, 2017
Grant date	Apr 11, 2017

Abstract

A bracket for cooling a peripheral component interconnect card is disclosed. The bracket includes a plurality of heat transfer surfaces, mounting systems for a blower fan, fan shroud and liquid cooling system for cooling the peripheral component interconnect card.

First claim

I claim:

1. A bracket with heat transfer properties, the bracket comprising:
a plurality of heat transfer surfaces wherein at least a first part of the plurality of heat transfer surfaces make contact with one or more heat sources on a graphics card when the bracket is mounted on the graphics card,
wherein:
the bracket includes a first set of screw holes for a blower fan to be mounted on the bracket;
the bracket includes a second set of screw holes for a fan shroud to be mounted on the bracket, wherein the fan shroud directs airflow from the blower fan to flow over a second part of the plurality of heat transfer surfaces to cool the second part of the plurality of heat transfer surfaces when the fan shroud and the blower fan are mounted on the bracket and when the blower fan is turned on;
the bracket includes a cut-out portion and a third set of screw holes for attachment of a liquid cooling system, wherein the third set of screw holes has a location and sizing that is specific to any one of: an Intel mounting pattern for liquid coolers, and an AMD mounting pattern for liquid coolers, and
wherein the cut-out portion allows the liquid cooling system to cool a processing unit chip of the graphics card when the bracket is mounted on the graphics card and when the liquid cooling system is mounted over the graphics card; and
the bracket includes side walls that directs airflow from the fan blower to flow over the plurality of heat transfer surfaces.

2. The bracket of claim 1 , wherein one or more of the plurality of heat transfer surfaces has thermal pads applied to the bottom of the one or more of the plurality of heat transfer surfaces.

3. The bracket of claim 1 , wherein one or more of the plurality of heat transfer surfaces has thermal grease applied to the one or more of the plurality of heat transfer surfaces.

4. The bracket of claim 1 is a stamped bracket made of material with thermal conductivity in the range of 50 watts per meter Kelvin to 400 watts per meter Kelvin.

5. The bracket of claim 1 is a stamped bracket made of material with thermal conductivity in the range of 80 watts per meter Kelvin to 200 watts per meter Kelvin.

6. The bracket of claim 2 , wherein the thermal pads have a thermal conductivity in the range of 1 watt per meter Kelvin to 6 watts per meter Kelvin.

7. The bracket of claim 2 , wherein the thermal pads have a thermal conductivity in the range of 2 watts per meter Kelvin to 3 watts per meter Kelvin.

8. The bracket of claim 3 , wherein the thermal grease has a thermal conductivity in the range of 1 watt per meter Kelvin to 6 watts per meter Kelvin.

9. The bracket of claim 3 , wherein the thermal grease has a thermal conductivity in the range of 2 watts per meter Kelvin to 3 watts per meter Kelvin.

10. The bracket of claim 2 , wherein the thermal pads have a compression range between 20% to 50%.

Assignees

• Corsair Memory Inc

Inventors

• Kinstle Iii Robert Michael

Classifications

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K7/20172

  Fan mounting or fan specifications · CPC title

• G06F2200/201

  Cooling arrangements using cooling fluid · CPC title

• H05K2201/066

  Heatsink mounted on the surface of the printed circuit board [PCB] · CPC title

• H05K7/20509 Primary

  Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures · CPC title