Routing design for high speed input/output links

Patent metadata

Field	Value
Publication number	US-9622339-B2
Application number	US-201213610663-A
Country	US
Kind code	B2
Filing date	Sep 11, 2012
Priority date	Sep 11, 2012
Publication date	Apr 11, 2017
Grant date	Apr 11, 2017

Abstract

Certain embodiments relate to routing structures and their formation. In one embodiment a routing structure includes a first region including a first layer comprising alternating signal traces and ground traces separated by a dielectric. The first region also includes a second layer including alternating signal traces and ground traces separated by a dielectric, wherein the second layer signal positioned over the first layer ground traces, and the second layer ground traces positioned over the first layer signal traces. The first region may also include additional layers of alternating signal and ground traces. The first region may also be formed with the ground traces having a width that is larger than that of the signal traces. The routing structure may also include a second region including pads to which the traces are coupled. Other embodiments are described and claimed.

First claim

What is claimed:

1. A routing structure comprising:
a multilayer substrate including a first region comprising a three dimensional array of spaced apart traces, the spaced apart traces including alternating signal traces and ground traces, wherein the signal traces and ground traces are alternating in a horizontal direction and in a vertical direction, wherein the first region includes an upper layer including a first ground trace, a second ground trace, and a signal trace between the first ground trace and the second ground trace;
the multilayer substrate further including a second region including an upper layer including a plurality of pads comprising a plurality of signal pads and a plurality of ground pads, including a first ground pad; wherein the first ground trace and the second ground trace each extend from the first region to the first ground pad in the second region, and wherein the first ground trace and the second ground trace are each in direct contact with the first ground pad in the second region; and the multilayer substrate further comprising a third region, the first region positioned between the second region and the third region, the third region including an additional plurality of pads, and wherein the signal traces and ground traces from the first region extend into the third region and are coupled to at least some of the additional plurality of pads in the third region.

2. The routing structure of claim 1 , wherein, in the first region, the ground traces have a width that is greater than that of the signal traces.

3. The routing structure of claim 1 , wherein the three dimensional array of spaced apart traces includes four rows of spaced apart traces.

4. The routing structure of claim 1 , further comprising a die electrically coupled to the multilayer substrate in the second region.

5. The routing structure of claim 1 , further comprising a first die electrically coupled to the multilayer substrate in the second region and a second die electrically coupled to the multilayer substrate in the third region.

6. The routing structure of claim 5 , wherein the multilayer substrate includes a first surface and a second surface opposite the first surface, and wherein the first die and the second die are positioned on the first surface.

7. The routing structure of claim 1 , wherein the upper layer includes a plurality of signal pads having no signal trace extending thereto.

8. The routing structure of claim 1 , wherein the first ground trace and the second ground trace each have a width that is greater in the first region than in the second region.

9. A routing structure comprising:
a first region including:
a first layer comprising alternating signal traces and ground traces separated by a dielectric material; and
a second layer comprising alternating signal traces and ground traces separated by a dielectric material; wherein the signal traces in the first layer are positioned over the ground traces in the second layer, and wherein the ground traces in the first layer are positioned over the signal traces in the second layer; and
a second region including a plurality of signal pads and a plurality of ground pads, including a first ground pad and a first signal pad;
wherein the first layer comprising alternating signal traces and ground traces includes a first ground trace, a second ground trace, and a signal trace between the first ground trace and the second ground trace, wherein the first ground trace and the second ground trace from the first layer of the first region each extend to and physically contact the first ground pad in the second region;
a third region including a plurality of additional ground pads and a plurality of additional signal pads, wherein the first region is positioned between the second region and the third region;
a die structure coupled to the second region of the routing structure; and
an additional die structure coupled to the third region of the routing structure.

10. The routing structure of claim 9 , wherein the ground traces include a width that is greater than that of the signal traces.

11. The routing structure of claim 9 , wherein adjacent ground traces and signal traces in the first region are parallel to each other along at least part of their length.

12. The routing structure of claim 9 , further comprising, in the first region:
a third layer comprising alternating signal traces and ground traces separated by a dielectric material, wherein the signal traces in the second layer are positioned over the ground traces in the third layer, and wherein the ground traces in the second layer are positioned over the signal traces in the third layer; and
a fourth layer comprising alternating signal traces and ground traces separated by a dielectric material, wherein the signal traces in the third layer are positioned over the ground traces in the fourth layer, and wherein the ground traces in the third layer are positioned over the signal traces in the fourth layer.

13. The routing structure of claim 12 , further comprising a dielectric material positioned between the first layer and the second layer, between the second layer and the third layer, and between the third layer and the fourth layer.

14. The routing structure of claim 9 , wherein none of the signal traces from the first layer of the first region extend to the first signal pad in the second region.

15. The routing structure of claim 9 , wherein the first ground trace and the second ground trace each have a width that is greater in the first region than in the second region.

16. A routing structure, comprising:
a first region;
a second region; and
a main routing region positioned between the first region and the second region and extending from the first region to the second region, the main routing region comprising:
a first routing layer of traces comprising a plurality of signal traces extending from the first region to the second region and a plurality of ground traces extending from the first region to the second region, the signal traces and the ground traces configured to alternate between a signal trace and a ground trace across the first routing layer;
a second routing layer of traces comprising a plurality of ground traces extending from the first region to the second region and a plurality of signal traces extending from the first region to the second region, the ground traces and the signal traces positioned to alternate between a ground trace and a signal trace across the second routing layer; and
a dielectric material positioned between the signal traces and the ground traces in the first routing layer of traces, and between the signal traces and the ground traces in the second routing layer of traces, the dielectric material also positioned to extend between the first routing layer of traces and the second routing layer of traces;
wherein the signal traces in the first routing layer of traces are positioned over the ground traces in the second routing layer of traces, and wherein the ground traces in the first routing layer of traces are positioned over the signal traces in the second routing layer of traces;

wherein the first region comprises a plurality of ground pads and a plurality of signal pads, including a first ground pad and a first signal pad;
wherein the plurality of ground traces in the first routing layer of traces include a first ground trace and a second ground trace; and
wherein the first ground trace and the second ground trace each extend from the main routing region to the first ground pad in the first region, and wherein the first ground trace

Assignees

• Qian Zhiguo
• Aygun Kemal
• Intel Corp

Inventors

• Qian Zhiguo
• Aygun Kemal

Classifications

• H05K2201/09727

  Varying width along a single conductor; Conductors or pads having different widths · CPC title

• H05K1/0228 Primary

  Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors (balanced signal pairs H05K1/0245) · CPC title

• H05K2201/09709

  Staggered pads, lands or terminals; Parallel conductors in different planes · CPC title

• H05K1/113

  Via provided in pad; Pad over filled via · CPC title

• Y10T29/49155

  Manufacturing circuit on or in base · CPC title