Electronics housing assembly
US-2024397637-A1 · Nov 28, 2024 · US
Housing-side separating layer for the stress decoupling of potted electronics
US9622372B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9622372-B2 |
| Application number | US-201214009414-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 4, 2012 |
| Priority date | Apr 7, 2011 |
| Publication date | Apr 11, 2017 |
| Grant date | Apr 11, 2017 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
The invention relates to a device, which includes a substrate for carrying an electrical circuit, a housing for enclosing the substrate, and a potting compound accommodated in the housing, which potting compound at least partially encloses the substrate. The potting compound can adhere to the housing. Furthermore, the device has a wall, from which the potting compound can detach.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method for producing an apparatus having a substrate for supporting an electrical circuit and having a housing, the housing having a housing top side and interior walls including a housing interior bottom side, the housing top side being situated opposite the housing interior bottom side and comprising a housing opening for enclosing the substrate, the method comprising: plasma treating the interior walls of the housing with a plasma activation without plasma treating the housing interior bottom side, and pouring the potting compound into the housing and onto the interior walls and the housing interior bottom side, wherein the potting compound can adhere to the plasma treated interior walls of the housing without adhering to the housing interior bottom side that is not plasma treated. 2. The method of claim 1 , further comprising plasma treating top and bottom surfaces of the substrate with the plasma activation. 3. The method of claim 2 , wherein the plasma treating steps comprise supplying heated material in a gaseous state that is electrically conductive. 4. The method of claim 1 , further comprising plasma treating a surface of the substrate that faces the housing bottom side with the plasma activation.
Assignees
Inventors
Classifications
- H05K5/0056Primary
characterized by features for protecting electronic components against vibration and moisture, e.g. potting, holders for relatively large capacitors · CPC title
sealed by potting, e.g. waterproof resin poured in a rigid casing · CPC title
- H05K7/14Primary
Mounting supporting structure in casing or on frame or rack · CPC title
Hermetically-sealed casings {(specially adapted for small components H05K5/0095)} · CPC title
- H05K5/00Primary
Casings, cabinets or drawers for electric apparatus · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9622372B2 cover?
- The invention relates to a device, which includes a substrate for carrying an electrical circuit, a housing for enclosing the substrate, and a potting compound accommodated in the housing, which potting compound at least partially encloses the substrate. The potting compound can adhere to the housing. Furthermore, the device has a wall, from which the potting compound can detach.
- Who is the assignee on this patent?
- Schillinger Jakob, Huber Dietmar, Theobald Dirk, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H05K5/0056. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 11 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).