Multilayer wiring board with enclosed Ur-variant dual conductive layer

Patent metadata

Field	Value
Publication number	US-9622344-B2
Application number	US-201314391748-A
Country	US
Kind code	B2
Filing date	Feb 28, 2013
Priority date	Apr 11, 2012
Publication date	Apr 11, 2017
Grant date	Apr 11, 2017

Abstract

A multi-layer wiring board includes wiring layers stacked on a substrate with an insulating layer between each layer. A wire formed in the wiring layer consists of a first layer and a second layer to form a double layered structure. The first layer is made of a first conductive material and the second layer is made of a second conductive material having relative magnetic permeability of 10 or more and larger than that of the first conductive material. The characteristic impedance of the wire is adjusted to a value closer to 50 ohms than that of a wire which has the same thickness as of the wire with the double layered structure, and is made only of the first conductive material.

First claim

What is claimed is:

1. A multi-layer wiring board, in which more than one wiring layers are stacked on a substrate with an insulating layer between them,
wherein a wire formed in the wiring layer consists of a first layer and a second layer to form a double layered structure, and said first layer is made of a first conductive material and said second layer is made of a second conductive material having relative magnetic permeability of 10 or more and larger than that of the first conductive material,
thereby the characteristic impedance of said wire is adjusted to a value closer to 50 ohm than that of a wire which has the same thickness as of said wire having the double layered structure, and is made of said first conductive material only.

2. A multi-layer wiring board of claim 1 , wherein the first conductive material is copper or silver, and the second conductive material is nickel, cobalt, or an alloy comprising nickel and/or cobalt.

3. A multi-layer wiring board of claim 1 , wherein the width of the wire is not less than 10 μm, but not more than 25 μm, the thickness of the first layer is not less than 6 μm, but not more than 20 μm, and the thickness of the second layer is not less than 5%, but not more than 50% of the thickness of the first layer.

4. A multi-layer wiring board of claim 1 wherein the second layer is placed at a position further from the substrate than the first layer.

5. A multi-layer wiring board of claim 1 , wherein the material which forms the insulating layer is polyimide.

6. A multi-layer wiring board of claim 1 , wherein the wire has at least one layer made of a third conductive material having a relative magnetic permeability of 10 or more and larger than that of the first conductive material as a third layer in addition to the first layer and the second layer to form a multi-layered structure, thereby the characteristic impedance of the wire is adjusted to a value closer to 50 ohm than that of a wire having the same thickness as the wire of the multi-layered structure and is made of the first conductive material only.

7. A multi-layer wiring board of claim 6 , wherein the third conductive material is nickel, cobalt, or an alloy comprising nickel and/or cobalt.

8. A process for manufacturing a multi-layer wiring board of claim 1 , in which more than one wiring layers are stacked on a substrate with an insulating layer between them, comprising the following steps in a process for forming a wire in the wiring layer;
a step of forming a first layer using a first conductive material, and
a step of forming a second layer, which stacks together with the first layer, using a second conductive material having a relative magnetic permeability of 10 or more and larger than that of the first conductive material, thereby adjusting the characteristic impedance of the wire to a value closer to 50 ohm than the characteristic impedance of a wire having the thickness of the sum of the thicknesses of the first and the second layers, and is made of said first conductive material only.

9. A process for manufacturing a multi-layer wiring board of claim 6 , in which more than one wiring layers are stacked on a substrate with an insulating layer between them, comprising the following steps in a process for forming a wire in the wiring layer;
a step of forming a first layer using a first conductive material, and
a step of forming a second layer and at least one third layer, which stack together with the first layer, using a second conductive material and a third conductive material, respectively, both having a relative magnetic permeability of 10 or more and larger than that of the first conductive material, thereby adjusting the characteristic impedance of the wire to a value closer to 50 ohm than the characteristic impedance of a wire having the thickness of the sum of the thicknesses of the first, the second and the third layers, and is made of said first conductive material only.

10. A probe card, which equips with a multi-layer wiring board of claim 1 .

11. A multi-layer wiring board of claim 3 , wherein the wire has at least one layer made of a third conductive material having a relative magnetic permeability of 10 or more and larger than that of the first conductive material as a third layer in addition to the first layer and the second layer to form a multi-layered structure, thereby the characteristic impedance of the wire is adjusted to a value closer to 50 ohm than that of a wire having the same thickness as the wire of the multi-layered structure and is made of the first conductive material only.

12. A multi-layer wiring board of claim 11 , wherein the third conductive material is nickel, cobalt, or an alloy comprising nickel and/or cobalt.

13. A multi-layer wiring board of claim 5 , wherein the wire has at least one layer made of a third conductive material having a relative magnetic permeability of 10 or more and larger than that of the first conductive material as a third layer in addition to the first layer and the second layer to form a multi-layered structure, thereby the characteristic impedance of the wire is adjusted to a value closer to 50 ohm than that of a wire having the same thickness as the wire of the multi-layered structure and is made of the first conductive material only.

14. A multi-layer wiring board of claim 13 , wherein the third conductive material is nickel, cobalt, or an alloy comprising nickel and/or cobalt.

15. A process for manufacturing a multi-layer wiring board of claim 3 , in which more than one wiring layers are stacked on a substrate with an insulating layer between them, comprising the following steps in a process for forming a wire in the wiring layer;
a step of forming a first layer using a first conductive material, and
a step of forming a second layer, which stacks together with the first layer, using a second conductive material having a relative magnetic permeability of 10 or more and larger than that of the first conductive material, thereby adjusting the characteristic impedance of the wire to a value closer to 50 ohm than the characteristic impedance of a wire having the thickness of the sum of the thicknesses of the first and the second layers, and is made of said first conductive material only.

16. A process for manufacturing a multi-layer wiring board of claim 5 , in which more than one wiring layers are stacked on a substrate with an insulating layer between them, comprising the following steps in a process for forming a wire in the wiring layer;
a step of forming a first layer using a first conductive material, and
a step of forming a second layer, which stacks together with the first layer, using a second conductive material having a relative magnetic permeability of 10 or more and larger than that of the first conductive material, thereby adjusting the characteristic impedance of the wire to a value closer to 50 ohm than the characteristic impedance of a wire having the thickness of the sum of the thicknesses of the first and the second layers, and is made of said first conductive material only.

17. A probe card, which equips with a multi-layer wiring board of claim 2 .

18. A probe card, which equips with a multi-layer wiring board of claim 3 .

19. A probe card, which equips with a multi-layer wiring board of claim 5 .

20. A probe card, which equips with a multi-layer wiring board of claim 6 .

21. A probe card, which equips with a multi-layer wiring board of claim 7 .

Assignees

• Nihon Micronics Kk

Inventors

• Inoue Tatsuo
• Sugai Takayasu
• Kudo Toshiyuki
• OMORI Toshinori

Classifications

• H05K1/025

  Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance (H05K1/024 and H05K1/0243 take precedence; for semiconductor devices H10W44/20) · CPC title

• Y10T29/49155

  Manufacturing circuit on or in base · CPC title

• H05K2201/0792

  Means against parasitic impedance; Means against eddy currents · CPC title

• H05K2201/0776

  Resistance and impedance · CPC title

• H05K1/0233

  Filters, inductors or a magnetic substance · CPC title